Deml; Gerhard
Patent Applications and Registrations
Patent applications and USPTO patent grants for Deml; Gerhard.The latest application filed is for "method of fabricating a semiconductor device having a resin with warpage compensated structures".
- Deml; Gerhard - Munich DE
- Deml; Gerhard - Erding DE
| Patent | Date |
|---|---|
| Method of fabricating a semiconductor device having a resin with warpage compensated structures Grant 8,377,753 - Heng , et al. February 19, 2 | 2013-02-19 |
| Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures App 20120058606 - Heng; Chai Wei ; et al. | 2012-03-08 |
| Semiconductor device including isolation layer Grant 8,110,906 - Mahler , et al. February 7, 2 | 2012-02-07 |
| Semiconductor devices having a resin with warpage compensated surfaces Grant 8,067,841 - Heng , et al. November 29, 2 | 2011-11-29 |
| Semiconductor module for a switched-mode power supply and method for its assembly Grant 7,923,827 - Heng , et al. April 12, 2 | 2011-04-12 |
| Semiconductor Device App 20090212446 - Heng; Chai Wei ; et al. | 2009-08-27 |
| Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly App 20090001535 - Heng; Yang Hong ; et al. | 2009-01-01 |
| Semiconductor Device Including Isolation Layer App 20080173992 - Mahler; Joachim ; et al. | 2008-07-24 |
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