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Patent applications and USPTO patent grants for DeLucca; John.The latest application filed is for "soldering method and related device for improved resistance to brittle fracture".
Patent | Date |
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Dielectric etching Grant 8,318,606 - Baiocchi , et al. November 27, 2 | 2012-11-27 |
Soldering Method And Related Device For Improved Resistance To Brittle Fracture App 20120280023 - Amin; Ahmed ;   et al. | 2012-11-08 |
Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an Ni layer which has a low concentration of P, wherein the amount of P in the underlying Ni layer is controlled as a function of the expected volume of the Grant 8,242,378 - Amin , et al. August 14, 2 | 2012-08-14 |
Modification Of Semiconductor Optical Paths By Morphological Manipulation App 20120033925 - DeLucca; John ;   et al. | 2012-02-09 |
Dielectric Etching App 20110053378 - Baiocchi; Frank ;   et al. | 2011-03-03 |
Soldering Method and Related Device for Improved Resistance to Brittle Fracture App 20100243300 - Amin; Ahmed ;   et al. | 2010-09-30 |
SEC | 0001263102 | DELUCCA JOHN |
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