Delibac; Daniel A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Delibac; Daniel A..The latest application filed is for "method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness".

Company Profile

0.6.6

Delibac; Daniel A. - Colchester VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness Grant 9,576,863 - Adderly , et al. February 21, 2	2017-02-21
Method Of Fine-tuning Process Controls During Integrated Circuit Chip Manufacturing Based On Substrate Backside Roughness App 20160181166 - Adderly; Shawn A. ; et al.	2016-06-23
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness Grant 9,330,988 - Adderly , et al. May 3, 2	2016-05-03
Semiconductor structures with metal lines Grant 9,087,839 - Adderly , et al. July 21, 2	2015-07-21
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof Grant 9,006,703 - Adderly , et al. April 14, 2	2015-04-14
Method For Reducing Lateral Extrusion Formed In Semiconductor Structures And Semiconductor Structures Formed Thereof App 20150035117 - Adderly; Shawn A. ; et al.	2015-02-05
Semiconductor Structures With Metal Lines App 20140291802 - Adderly; Shawn A. ; et al.	2014-10-02
Electromigration resistant aluminum-based metal interconnect structure Grant 8,084,864 - Chapple-Sokol , et al. December 27, 2	2011-12-27
Electromigration Resistant Aluminum-based Metal Interconnect Structure App 20110221064 - Chapple-Sokol; Jonathan D. ; et al.	2011-09-15
Electromigration resistant aluminum-based metal interconnect structure Grant 8,003,536 - Chapple-Sokol , et al. August 23, 2	2011-08-23
Electromigration Resistant Aluminum-based Metal Interconnect Structure App 20100237503 - Chapple-Sokol; Jonathan D. ; et al.	2010-09-23
Tungsten Liner For Aluminum-based Electromigration Resistant Interconnect Structure App 20090230555 - Chapple-Sokol; Jonathan D. ; et al.	2009-09-17

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