DELHEIMER; CHARLES I.
Patent Applications and Registrations
Patent applications and USPTO patent grants for DELHEIMER; CHARLES I..The latest application filed is for "circuit board assembly with high and low frequency substrates".
- DELHEIMER; CHARLES I. - NOBLESVILLE IN
- Delheimer; Charles I - Noblesville IN
| Patent | Date |
|---|---|
| Circuit Board Assembly With High And Low Frequency Substrates App 20160197400 - ZIMMERMAN; DAVID W. ; et al. | 2016-07-07 |
| Microwave communication package Grant 7,855,685 - Walsh , et al. December 21, 2 | 2010-12-21 |
| Microwave communication package App 20090085808 - Walsh; Matthew R. ; et al. | 2009-04-02 |
| Interconnect for an electrical circuit substrate App 20080218988 - Burns; Jeffrey H. ; et al. | 2008-09-11 |
| Connector applied underfill App 20080176428 - Brandenburg; Scott D. ; et al. | 2008-07-24 |
| Electronic module with form in-place pedestal Grant 7,202,571 - Thompson , et al. April 10, 2 | 2007-04-10 |
| Technique for defining a wettable solder joint area for an electronic assembly substrate App 20060255102 - Snyder; Rick B. ; et al. | 2006-11-16 |
| Electronic module with form in-place pedestal App 20060033195 - Thompson; Brian D. ; et al. | 2006-02-16 |
| Printed circuit board assembly and method App 20050081375 - Kuhlman, Frederick F. ; et al. | 2005-04-21 |
| Method of mounting a leadless package and structure therefor Grant 6,750,084 - Delheimer June 15, 2 | 2004-06-15 |
| Method of mounting a leadless package and structure therefor App 20030234441 - Delheimer, Charles I. | 2003-12-25 |
| Flip chip with backside electrical contact and assembly and method therefor Grant 6,262,489 - Koors , et al. July 17, 2 | 2001-07-17 |
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