| Patent | Date |
|---|
Air gap spacer integration for improved fin device performance
Grant 9,515,156 - Besser , et al. December 6, 2 | 2016-12-06 |
Air Gap Spacer Integration For Improved Fin Device Performance
App 20160111515 - Besser; Paul Raymond ; et al. | 2016-04-21 |
Bi-layer, tri-layer mask CD control
Grant 8,394,722 - Delgadino , et al. March 12, 2 | 2013-03-12 |
Method for low-K dielectric etch with reduced damage
Grant 8,236,188 - Ji , et al. August 7, 2 | 2012-08-07 |
Removal of process residues on the backside of a substrate
Grant 8,083,963 - Delgadino , et al. December 27, 2 | 2011-12-27 |
Methods to avoid unstable plasma states during a process transition
Grant 8,048,806 - Kutney , et al. November 1, 2 | 2011-11-01 |
Methods for etching a dielectric barrier layer with high selectivity
Grant 7,977,245 - Xiao , et al. July 12, 2 | 2011-07-12 |
Organic BARC etch process capable of use in the formation of low K dual damascene integrated circuits
Grant 7,828,987 - Schneider , et al. November 9, 2 | 2010-11-09 |
Method For Low-k Dielectric Etch With Reduced Damage
App 20100261352 - Ji; Bing ; et al. | 2010-10-14 |
Two step etching of a bottom anti-reflective coating layer in dual damascene application
Grant 7,718,543 - Huang , et al. May 18, 2 | 2010-05-18 |
Bi-layer, Tri-layer Mask Cd Control
App 20100108264 - Delgadino; Gerardo A. ; et al. | 2010-05-06 |
Method of forming a low-K dual damascene interconnect structure
Grant 7,435,685 - Delgadino , et al. October 14, 2 | 2008-10-14 |
Plasma dielectric etch process including in-situ backside polymer removal for low-dielectric constant material
Grant 7,432,209 - Delgadino , et al. October 7, 2 | 2008-10-07 |
Removal Of Process Residues On The Backside Of A Substrate
App 20080194111 - Delgadino; Gerardo A. ; et al. | 2008-08-14 |
Method Of Forming A Low-k Dual Damascene Interconnect Structure
App 20080145998 - DELGADINO; GERARDO A. ; et al. | 2008-06-19 |
Two Step Etching Of A Bottom Anti-reflective Coating Layer In Dual Damascene Application
App 20080138997 - Huang; Zhilin ; et al. | 2008-06-12 |
Dielectric Etch Tool Configured For High Density And Low Bombardment Energy Plasma Providing High Etch Rates
App 20080023144 - Delgadino; Gerardo A. ; et al. | 2008-01-31 |
Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
Grant 7,309,448 - Chae , et al. December 18, 2 | 2007-12-18 |
Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
Grant 7,300,597 - Chae , et al. November 27, 2 | 2007-11-27 |
Plasma Dielectric Etch Process Including Ex-situ Backside Polymer Removal For Low-dielectric Constant Material
App 20070238305 - Delgadino; Gerardo A. ; et al. | 2007-10-11 |
Plasma dielectric etch process including ex-situ backside polymer removal for low-dielectric constant material
Grant 7,276,447 - Delgadino , et al. October 2, 2 | 2007-10-02 |
Methods for etching a bottom anti-reflective coating layer in dual damascene application
App 20070224827 - Xiao; Ying ; et al. | 2007-09-27 |
Plasma dielectric etch process including in-situ backside polymer removal for low-dielectric constant material
App 20070224826 - Delgadino; Gerardo A. ; et al. | 2007-09-27 |
Methods for etching a dielectric barrier layer with high selectivity
App 20070224807 - Xiao; Ying ; et al. | 2007-09-27 |
Methods For Etching A Bottom Anti-reflective Coating Layer In Dual Damascene Application
App 20070224825 - Xiao; Ying ; et al. | 2007-09-27 |
Methods For Etching A Dielectric Barrier Layer With High Selectivity
App 20070224803 - Xiao; Ying ; et al. | 2007-09-27 |
Plasma etch and photoresist strip process with intervening chamber de-fluorination and wafer de-fluorination steps
Grant 7,244,313 - Zhou , et al. July 17, 2 | 2007-07-17 |
Methods to avoid unstable plasma states during a process transition
App 20070066064 - Kutney; Michael C. ; et al. | 2007-03-22 |
Method to reduce plasma-induced charging damage
App 20070048882 - Kutney; Michael C. ; et al. | 2007-03-01 |
Method Of Fabricating A Dual Damascene Interconnect Structure
App 20070026665 - Bera; Kallol ; et al. | 2007-02-01 |
Selective Etch Process Of A Sacrificial Light Absorbing Material (slam) Over A Dielectric Material
App 20070020944 - Chae; Hee Yeop ; et al. | 2007-01-25 |
Method of forming a low-K dual damascene interconnect structure
Grant 7,132,369 - Delgadino , et al. November 7, 2 | 2006-11-07 |
Dielectric etch method with high source and low bombardment plasma providing high etch rates
App 20060118519 - Delgadino; Gerardo A. ; et al. | 2006-06-08 |
Carbon-doped-Si oxide etch using H2 additive in fluorocarbon etch chemistry
App 20050266691 - Gu, Binxi ; et al. | 2005-12-01 |
Method for modifying dielectric characteristics of dielectric layers
Grant 6,921,727 - Chiang , et al. July 26, 2 | 2005-07-26 |
Capacitively coupled plasma reactor with uniform radial distribution of plasma
Grant 6,900,596 - Yang , et al. May 31, 2 | 2005-05-31 |
Method of fabricating a dual damascene interconnect structure
App 20050059234 - Bera, Kallol ; et al. | 2005-03-17 |
Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
App 20050029229 - Chae, Hee Yeop ; et al. | 2005-02-10 |
Method for modifying dielectric characteristics of dielectric layers
App 20040180556 - Chiang, Kang-Lie ; et al. | 2004-09-16 |
Method of forming a low-K dual damascene interconnect structure
App 20040157453 - Delgadino, Gerardo A. ; et al. | 2004-08-12 |
Capacitively coupled plasma reactor with uniform radial distribution of plasma
App 20040056602 - Yang, Jang Gyoo ; et al. | 2004-03-25 |
Top gas feed lid for semiconductor processing chamber
App 20030037879 - Askarinam, Farahmand E. ; et al. | 2003-02-27 |
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