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Patent applications and USPTO patent grants for Deley; Michael T..The latest application filed is for "methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same".
Patent | Date |
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Methods Of Teaching Bonding Locations And Inspecting Wire Loops On A Wire Bonding Machine, And Apparatuses For Performing The Same App 20120024089 - Couey; Jeremiah ;   et al. | 2012-02-02 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations Grant 8,100,317 - Deley , et al. January 24, 2 | 2012-01-24 |
Method Of Teaching Eyepoints For Wire Bonding And Related Semiconductor Processing Operations App 20110174865 - Deley; Michael T. ;   et al. | 2011-07-21 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations Grant 7,931,186 - Deley , et al. April 26, 2 | 2011-04-26 |
Method Of Teaching Eyepoints For Wire Bonding And Related Semiconductor Processing Operations App 20100181365 - Deley; Michael T. ;   et al. | 2010-07-22 |
Apparatus and method for determining the position of a component prior to placement Grant 5,559,727 - Deley , et al. September 24, 1 | 1996-09-24 |
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