Delehanty; Donald J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Delehanty; Donald J..The latest application filed is for "planarization system and method using a carbonate containing fluid".

Company Profile

0.5.4

Delehanty; Donald J. - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Planarization system and method using a carbonate containing fluid Grant 7,214,623 - Delehanty , et al. May 8, 2	2007-05-08
Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers Grant 7,040,966 - Salfelder , et al. May 9, 2	2006-05-09
Planarization System And Method Using A Carbonate Containing Fluid App 20050079709 - Delehanty, Donald J. ; et al.	2005-04-14
Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers App 20050042877 - Salfelder, Joseph F. ; et al.	2005-02-24
Wafer edge cleaning utilizing polish pad material Grant 6,837,777 - Ziemins , et al. January 4, 2	2005-01-04
Wafer edge cleaning utilizing polish pad material App 20040000326 - Ziemins, Uldis A. ; et al.	2004-01-01
Wafer edge cleaning utilizing polish pad material Grant 6,622,334 - Ziemins , et al. September 23, 2	2003-09-23
Process for removing chemical mechanical polishing residual slurry Grant 6,425,956 - Cotte , et al. July 30, 2	2002-07-30
Process For Removing Chemical Mechanical Polishing Residual Slurry App 20020088477 - Cotte, John Michael ; et al.	2002-07-11

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