loadpatents
name:-0.0089318752288818
name:-0.0072062015533447
name:-0.00042390823364258
Delaney; Laurence D. Patent Filings

Delaney; Laurence D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Delaney; Laurence D..The latest application filed is for "silicon parts joined by a silicon layer preferably plasma sprayed".

Company Profile
0.6.6
  • Delaney; Laurence D. - Whitefish MT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silicon parts joined by a silicon layer preferably plasma sprayed
Grant 7,736,747 - Boyle , et al. June 15, 2
2010-06-15
Silicon parts joined by a silicon layer preferably plasma sprayed
App 20060216908 - Boyle; James E. ;   et al.
2006-09-28
Plasma spraying for joining silicon parts
Grant 7,074,693 - Boyle , et al. July 11, 2
2006-07-11
Silicon fixture supporting silicon wafers during high temperature processing
Grant 6,979,659 - Zehavi , et al. December 27, 2
2005-12-27
Plasma spraying for joining silicon parts
App 20040266158 - Boyle, James E. ;   et al.
2004-12-30
Silicon fixture supporting silicon wafers during high temperature processing
App 20040197974 - Zehavi, Raanan Y. ;   et al.
2004-10-07
High temperature hydrogen anneal of silicon wafers supported on a silicon fixture
Grant 6,727,191 - Zehavi , et al. April 27, 2
2004-04-27
Silicon wafer tower with inclined support teeth
App 20040040885 - Boyle, James E. ;   et al.
2004-03-04
Method of machining silicon
Grant 6,617,225 - Boyle , et al. September 9, 2
2003-09-09
Method of machining silicon
App 20030003686 - Boyle, James E. ;   et al.
2003-01-02
Method of fabricating silicon structures including fixtures for supporting wafers
Grant 6,455,395 - Boyle , et al. September 24, 2
2002-09-24
High temperature hydrogen anneal of silicon wafers supported on a silicon fixture
App 20020119641 - Zehavi, Raanan Y. ;   et al.
2002-08-29

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