Dejima; Hirohisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dejima; Hirohisa.The latest application filed is for "backlight unit and liquid crystal display device".

Company Profile

1.3.11

Dejima; Hirohisa - Tokyo JP
Dejima; Hirohisa - Shinagawa-ku JP
Dejima; Hirohisa - Shizuoka JP
Dejima; Hirohisa - Utsunomiya JP
Dejima; Hirohisa - Tochigi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Backlight unit and liquid crystal display device Grant 10,718,892 - Namikawa , et al.	2020-07-21
Backlight Unit And Liquid Crystal Display Device App 20200124784 - NAMIKAWA; Yoshitada ; et al.	2020-04-23
Buffer sheet and flat panel display Grant 10,613,368 - Okabe , et al.	2020-04-07
Buffer Sheet And Flat Panel Display App 20190049790 - OKABE; Motohiko ; et al.	2019-02-14
Resin Composition, Semiconductor Wafer Bonding Product And Semiconductor Device App 20120196075 - Takahashi; Toyosei ; et al.	2012-08-02
Method Of Manufacturing Semiconductor Wafer Bonding Product, Semiconductor Wafer Bonding Product And Semiconductor Device App 20120187553 - Yoneyama; Masahiro ; et al.	2012-07-26
Spacer Formation Film, Method Of Manufacturing Semiconductor Wafer Bonding Product, Semiconductor Wafer Bonding Product And Semiconductor Device App 20120168970 - Sato; Toshihiro ; et al.	2012-07-05
Film For Resin Spacer, Light-receiving Device And Method For Manufacturing Same, And Mems Device And Method For Manufacturing Same App 20120032284 - Dejima; Hirohisa ; et al.	2012-02-09
Method Of Manufacturing Semiconductor Wafer Bonding Product, Semiconductor Wafer Bonding Product And Semiconductor Device App 20120012989 - Sato; Toshihiro ; et al.	2012-01-19
Spacer Formation Film, Semiconductor Wafer And Semiconductor Device App 20110316127 - Shiraishi; Fumihiro ; et al.	2011-12-29
Photosensitive Resin Composition, Adhesive Film And Light-receiving Device App 20110316116 - Sato; Toshihiro ; et al.	2011-12-29
Semiconductor Wafer Bonding Product, Method Of Manufacturing Semiconductor Wafer Bonding Product And Semiconductor Device App 20110304034 - Dejima; Hirohisa ; et al.	2011-12-15
Resin composition, filling material, insulating layer and semiconductor device Grant 7,999,354 - Takahashi , et al. August 16, 2	2011-08-16
Resin Composition, Filling Material, Insulating Layer And Semiconductor Device App 20100181684 - Takahashi; Toyosei ; et al.	2010-07-22

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