Deguchi; Hidenobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Deguchi; Hidenobu.The latest application filed is for "epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer lalminate".

Company Profile

0.5.7

Deguchi; Hidenobu - Tsukuba JP
DEGUCHI; Hidenobu - Ibaraki JP
Deguchi; Hidenobu - Tsukuba-shi JP
Deguchi; Hidenobu - Takatsuki JP
Deguchi; Hidenobu - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Preliminary-cured material, roughened preliminary-cured material, and laminated body Grant 9,120,293 - Yokota , et al. September 1, 2	2015-09-01
Epoxy Resin Composition, Prepreg, Cured Body, Sheet-like Molded Body, Laminate And Multilayer Lalminate App 20130288041 - GOTO; Nobuhiro ; et al.	2013-10-31
Preliminary-cured Material, Roughened Preliminary-cured Material, And Laminated Body App 20130108861 - Yokota; Reona ; et al.	2013-05-02
Epoxy Resin Composition, Prepreg, Cured Body, Sheet-like Molded Body, Laminate And Multilayer Laminate App 20110189432 - Goto; Nobuhiro ; et al.	2011-08-04
Resin composition Grant 7,754,803 - Fujiwara , et al. July 13, 2	2010-07-13
Thermosetting resin composition, resin sheet and resin sheet for insulated substrate Grant 7,709,085 - Shibayama , et al. May 4, 2	2010-05-04
Resin composition of layered silicate Grant 7,682,691 - Akaho , et al. March 23, 2	2010-03-23
Thermosetting Resin Composition, Resin Sheet and Resin Sheet for Insulated Substrate App 20080233386 - Shibayama; Koichi ; et al.	2008-09-25
Resin composition App 20050165151 - Fujiwara, Akihiko ; et al.	2005-07-28
Resin composition App 20050107497 - Akaho, Kazunori ; et al.	2005-05-19

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