Degenkolb; Thomas A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Degenkolb; Thomas A..The latest application filed is for "vehicle optical sensor system".
Company Profile
0.22.21
- Degenkolb; Thomas A. - Noblesville IN
Patent Activity
| Patent | Date |
|---|---|
| Multiple imager camera Grant 9,621,874 - Loong , et al. April 11, 2 | 2017-04-11 |
| Vehicle optical sensor system Grant 9,506,803 - Low , et al. November 29, 2 | 2016-11-29 |
| Vehicle Optical Sensor System App 20160076934 - LOW; YEW KWANG ; et al. | 2016-03-17 |
| Multiple Imager Camera App 20160065940 - LOONG; DANIEL LEONG WOON ; et al. | 2016-03-03 |
| Fluid cooled encapsulated microelectronic package Grant 8,471,380 - Brandenburg , et al. June 25, 2 | 2013-06-25 |
| Fluid Cooled Encapsulated Microelectronic Package App 20120001319 - BRANDENBURG; SCOTT D. ; et al. | 2012-01-05 |
| Fluid cooled encapsulated microelectronic package Grant 8,026,597 - Brandenburg , et al. September 27, 2 | 2011-09-27 |
| Leaded semiconductor power module with direct bonding and double sided cooling Grant 7,759,778 - Lowry , et al. July 20, 2 | 2010-07-20 |
| Leaded semiconductor power module with direct bonding and double sided cooling App 20100065950 - Lowry; Michael J. ; et al. | 2010-03-18 |
| Solderless electrical interconnection for electronic package Grant 7,621,757 - Brandenburg , et al. November 24, 2 | 2009-11-24 |
| Wrap-around overmold for electronic assembly Grant 7,616,448 - Degenkolb , et al. November 10, 2 | 2009-11-10 |
| Electrical pin interconnection for electronic package Grant 7,537,464 - Brandenburg , et al. May 26, 2 | 2009-05-26 |
| Fluid cooled encapsulated microelectronic package App 20090108439 - Brandenburg; Scott D. ; et al. | 2009-04-30 |
| Wrap-around overmold for electronic assembly App 20090073663 - Degenkolb; Thomas A. ; et al. | 2009-03-19 |
| Fluid cooled encapsulated microelectronic package Grant 7,485,957 - Brandenburg , et al. February 3, 2 | 2009-02-03 |
| Compression connection for vertical IC packages Grant 7,447,041 - Brandenburg , et al. November 4, 2 | 2008-11-04 |
| Surface mount connector Grant 7,422,448 - Brandenburg , et al. September 9, 2 | 2008-09-09 |
| Compression connection for vertical IC packages App 20080212296 - Brandenburg; Scott D. ; et al. | 2008-09-04 |
| Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels Grant 7,364,684 - Brandenburg , et al. April 29, 2 | 2008-04-29 |
| Electronics assembly and electronics package carrier therefor Grant 7,324,342 - Taylor , et al. January 29, 2 | 2008-01-29 |
| Electrical pin interconnection for electronic package App 20070295450 - Brandenburg; Scott D. ; et al. | 2007-12-27 |
| Solderless electrical interconnection for electronic package App 20070295452 - Brandenburg; Scott D. ; et al. | 2007-12-27 |
| Technique for manufacturing an overmolded electronic assembly Grant 7,268,429 - Brandenburg , et al. September 11, 2 | 2007-09-11 |
| Printed circuit board assembly with integrated connector Grant 7,227,758 - Brandenburg , et al. June 5, 2 | 2007-06-05 |
| Fluid cooled encapsulated microelectronic package App 20070114656 - Brandenburg; Scott D. ; et al. | 2007-05-24 |
| Electronics assembly and electronics package carrier therefor App 20070086163 - Taylor; Ralph S. ; et al. | 2007-04-19 |
| Fluid cooled encapsulated microelectronic package Grant 7,205,653 - Brandenburg , et al. April 17, 2 | 2007-04-17 |
| Surface mount connector App 20070026700 - Brandenburg; Scott D. ; et al. | 2007-02-01 |
| Electronic assembly with backplate having at least one thermal insert App 20070004090 - Brandenburg; Scott D. ; et al. | 2007-01-04 |
| Technique for manufacturing an overmolded electronic assembly App 20060292751 - Brandenburg; Scott D. ; et al. | 2006-12-28 |
| Power electronic system with passive cooling Grant 7,106,588 - Oberlin , et al. September 12, 2 | 2006-09-12 |
| Multi-substrate circuit assembly Grant 7,064,963 - Oman , et al. June 20, 2 | 2006-06-20 |
| Fluid cooled encapsulated microelectronic package App 20060038284 - Brandenburg; Scott D. ; et al. | 2006-02-23 |
| Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels App 20060033236 - Brandenburg; Scott D. ; et al. | 2006-02-16 |
| Surface mount axial leaded component for an electronic module App 20060021792 - Myers; Bruce A. ; et al. | 2006-02-02 |
| Multi-substrate Circuit Assembly App 20050218505 - Oman, Todd P. ; et al. | 2005-10-06 |
| Technique for connector to printed circuit board decoupling to eliminate flexure Grant 6,905,349 - Brandenburg , et al. June 14, 2 | 2005-06-14 |
| Power electronic system with passive cooling App 20050088822 - Oberlin, Gary E. ; et al. | 2005-04-28 |
| Printed circuit board assembly with integrated connector App 20050018410 - Brandenburg, Scott D. ; et al. | 2005-01-27 |
| Overmolded electronic package including circuit-carrying substrate Grant 6,779,260 - Brandenburg , et al. August 24, 2 | 2004-08-24 |
| Filtered electrical connector assembly for an overmolded electronic package App 20040132322 - Brandenburg, Scott D. ; et al. | 2004-07-08 |
| Corrosive resistant flip chip thermal management structure Grant 6,560,110 - Myers , et al. May 6, 2 | 2003-05-06 |
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