DEGANI; Yinon
Patent Applications and Registrations
Patent applications and USPTO patent grants for DEGANI; Yinon.The latest application filed is for "incoming threat protection system and method of using same".
Company Profile
1.43.24
- DEGANI; Yinon - Ramat Hasharon IL
- Degani; Yinon - Highland Park NJ
- Degani, Yinon - High Park NJ
Patent Activity
| Patent | Date |
|---|---|
| Incoming Threat Protection System And Method Of Using Same App 20220097843 - DEGANI; Yinon ; et al. | 2022-03-31 |
| RF devices Grant 8,102,021 - Degani January 24, 2 | 2012-01-24 |
| Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor Grant 8,018,027 - Bizen , et al. September 13, 2 | 2011-09-13 |
| Method For Fabricating A Flip-bonded Dual-substrate Inductor, Flip-bonded Dual-substrate Inductor, And Integrated Passive Device Including A Flip-bonded Dual-substrate Inductor App 20110101497 - BIZEN; Tatsuo ; et al. | 2011-05-05 |
| Integrated passive device substrates Grant 7,936,043 - Degani , et al. May 3, 2 | 2011-05-03 |
| Shielding noisy conductors in integrated passive devices Grant 7,795,709 - Degani , et al. September 14, 2 | 2010-09-14 |
| Compact balun transformers Grant 7,692,511 - Degani , et al. April 6, 2 | 2010-04-06 |
| RF devices App 20090278690 - Degani; Yinon | 2009-11-12 |
| Compact balun transformers App 20090237175 - Degani; Yinon ; et al. | 2009-09-24 |
| Integrated passive devices App 20090218655 - Degani; Yinon ; et al. | 2009-09-03 |
| MCM packages App 20090184416 - Degani; Yinon ; et al. | 2009-07-23 |
| Integrated passive devices Grant 7,382,056 - Chiu , et al. June 3, 2 | 2008-06-03 |
| Integrated passive devices with high Q inductors Grant 7,355,264 - Degani , et al. April 8, 2 | 2008-04-08 |
| Shielding noisy conductors in integrated passive devices App 20080061405 - Degani; Yinon ; et al. | 2008-03-13 |
| Integrated Passive Devices With High Q Inductors App 20080061420 - Degani; Yinon ; et al. | 2008-03-13 |
| Integrated passive devices App 20070262418 - Degani; Yinon ; et al. | 2007-11-15 |
| Integrated passive device substrates App 20070215976 - Degani; Yinon ; et al. | 2007-09-20 |
| Integrated passive devices Grant 7,259,077 - Degani , et al. August 21, 2 | 2007-08-21 |
| Integrated passive devices App 20070065964 - Degani; Yinon | 2007-03-22 |
| SDIO memory and interface card Grant 7,170,754 - Asom , et al. January 30, 2 | 2007-01-30 |
| Shielding noisy conductors in integrated passive devices App 20060255434 - Degani; Yinon ; et al. | 2006-11-16 |
| Cellular/Wi-Fi combination devices App 20060217102 - Degani; Yinon ; et al. | 2006-09-28 |
| High frequency integrated circuits App 20060197182 - Degani; Yinon ; et al. | 2006-09-07 |
| Testing integrated circuits Grant 7,061,258 - Degani , et al. June 13, 2 | 2006-06-13 |
| High density flip chip interconnections App 20050277226 - Degani, Yinon ; et al. | 2005-12-15 |
| Integrated passive devices App 20050253255 - Degani, Yinon ; et al. | 2005-11-17 |
| Integrated passive devices App 20050253257 - Chiu, Anthony M. ; et al. | 2005-11-17 |
| SDIO memory and interface card App 20050248926 - Asom, Moses ; et al. | 2005-11-10 |
| Testing integrated circuits App 20050088194 - Degani, Yinon ; et al. | 2005-04-28 |
| Membrane test method and apparatus for integrated circuit testing Grant 6,867,607 - Degani , et al. March 15, 2 | 2005-03-15 |
| Stacked module package Grant 6,734,539 - Degani , et al. May 11, 2 | 2004-05-11 |
| High frequency integrated circuits App 20040075170 - Degani, Yinon ; et al. | 2004-04-22 |
| Method of testing and constructing monolithic multi-chip modules Grant 6,680,212 - Degani , et al. January 20, 2 | 2004-01-20 |
| High performance multi-chip IC package Grant 6,678,167 - Degani , et al. January 13, 2 | 2004-01-13 |
| Testing integrated circuits App 20030137315 - Degani, Yinon ; et al. | 2003-07-24 |
| Flip chip metallization Grant 6,597,069 - Degani , et al. July 22, 2 | 2003-07-22 |
| Multi-chip ball grid array IC packages Grant 6,437,990 - Degani , et al. August 20, 2 | 2002-08-20 |
| Packaging micromechanical devices Grant 6,433,411 - Degani , et al. August 13, 2 | 2002-08-13 |
| Method of testing and constructing monolithic multi-chip modules App 20020081755 - Degani, Yinon ; et al. | 2002-06-27 |
| Stacked module package App 20020079568 - Degani, Yinon ; et al. | 2002-06-27 |
| Testing integrated circuits App 20020075031 - Degani, Yinon | 2002-06-20 |
| Interconnecting micromechanical devices Grant 6,396,711 - Degani , et al. May 28, 2 | 2002-05-28 |
| Packaging silicon on silicon multichip modules Grant 6,369,444 - Degani , et al. April 9, 2 | 2002-04-09 |
| Low cost ball grid array package Grant 6,282,100 - Degani , et al. August 28, 2 | 2001-08-28 |
| Low profile integrated circuit packages Grant 6,251,705 - Degani , et al. June 26, 2 | 2001-06-26 |
| Flip chip bump bonding Grant 6,232,212 - Degani , et al. May 15, 2 | 2001-05-15 |
| Interposer for recessed flip-chip package Grant 6,175,158 - Degani , et al. January 16, 2 | 2001-01-16 |
| Recessed flip-chip package Grant 6,154,370 - Degani , et al. November 28, 2 | 2000-11-28 |
| Flip chip metallization Grant 6,130,141 - Degani , et al. October 10, 2 | 2000-10-10 |
| Solder bonding printed circuit boards Grant 6,100,475 - Degani , et al. August 8, 2 | 2000-08-08 |
| Integrated circuit bonding method and apparatus Grant 6,074,897 - Degani , et al. June 13, 2 | 2000-06-13 |
| Solder bonding printed circuit boards Grant 6,013,877 - Degani , et al. January 11, 2 | 2000-01-11 |
| RF IC package Grant 5,869,894 - Degani , et al. February 9, 1 | 1999-02-09 |
| Thin packaging of multi-chip modules with enhanced thermal/power management Grant 5,646,828 - Degani , et al. July 8, 1 | 1997-07-08 |
| Packaging multi-chip modules without wire-bond interconnection Grant 5,608,262 - Degani , et al. March 4, 1 | 1997-03-04 |
| Method and apparatus for assembling multichip modules Grant 5,564,617 - Degani , et al. October 15, 1 | 1996-10-15 |
| Process for fabircating an integrated circuit Grant 5,516,728 - Degani , et al. May 14, 1 | 1996-05-14 |
| Electronic device package having electronic device boonded, at a localized region thereof, to circuit board Grant 5,473,512 - Degani , et al. December 5, 1 | 1995-12-05 |
| Soldering material and procedure Grant 5,385,290 - Degani January 31, 1 | 1995-01-31 |
| Solder paste mixture Grant 5,382,300 - Blonder , et al. January 17, 1 | 1995-01-17 |
| Surface mount solder assembly of leadless integrated circuit packages to substrates Grant 5,346,118 - Degani , et al. September 13, 1 | 1994-09-13 |
| Solder paste and method of using the same Grant 5,211,764 - Degani May 18, 1 | 1993-05-18 |
| Solder paste Grant 5,150,832 - Degani , et al. September 29, 1 | 1992-09-29 |
| Article for connecting optical fibers Grant 5,091,988 - Degani , et al. February 25, 1 | 1992-02-25 |
| Process for improving photostability of titanium dioxide pigments in binder compositions without decreasing reflectivity Grant 5,037,476 - Degani , et al. August 6, 1 | 1991-08-06 |
| Optical fiber connector Grant 4,973,126 - Degani , et al. November 27, 1 | 1990-11-27 |
| Movable fiber optical switch Grant 4,946,236 - Dautartas , et al. August 7, 1 | 1990-08-07 |
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