Decrosta; David A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Decrosta; David A..The latest application filed is for "active area bonding compatible high current structures".
- Decrosta; David A. - Melbourne FL
- Decrosta; David A - Melbourne FL
| Patent | Date |
|---|---|
| Active area bonding compatible high current structures Grant 8,946,912 - Gasner , et al. February 3, 2 | 2015-02-03 |
| Active Area Bonding Compatible High Current Structures App 20140113444 - Gasner; John T. ; et al. | 2014-04-24 |
| Active area bonding compatible high current structures Grant 8,652,960 - Gasner , et al. February 18, 2 | 2014-02-18 |
| Active area bonding compatible high current structures Grant 8,569,896 - Gasner , et al. October 29, 2 | 2013-10-29 |
| Active Area Bonding Compatible High Current Structures App 20130130445 - Gasner; John T. ; et al. | 2013-05-23 |
| Active Area Bonding Compatible High Current Structures App 20120261836 - Gasner; John T. ; et al. | 2012-10-18 |
| Active area bonding compatible high current structures Grant 8,274,160 - Gasner , et al. September 25, 2 | 2012-09-25 |
| Active Area Bonding Compatible High Current Structures App 20100261344 - Gasner; John T. ; et al. | 2010-10-14 |
| Active area bonding compatible high current structures Grant 7,795,130 - Gasner , et al. September 14, 2 | 2010-09-14 |
| Active Area Bonding Compatible High Current Structures App 20070187837 - Gasner; John T. ; et al. | 2007-08-16 |
| Active Area Bonding Compatible High Current Structures App 20070184645 - Gasner; John T. ; et al. | 2007-08-09 |
| Active area bonding compatible high current structures Grant 7,224,074 - Gasner , et al. May 29, 2 | 2007-05-29 |
| Enhanced plasma etch process Grant 7,181,306 - DeCrosta February 20, 2 | 2007-02-20 |
| Active area bonding compatible high current structures App 20060099823 - Gasner; John T. ; et al. | 2006-05-11 |
| Active area bonding compatible high current structures Grant 7,005,369 - Gasner , et al. February 28, 2 | 2006-02-28 |
| Enhanced plasma etch process App 20050236108 - DeCrosta, David A. | 2005-10-27 |
| Active area bonding compatible high current structures App 20050042853 - Gasner, John T. ; et al. | 2005-02-24 |
| Radiation hardened dielectric for EEPROM Grant 6,130,172 - Fuller , et al. October 10, 2 | 2000-10-10 |
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