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Double sided container process used during the manufacture of a semiconductor device Grant 7,345,333 - DeBoer , et al. March 18, 2 | 2008-03-18 |
Method and structure for reducing contact aspect ratios Grant 7,268,072 - Deboer , et al. September 11, 2 | 2007-09-11 |
Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby App 20070148990 - DeBoer; Scott J. ;   et al. | 2007-06-28 |
Methods for forming a high dielectric film Grant 7,192,889 - DeBoer , et al. March 20, 2 | 2007-03-20 |
Method of fabricating a semiconductor device with a wet oxidation with steam process Grant 7,176,079 - Weimer , et al. February 13, 2 | 2007-02-13 |
Capacitors, methods of forming capacitors, and methods of forming capacitor dielectric layers Grant 7,153,746 - Moore , et al. December 26, 2 | 2006-12-26 |
Double sided container process used during the manufacture of a semiconductor device App 20060267062 - DeBoer; Scott J. ;   et al. | 2006-11-30 |
A Capacitor Electrode Having An Interface Layer Of Different Chemical Composition Formed On A Bulk Layer App 20060246658 - DeBoer; Scott J. ;   et al. | 2006-11-02 |
Capacitor electrode having an interface layer of different chemical composition formed on a bulk layer Grant 7,092,233 - DeBoer , et al. August 15, 2 | 2006-08-15 |
Double sided container process used during the manufacture of a semiconductor device Grant 7,084,448 - DeBoer , et al. August 1, 2 | 2006-08-01 |
Method of processing a transistor gate dielectric film with stem Grant 7,064,052 - Weimer , et al. June 20, 2 | 2006-06-20 |
Method of fabricating a semiconductor device with a dielectric film using a wet oxidation with steam process Grant 7,022,623 - Weimer , et al. April 4, 2 | 2006-04-04 |
Raised-lines overlay semiconductor targets and method of making the same App 20060017074 - Baluswamy; Pary ;   et al. | 2006-01-26 |
Capacitor electrode having an interface layer of different chemical composition formed on a bulk layer App 20060007631 - DeBoer; Scott J. ;   et al. | 2006-01-12 |
Method of forming a capacitor electrode having an interface layer of different chemical composition from a bulk layer Grant 6,964,909 - DeBoer , et al. November 15, 2 | 2005-11-15 |
Method of fabricating a capacitive element for a semiconductor device Grant 6,949,477 - Weimer , et al. September 27, 2 | 2005-09-27 |
Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby Grant 6,927,179 - DeBoer , et al. August 9, 2 | 2005-08-09 |
Capacitors, methods of forming capacitors, and methods of forming capacitor dielectric layers App 20050167727 - Moore, John T. ;   et al. | 2005-08-04 |
Method and structure for reducing contact aspect ratios App 20050164481 - Deboer, Scott J. ;   et al. | 2005-07-28 |
Residue free overlay target Grant 6,914,017 - Baluswamy , et al. July 5, 2 | 2005-07-05 |
Capacitors Grant 6,891,215 - Moore , et al. May 10, 2 | 2005-05-10 |
Method and structure for reducing contact aspect ratios Grant 6,878,587 - Deboer , et al. April 12, 2 | 2005-04-12 |
Methods of forming capacitors Grant 6,878,585 - Moore , et al. April 12, 2 | 2005-04-12 |
Method of forming a capacitor dielectric layer Grant 6,875,707 - Moore , et al. April 5, 2 | 2005-04-05 |
Raised-lines overlay semiconductor targets and method of making the same App 20050070069 - Baluswamy, Pary ;   et al. | 2005-03-31 |
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers Grant 6,872,639 - DeBoer , et al. March 29, 2 | 2005-03-29 |
Fabrication of DRAM and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process App 20050048793 - Weimer, Ronald A. ;   et al. | 2005-03-03 |
Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby App 20050009361 - DeBoer, Scott J. ;   et al. | 2005-01-13 |
Capacitor electrode having an interface layer of different chemical composition formed on a bulk layer Grant 6,825,522 - DeBoer , et al. November 30, 2 | 2004-11-30 |
Raised-lines overlay semiconductor targets and method of making the same Grant 6,822,342 - Baluswamy , et al. November 23, 2 | 2004-11-23 |
Double sided container process used during the manufacture of a semiconductor device App 20040164335 - DeBoer, Scott J. ;   et al. | 2004-08-26 |
Capacitor structures with recessed hemispherical grain silicon App 20040155274 - DeBoer, Scott J. ;   et al. | 2004-08-12 |
Method and structure for reducing contact aspect ratios App 20040106276 - Deboer, Scott J. ;   et al. | 2004-06-03 |
DRAM capacitor formulation using a double-sided electrode Grant 6,737,696 - DeBoer , et al. May 18, 2 | 2004-05-18 |
Structure for reducing contact aspect ratios Grant 6,720,609 - Deboer , et al. April 13, 2 | 2004-04-13 |
Double sided container process used during the manufacture of a semiconductor device Grant 6,696,336 - DeBoer , et al. February 24, 2 | 2004-02-24 |
Capacitor structures with recessed hemispherical grain silicon Grant 6,693,320 - DeBoer , et al. February 17, 2 | 2004-02-17 |
Structure for reducing contact aspect ratios Grant 6,677,636 - Deboer , et al. January 13, 2 | 2004-01-13 |
Method and structure for reducing contact aspect ratios Grant 6,670,238 - Deboer , et al. December 30, 2 | 2003-12-30 |
Capacitors App 20030209778 - Moore, John T. ;   et al. | 2003-11-13 |
Method of forming a capacitor dielectric layer App 20030207592 - Moore, John T. ;   et al. | 2003-11-06 |
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers App 20030203608 - DeBoer, Scott J. ;   et al. | 2003-10-30 |
DRAM capacitor formulation using a double-sided electrode Grant 6,635,547 - DeBoer , et al. October 21, 2 | 2003-10-21 |
Capacitor structures with recessed hemispherical grain silicon Grant 6,632,719 - DeBoer , et al. October 14, 2 | 2003-10-14 |
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers Grant 6,614,082 - DeBoer , et al. September 2, 2 | 2003-09-02 |
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers Grant 6,613,654 - DeBoer , et al. September 2, 2 | 2003-09-02 |
Structural integrity enhancement of dielectric films Grant 6,607,953 - DeBoer August 19, 2 | 2003-08-19 |
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride Grant 6,548,405 - Kraus , et al. April 15, 2 | 2003-04-15 |
Capacitors, methods of forming capacitors, and methods of forming capacitor dielectric layers App 20030045050 - Moore, John T. ;   et al. | 2003-03-06 |
Structure for reducing contact aspect ratios App 20030015750 - Deboer, Scott J. ;   et al. | 2003-01-23 |
Method and structure for reducing contact aspect ratios App 20020195639 - Deboer, Scott J. ;   et al. | 2002-12-26 |
Structural integrity enhancement of dielectric films App 20020197816 - DeBoer, Scott J. | 2002-12-26 |
Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby App 20020187654 - DeBoer, Scott J. ;   et al. | 2002-12-12 |
Fabrication of dram and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process App 20020151107 - Weimer, Ronald A. ;   et al. | 2002-10-17 |
Methods for forming a dielectric film Grant 6,461,982 - DeBoer , et al. October 8, 2 | 2002-10-08 |
DRAM capacitor formulation using a double-sided electrode Grant 6,451,661 - DeBoer , et al. September 17, 2 | 2002-09-17 |
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride App 20020106896 - Kraus, Brenda D. ;   et al. | 2002-08-08 |
Boride electrodes and barriers for cell dielectrics App 20020079531 - Al-Shareef, Husam N. ;   et al. | 2002-06-27 |
Method and structure for reducing contact aspect ratios App 20020064934 - Deboer, Scott J. ;   et al. | 2002-05-30 |
Fabrication of DRAM and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process App 20020045358 - Weimer, Ronald A. ;   et al. | 2002-04-18 |
Method and structure for reducing contact aspect ratios Grant 6,365,453 - Deboer , et al. April 2, 2 | 2002-04-02 |
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride Grant 6,365,519 - Kraus , et al. April 2, 2 | 2002-04-02 |
Residue-free overlay target App 20020036332 - Baluswamy, Pary ;   et al. | 2002-03-28 |
Methods Of Forming Recessed Hemispherical Grain Silicon Capacitor Structures App 20020028563 - DeBoer, Scott J. | 2002-03-07 |
Methods of forming capacitors and related integrated circuitry App 20020022320 - DeBoer, Scott J. ;   et al. | 2002-02-21 |
Structural integrity enhancement of dielectric films Grant 6,340,613 - DeBoer January 22, 2 | 2002-01-22 |
DRAM capacitor formulation using a double-sided electrode App 20010053576 - DeBoer, Scott J. ;   et al. | 2001-12-20 |
Fabrication Of Dram And Other Semiconductor Devices With An Insulating Film Using A Wet Rapid Thermal Oxidation Process App 20010051406 - WEIMER, RONALD A. ;   et al. | 2001-12-13 |
Apparatus for forming a high dielectric film Grant 6,325,017 - DeBoer , et al. December 4, 2 | 2001-12-04 |
Method and structure for reducing contact aspect ratios App 20010045658 - Deboer, Scott J. ;   et al. | 2001-11-29 |
Structural integrity enhancement of dielectric films App 20010041457 - DeBoer, Scott J. | 2001-11-15 |
Oxide etching method and structures resulting from same App 20010038111 - DeBoer, Scott J. ;   et al. | 2001-11-08 |
Methods And Apparatus For Forming A High Dielectric Film And The Dielectric Film Formed Thereby App 20010036752 - DEBOER, SCOTT J. ;   et al. | 2001-11-01 |
Semiconductor processing methods of forming photoresist over silicon nitride materials, and semiconductor wafer assemblies comprising photoresist over silicon nitride materials Grant 6,300,253 - Moore , et al. October 9, 2 | 2001-10-09 |
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride App 20010014521 - Kraus, Brenda D. ;   et al. | 2001-08-16 |
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride Grant 6,218,293 - Kraus , et al. April 17, 2 | 2001-04-17 |
DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films Grant 6,150,208 - Deboer , et al. November 21, 2 | 2000-11-21 |
Boride electrodes and barriers for cell dielectrics Grant 6,111,285 - Al-Shareef , et al. August 29, 2 | 2000-08-29 |
Conditioning of dielectric materials Grant 6,090,723 - Thakur , et al. July 18, 2 | 2000-07-18 |
Method of forming capacitors and related integrated circuitry Grant 6,046,093 - DeBoer , et al. April 4, 2 | 2000-04-04 |
Semiconductor wafer assemblies comprising silicon nitride, methods of forming silicon nitride, and methods of reducing stress on semiconductive wafers Grant 5,985,771 - Moore , et al. November 16, 1 | 1999-11-16 |
Method of fabricating a semiconductor device utilizing polysilicon grains Grant 5,960,294 - Zahurak , et al. September 28, 1 | 1999-09-28 |