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name:-0.054604053497314
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DeBoer; Scott J. Patent Filings

DeBoer; Scott J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for DeBoer; Scott J..The latest application filed is for "methods and apparatus for forming a high dielectric film and the dielectric film formed thereby".

Company Profile
0.46.36
  • DeBoer; Scott J. - Boise ID
  • DeBoer; Scott J. - Biose ID
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Double sided container process used during the manufacture of a semiconductor device
Grant 7,345,333 - DeBoer , et al. March 18, 2
2008-03-18
Method and structure for reducing contact aspect ratios
Grant 7,268,072 - Deboer , et al. September 11, 2
2007-09-11
Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby
App 20070148990 - DeBoer; Scott J. ;   et al.
2007-06-28
Methods for forming a high dielectric film
Grant 7,192,889 - DeBoer , et al. March 20, 2
2007-03-20
Method of fabricating a semiconductor device with a wet oxidation with steam process
Grant 7,176,079 - Weimer , et al. February 13, 2
2007-02-13
Capacitors, methods of forming capacitors, and methods of forming capacitor dielectric layers
Grant 7,153,746 - Moore , et al. December 26, 2
2006-12-26
Double sided container process used during the manufacture of a semiconductor device
App 20060267062 - DeBoer; Scott J. ;   et al.
2006-11-30
A Capacitor Electrode Having An Interface Layer Of Different Chemical Composition Formed On A Bulk Layer
App 20060246658 - DeBoer; Scott J. ;   et al.
2006-11-02
Capacitor electrode having an interface layer of different chemical composition formed on a bulk layer
Grant 7,092,233 - DeBoer , et al. August 15, 2
2006-08-15
Double sided container process used during the manufacture of a semiconductor device
Grant 7,084,448 - DeBoer , et al. August 1, 2
2006-08-01
Method of processing a transistor gate dielectric film with stem
Grant 7,064,052 - Weimer , et al. June 20, 2
2006-06-20
Method of fabricating a semiconductor device with a dielectric film using a wet oxidation with steam process
Grant 7,022,623 - Weimer , et al. April 4, 2
2006-04-04
Raised-lines overlay semiconductor targets and method of making the same
App 20060017074 - Baluswamy; Pary ;   et al.
2006-01-26
Capacitor electrode having an interface layer of different chemical composition formed on a bulk layer
App 20060007631 - DeBoer; Scott J. ;   et al.
2006-01-12
Method of forming a capacitor electrode having an interface layer of different chemical composition from a bulk layer
Grant 6,964,909 - DeBoer , et al. November 15, 2
2005-11-15
Method of fabricating a capacitive element for a semiconductor device
Grant 6,949,477 - Weimer , et al. September 27, 2
2005-09-27
Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby
Grant 6,927,179 - DeBoer , et al. August 9, 2
2005-08-09
Capacitors, methods of forming capacitors, and methods of forming capacitor dielectric layers
App 20050167727 - Moore, John T. ;   et al.
2005-08-04
Method and structure for reducing contact aspect ratios
App 20050164481 - Deboer, Scott J. ;   et al.
2005-07-28
Residue free overlay target
Grant 6,914,017 - Baluswamy , et al. July 5, 2
2005-07-05
Capacitors
Grant 6,891,215 - Moore , et al. May 10, 2
2005-05-10
Method and structure for reducing contact aspect ratios
Grant 6,878,587 - Deboer , et al. April 12, 2
2005-04-12
Methods of forming capacitors
Grant 6,878,585 - Moore , et al. April 12, 2
2005-04-12
Method of forming a capacitor dielectric layer
Grant 6,875,707 - Moore , et al. April 5, 2
2005-04-05
Raised-lines overlay semiconductor targets and method of making the same
App 20050070069 - Baluswamy, Pary ;   et al.
2005-03-31
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
Grant 6,872,639 - DeBoer , et al. March 29, 2
2005-03-29
Fabrication of DRAM and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process
App 20050048793 - Weimer, Ronald A. ;   et al.
2005-03-03
Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby
App 20050009361 - DeBoer, Scott J. ;   et al.
2005-01-13
Capacitor electrode having an interface layer of different chemical composition formed on a bulk layer
Grant 6,825,522 - DeBoer , et al. November 30, 2
2004-11-30
Raised-lines overlay semiconductor targets and method of making the same
Grant 6,822,342 - Baluswamy , et al. November 23, 2
2004-11-23
Double sided container process used during the manufacture of a semiconductor device
App 20040164335 - DeBoer, Scott J. ;   et al.
2004-08-26
Capacitor structures with recessed hemispherical grain silicon
App 20040155274 - DeBoer, Scott J. ;   et al.
2004-08-12
Method and structure for reducing contact aspect ratios
App 20040106276 - Deboer, Scott J. ;   et al.
2004-06-03
DRAM capacitor formulation using a double-sided electrode
Grant 6,737,696 - DeBoer , et al. May 18, 2
2004-05-18
Structure for reducing contact aspect ratios
Grant 6,720,609 - Deboer , et al. April 13, 2
2004-04-13
Double sided container process used during the manufacture of a semiconductor device
Grant 6,696,336 - DeBoer , et al. February 24, 2
2004-02-24
Capacitor structures with recessed hemispherical grain silicon
Grant 6,693,320 - DeBoer , et al. February 17, 2
2004-02-17
Structure for reducing contact aspect ratios
Grant 6,677,636 - Deboer , et al. January 13, 2
2004-01-13
Method and structure for reducing contact aspect ratios
Grant 6,670,238 - Deboer , et al. December 30, 2
2003-12-30
Capacitors
App 20030209778 - Moore, John T. ;   et al.
2003-11-13
Method of forming a capacitor dielectric layer
App 20030207592 - Moore, John T. ;   et al.
2003-11-06
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
App 20030203608 - DeBoer, Scott J. ;   et al.
2003-10-30
DRAM capacitor formulation using a double-sided electrode
Grant 6,635,547 - DeBoer , et al. October 21, 2
2003-10-21
Capacitor structures with recessed hemispherical grain silicon
Grant 6,632,719 - DeBoer , et al. October 14, 2
2003-10-14
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
Grant 6,614,082 - DeBoer , et al. September 2, 2
2003-09-02
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
Grant 6,613,654 - DeBoer , et al. September 2, 2
2003-09-02
Structural integrity enhancement of dielectric films
Grant 6,607,953 - DeBoer August 19, 2
2003-08-19
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride
Grant 6,548,405 - Kraus , et al. April 15, 2
2003-04-15
Capacitors, methods of forming capacitors, and methods of forming capacitor dielectric layers
App 20030045050 - Moore, John T. ;   et al.
2003-03-06
Structure for reducing contact aspect ratios
App 20030015750 - Deboer, Scott J. ;   et al.
2003-01-23
Method and structure for reducing contact aspect ratios
App 20020195639 - Deboer, Scott J. ;   et al.
2002-12-26
Structural integrity enhancement of dielectric films
App 20020197816 - DeBoer, Scott J.
2002-12-26
Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby
App 20020187654 - DeBoer, Scott J. ;   et al.
2002-12-12
Fabrication of dram and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process
App 20020151107 - Weimer, Ronald A. ;   et al.
2002-10-17
Methods for forming a dielectric film
Grant 6,461,982 - DeBoer , et al. October 8, 2
2002-10-08
DRAM capacitor formulation using a double-sided electrode
Grant 6,451,661 - DeBoer , et al. September 17, 2
2002-09-17
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride
App 20020106896 - Kraus, Brenda D. ;   et al.
2002-08-08
Boride electrodes and barriers for cell dielectrics
App 20020079531 - Al-Shareef, Husam N. ;   et al.
2002-06-27
Method and structure for reducing contact aspect ratios
App 20020064934 - Deboer, Scott J. ;   et al.
2002-05-30
Fabrication of DRAM and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process
App 20020045358 - Weimer, Ronald A. ;   et al.
2002-04-18
Method and structure for reducing contact aspect ratios
Grant 6,365,453 - Deboer , et al. April 2, 2
2002-04-02
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride
Grant 6,365,519 - Kraus , et al. April 2, 2
2002-04-02
Residue-free overlay target
App 20020036332 - Baluswamy, Pary ;   et al.
2002-03-28
Methods Of Forming Recessed Hemispherical Grain Silicon Capacitor Structures
App 20020028563 - DeBoer, Scott J.
2002-03-07
Methods of forming capacitors and related integrated circuitry
App 20020022320 - DeBoer, Scott J. ;   et al.
2002-02-21
Structural integrity enhancement of dielectric films
Grant 6,340,613 - DeBoer January 22, 2
2002-01-22
DRAM capacitor formulation using a double-sided electrode
App 20010053576 - DeBoer, Scott J. ;   et al.
2001-12-20
Fabrication Of Dram And Other Semiconductor Devices With An Insulating Film Using A Wet Rapid Thermal Oxidation Process
App 20010051406 - WEIMER, RONALD A. ;   et al.
2001-12-13
Apparatus for forming a high dielectric film
Grant 6,325,017 - DeBoer , et al. December 4, 2
2001-12-04
Method and structure for reducing contact aspect ratios
App 20010045658 - Deboer, Scott J. ;   et al.
2001-11-29
Structural integrity enhancement of dielectric films
App 20010041457 - DeBoer, Scott J.
2001-11-15
Oxide etching method and structures resulting from same
App 20010038111 - DeBoer, Scott J. ;   et al.
2001-11-08
Methods And Apparatus For Forming A High Dielectric Film And The Dielectric Film Formed Thereby
App 20010036752 - DEBOER, SCOTT J. ;   et al.
2001-11-01
Semiconductor processing methods of forming photoresist over silicon nitride materials, and semiconductor wafer assemblies comprising photoresist over silicon nitride materials
Grant 6,300,253 - Moore , et al. October 9, 2
2001-10-09
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride
App 20010014521 - Kraus, Brenda D. ;   et al.
2001-08-16
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride
Grant 6,218,293 - Kraus , et al. April 17, 2
2001-04-17
DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films
Grant 6,150,208 - Deboer , et al. November 21, 2
2000-11-21
Boride electrodes and barriers for cell dielectrics
Grant 6,111,285 - Al-Shareef , et al. August 29, 2
2000-08-29
Conditioning of dielectric materials
Grant 6,090,723 - Thakur , et al. July 18, 2
2000-07-18
Method of forming capacitors and related integrated circuitry
Grant 6,046,093 - DeBoer , et al. April 4, 2
2000-04-04
Semiconductor wafer assemblies comprising silicon nitride, methods of forming silicon nitride, and methods of reducing stress on semiconductive wafers
Grant 5,985,771 - Moore , et al. November 16, 1
1999-11-16
Method of fabricating a semiconductor device utilizing polysilicon grains
Grant 5,960,294 - Zahurak , et al. September 28, 1
1999-09-28
Company Registrations
SEC0001568238Deboer Scott J

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