loadpatents
Patent applications and USPTO patent grants for Dean; Timothy B..The latest application filed is for "process for reforming a plastic packaged integrated circuit die and a reformed plastic packaged integrated circuit die".
Patent | Date |
---|---|
Process to reform a plastic packaged integrated circuit die Grant 7,434,310 - Dean , et al. October 14, 2 | 2008-10-14 |
Overmolded electronic assembly and overmoldable interface component Grant 7,390,978 - Dean , et al. June 24, 2 | 2008-06-24 |
Process For Reforming A Plastic Packaged Integrated Circuit Die And A Reformed Plastic Packaged Integrated Circuit Die App 20070278676 - Dean; Timothy B. ;   et al. | 2007-12-06 |
Peelable circuit board foil Grant 7,241,510 - Dunn , et al. July 10, 2 | 2007-07-10 |
Printed circuit dielectric foil and embedded capacitors Grant 7,193,838 - Dunn , et al. March 20, 2 | 2007-03-20 |
Peelable circuit board foil App 20060269728 - Dunn; Gregory J. ;   et al. | 2006-11-30 |
Corrosion-resistant copper bond pad and integrated device Grant 7,078,796 - Dunn , et al. July 18, 2 | 2006-07-18 |
Overmolded electronic assembly and overmoldable interface component App 20060141828 - Dean; Timothy B. ;   et al. | 2006-06-29 |
Activation plate for electroless and immersion plating of integrated circuits Grant 6,974,776 - Dean , et al. December 13, 2 | 2005-12-13 |
Printed circuit dielectric foil and embedded capacitors App 20050135074 - Dunn, Gregory J. ;   et al. | 2005-06-23 |
Corrosion-resistant bond pad and integrated device App 20050104207 - Dean, Timothy B. ;   et al. | 2005-05-19 |
Peelable Circuit Board Foil App 20050079375 - Dean, Timothy B. ;   et al. | 2005-04-14 |
Peelable circuit board foil Grant 6,872,468 - Dean , et al. March 29, 2 | 2005-03-29 |
Corrosion-resistant copper bond pad and integrated device App 20050001324 - Dunn, Gregory J. ;   et al. | 2005-01-06 |
Activation plate for electroless and immersion plating of integrated circuits App 20050003677 - Dean, Timothy B. ;   et al. | 2005-01-06 |
Corrosion-resistant bond pad and integrated device App 20050001316 - Dean, Timothy B. ;   et al. | 2005-01-06 |
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