Dean; Timothy B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dean; Timothy B..The latest application filed is for "process for reforming a plastic packaged integrated circuit die and a reformed plastic packaged integrated circuit die".

Company Profile

0.7.9

Dean; Timothy B. - Elk Grove Village IL
Dean; Timothy B. - Elk Grove IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process to reform a plastic packaged integrated circuit die Grant 7,434,310 - Dean , et al. October 14, 2	2008-10-14
Overmolded electronic assembly and overmoldable interface component Grant 7,390,978 - Dean , et al. June 24, 2	2008-06-24
Process For Reforming A Plastic Packaged Integrated Circuit Die And A Reformed Plastic Packaged Integrated Circuit Die App 20070278676 - Dean; Timothy B. ; et al.	2007-12-06
Peelable circuit board foil Grant 7,241,510 - Dunn , et al. July 10, 2	2007-07-10
Printed circuit dielectric foil and embedded capacitors Grant 7,193,838 - Dunn , et al. March 20, 2	2007-03-20
Peelable circuit board foil App 20060269728 - Dunn; Gregory J. ; et al.	2006-11-30
Corrosion-resistant copper bond pad and integrated device Grant 7,078,796 - Dunn , et al. July 18, 2	2006-07-18
Overmolded electronic assembly and overmoldable interface component App 20060141828 - Dean; Timothy B. ; et al.	2006-06-29
Activation plate for electroless and immersion plating of integrated circuits Grant 6,974,776 - Dean , et al. December 13, 2	2005-12-13
Printed circuit dielectric foil and embedded capacitors App 20050135074 - Dunn, Gregory J. ; et al.	2005-06-23
Corrosion-resistant bond pad and integrated device App 20050104207 - Dean, Timothy B. ; et al.	2005-05-19
Peelable Circuit Board Foil App 20050079375 - Dean, Timothy B. ; et al.	2005-04-14
Peelable circuit board foil Grant 6,872,468 - Dean , et al. March 29, 2	2005-03-29
Corrosion-resistant copper bond pad and integrated device App 20050001324 - Dunn, Gregory J. ; et al.	2005-01-06
Activation plate for electroless and immersion plating of integrated circuits App 20050003677 - Dean, Timothy B. ; et al.	2005-01-06
Corrosion-resistant bond pad and integrated device App 20050001316 - Dean, Timothy B. ; et al.	2005-01-06

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