loadpatents
name:-0.02811598777771
name:-0.089440107345581
name:-0.0041470527648926
DEAI; Hiroyuki Patent Filings

DEAI; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for DEAI; Hiroyuki.The latest application filed is for "silica spherical particles for semiconductor sealing material".

Company Profile
2.4.7
  • DEAI; Hiroyuki - Tokyo JP
  • Deai; Hiroyuki - Saitama JP
  • Deai; Hiroyuki - Osato-Gun JP
  • Deai; Hiroyuki - Hikari JP
  • Deai; Hiroyuki - Yamaguchi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silica Spherical Particles For Semiconductor Sealing Material
App 20220009783 - YAGI; Katsumasa ;   et al.
2022-01-13
Bonding wire for semiconductor device
Grant 10,950,570 - Oyamada , et al. March 16, 2
2021-03-16
Method for manufacturing silicon carbide single crystal
Grant 10,526,722 - Nakabayashi , et al. J
2020-01-07
Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
Grant 10,381,320 - Oyamada , et al. A
2019-08-13
Method For Manufacturing Silicon Carbide Single Crystal
App 20180251909 - NAKABAYASHI; Masashi ;   et al.
2018-09-06
Bonding Wire For Semiconductor Device
App 20170110430 - OYAMADA; Tetsuya ;   et al.
2017-04-20
Bonding Wire For Semiconductor Device
App 20170040281 - OYAMADA; Tetsuya ;   et al.
2017-02-09
Silicon Wafer And Production Method Thereof
App 20120032229 - Deai; Hiroyuki ;   et al.
2012-02-09
Semiconductor substrate and method for production thereof
Grant 8,043,929 - Brunner , et al. October 25, 2
2011-10-25
Semiconductor Substrate And Method For Production Thereof
App 20080268613 - Brunner; Josef ;   et al.
2008-10-30
Semiconductor substrate and method for production thereof
App 20050139961 - Brunner, Josef ;   et al.
2005-06-30

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