de Munnik; Walter
Patent Applications and Registrations
Patent applications and USPTO patent grants for de Munnik; Walter.The latest application filed is for "integrated circuit package and process for fabricating the same".
- de Munnik; Walter - Arnhem NL
| Patent | Date |
|---|---|
| Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion Grant 9,520,306 - Lin , et al. December 13, 2 | 2016-12-13 |
| Integrated Circuit Package And Process For Fabricating The Same App 20160013075 - LIN; Geraldine Tsui Yee ; et al. | 2016-01-14 |
| Integrated circuit package having a plurality of spaced apart pad portions Grant 8,330,270 - Lin , et al. December 11, 2 | 2012-12-11 |
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