loadpatents
name:-0.014050006866455
name:-0.0083780288696289
name:-0.0064249038696289
de Marneffe; Jean-Francois Patent Filings

de Marneffe; Jean-Francois

Patent Applications and Registrations

Patent applications and USPTO patent grants for de Marneffe; Jean-Francois.The latest application filed is for "bias temperature instability of sio2 layers".

Company Profile
6.7.12
  • de Marneffe; Jean-Francois - Bossut-Gottechain BE
  • de MARNEFFE; Jean-Francois - Tokyo JP
  • de Marneffe; Jean-Francois - Leuven BE
  • de Marneffe; Jean-Francois - Gottechain BE
  • de Marneffe; Jean-Francois - Bossut-Gottechaln BE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bias Temperature Instability Of Sio2 Layers
App 20220181145 - Franco; Jacopo ;   et al.
2022-06-09
Removing an organic sacrificial material from a two-dimensional material
Grant 11,056,376 - Chan , et al. July 6, 2
2021-07-06
Semiconductor Device Manufacturing Method
App 20210118727 - YATSUDA; Koichi ;   et al.
2021-04-22
Semiconductor device manufacturing method
Grant 10,910,259 - Yatsuda , et al. February 2, 2
2021-02-02
Method Of Etching Porous Film
App 20200395221 - TAHARA; Shigeru ;   et al.
2020-12-17
Removing an Organic Sacrificial Material From a Two-Dimensional Material
App 20200144094 - Chan; Boon Teik ;   et al.
2020-05-07
Nanopore Formed Through Fin By Self-alignment
App 20190271660 - Chan; Boon Teik ;   et al.
2019-09-05
Semiconductor Device Manufacturing Method
App 20190181039 - YATSUDA; Koichi ;   et al.
2019-06-13
Method of etching porous film
Grant 10,236,162 - Tahara , et al.
2019-03-19
Methods and Systems for Forming a Mask Layer
App 20190057859 - Chan; Boon Teik ;   et al.
2019-02-21
Method Of Etching Porous Film
App 20180082823 - TAHARA; Shigeru ;   et al.
2018-03-22
Method of etching porous film
Grant 9,859,102 - Tahara , et al. January 2, 2
2018-01-02
Method and apparatus for real-time monitoring of plasma etch uniformity
Grant 9,847,262 - Samara , et al. December 19, 2
2017-12-19
Plasma etching of porous substrates
Grant 9,595,422 - Baklanov , et al. March 14, 2
2017-03-14
Plasma method for reducing post-lithography line width roughness
Grant 9,520,298 - De Schepper , et al. December 13, 2
2016-12-13
Method Of Etching Porous Film
App 20160307732 - TAHARA; Shigeru ;   et al.
2016-10-20
Plasma Etching Of Porous Substrates
App 20160276133 - Baklanov; Mikhail ;   et al.
2016-09-22
Method And Apparatus For Real-time Monitoring Of Plasma Etch Uniformity
App 20160181165 - Samara; Vladimir ;   et al.
2016-06-23
Plasma Method for Reducing Post-Lithography Line Width Roughness
App 20150228497 - De Schepper; Peter ;   et al.
2015-08-13

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