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Patent applications and USPTO patent grants for de Marneffe; Jean-Francois.The latest application filed is for "bias temperature instability of sio2 layers".
Patent | Date |
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Bias Temperature Instability Of Sio2 Layers App 20220181145 - Franco; Jacopo ;   et al. | 2022-06-09 |
Removing an organic sacrificial material from a two-dimensional material Grant 11,056,376 - Chan , et al. July 6, 2 | 2021-07-06 |
Semiconductor Device Manufacturing Method App 20210118727 - YATSUDA; Koichi ;   et al. | 2021-04-22 |
Semiconductor device manufacturing method Grant 10,910,259 - Yatsuda , et al. February 2, 2 | 2021-02-02 |
Method Of Etching Porous Film App 20200395221 - TAHARA; Shigeru ;   et al. | 2020-12-17 |
Removing an Organic Sacrificial Material From a Two-Dimensional Material App 20200144094 - Chan; Boon Teik ;   et al. | 2020-05-07 |
Nanopore Formed Through Fin By Self-alignment App 20190271660 - Chan; Boon Teik ;   et al. | 2019-09-05 |
Semiconductor Device Manufacturing Method App 20190181039 - YATSUDA; Koichi ;   et al. | 2019-06-13 |
Method of etching porous film Grant 10,236,162 - Tahara , et al. | 2019-03-19 |
Methods and Systems for Forming a Mask Layer App 20190057859 - Chan; Boon Teik ;   et al. | 2019-02-21 |
Method Of Etching Porous Film App 20180082823 - TAHARA; Shigeru ;   et al. | 2018-03-22 |
Method of etching porous film Grant 9,859,102 - Tahara , et al. January 2, 2 | 2018-01-02 |
Method and apparatus for real-time monitoring of plasma etch uniformity Grant 9,847,262 - Samara , et al. December 19, 2 | 2017-12-19 |
Plasma etching of porous substrates Grant 9,595,422 - Baklanov , et al. March 14, 2 | 2017-03-14 |
Plasma method for reducing post-lithography line width roughness Grant 9,520,298 - De Schepper , et al. December 13, 2 | 2016-12-13 |
Method Of Etching Porous Film App 20160307732 - TAHARA; Shigeru ;   et al. | 2016-10-20 |
Plasma Etching Of Porous Substrates App 20160276133 - Baklanov; Mikhail ;   et al. | 2016-09-22 |
Method And Apparatus For Real-time Monitoring Of Plasma Etch Uniformity App 20160181165 - Samara; Vladimir ;   et al. | 2016-06-23 |
Plasma Method for Reducing Post-Lithography Line Width Roughness App 20150228497 - De Schepper; Peter ;   et al. | 2015-08-13 |
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