DE BONIS; Thomas J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for DE BONIS; Thomas J..The latest application filed is for "multi-chip packaging".
- DE BONIS; Thomas J. - Tempe AZ
- De Bonis; Thomas J - Tempe AZ
| Patent | Date |
|---|---|
| Multi-chip Packaging App 20220231007 - SANKMAN; Robert L. ; et al. | 2022-07-21 |
| Multi-chip packaging Grant 11,348,911 - Sankman , et al. May 31, 2 | 2022-05-31 |
| Multi-chip Packaging App 20220157803 - SANKMAN; Robert L. ; et al. | 2022-05-19 |
| Thermally coupled package-on-package semiconductor packages Grant 11,222,877 - Karhade , et al. January 11, 2 | 2022-01-11 |
| Multi-chip Packaging App 20200395352 - Sankman; Robert L. ; et al. | 2020-12-17 |
| Multi-chip packaging Grant 10,700,051 - Sankman , et al. | 2020-06-30 |
| Multi-chip Packaging App 20190371778 - Sankman; Robert L. ; et al. | 2019-12-05 |
| Thermally Coupled Package-on-package Semiconductor App 20190103385 - KARHADE; OMKAR ; et al. | 2019-04-04 |
| Package structure to enhance yield of TMI interconnections Grant 10,049,971 - De Bonis , et al. August 14, 2 | 2018-08-14 |
| Package Structure To Enhance Yield of TMI Interconnections App 20170207152 - De Bonis; Thomas J. ; et al. | 2017-07-20 |
| Package structure to enhance yield of TMI interconnections Grant 9,613,933 - De Bonis , et al. April 4, 2 | 2017-04-04 |
| Package Structure To Enhance Yield of TMI Interconnections App 20150255415 - De Bonis; Thomas J. ; et al. | 2015-09-10 |
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