loadpatents
name:-0.039485931396484
name:-0.02984094619751
name:-0.014701128005981
De; Binod B. Patent Filings

De; Binod B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for De; Binod B..The latest application filed is for "dielectric film-forming composition".

Company Profile
13.24.31
  • De; Binod B. - Attleboro MA
  • De; Binod B. - Providence RI
  • De; Binod B - Attleboro MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Dielectric Film-Forming Composition
App 20220127459 - De; Binod B. ;   et al.
2022-04-28
Dielectric Film Forming Compositions
App 20220017673 - Malik; Sanjay ;   et al.
2022-01-20
Dielectric Film-Forming Composition
App 20220002463 - De; Binod B. ;   et al.
2022-01-06
Polyimides
App 20210355279 - De; Binod B. ;   et al.
2021-11-18
Photosensitive stacked structure
Grant 11,175,582 - Malik , et al. November 16, 2
2021-11-16
Polyimides
Grant 11,061,327 - Reinerth , et al. July 13, 2
2021-07-13
Polyimides
Grant 10,793,676 - Malik , et al. October 6, 2
2020-10-06
Polyimide compositions
Grant 10,781,341 - Malik , et al. Sept
2020-09-22
Polyimides
App 20200262978 - De; Binod B. ;   et al.
2020-08-20
Photosensitive Polyimide Compositions
App 20200218152 - De; Binod B. ;   et al.
2020-07-09
Cleaning composition
Grant 10,696,932 - Sakamuri , et al. June 30, 2
2020-06-30
Polymer and thermosetting composition containing same
Grant 10,604,628 - Malik , et al.
2020-03-31
Dielectric film forming composition
Grant 10,563,014 - Malik , et al. Feb
2020-02-18
Polyimides
App 20190263969 - Malik; Sanjay ;   et al.
2019-08-29
Photosensitive Polyimide Compositions
App 20190171105 - Malik; Sanjay ;   et al.
2019-06-06
Polyimides
App 20190129303 - Reinerth; William A. ;   et al.
2019-05-02
Dielectric Film Forming Composition
App 20190077913 - Malik; Sanjay ;   et al.
2019-03-14
Photosensitive Stacked Structure
App 20190018321 - Malik; Sanjay ;   et al.
2019-01-17
Cleaning Composition
App 20190016999 - Sakamuri; Raj ;   et al.
2019-01-17
Photosensitive polyimide compositions
Grant 10,036,952 - Malik , et al. July 31, 2
2018-07-31
Process for the production of polyimide and polyamic ester polymers
Grant 9,777,117 - Reinerth , et al. October 3, 2
2017-10-03
Novel Polymer and Thermosetting Composition Containing Same
App 20170260330 - Malik; Sanjay ;   et al.
2017-09-14
Polymer and thermosetting composition containing same
Grant 9,695,284 - Malik , et al. July 4, 2
2017-07-04
Process For The Production Of Polyimide And Polyamic Ester Polymers
App 20170174837 - Reinerth; William A. ;   et al.
2017-06-22
Process for the production of polyimide and polyamic ester polymers
Grant 9,617,386 - Reinerth , et al. April 11, 2
2017-04-11
Photosensitive Polyimide Compositions
App 20160313641 - De; Binod B. ;   et al.
2016-10-27
Photosensitive Polyimide Compositions
App 20160313642 - Malik; Sanjay ;   et al.
2016-10-27
Novel Polyimide Compositions
App 20150219990 - Malik; Sanjay ;   et al.
2015-08-06
Chemically amplified positive photoresist composition
Grant 9,034,557 - Dimov , et al. May 19, 2
2015-05-19
Novel Polymer and Thermosetting Composition Containing Same
App 20140343199 - Malik; Sanjay ;   et al.
2014-11-20
Process For The Production Of Polyimide And Polyamic Ester Polymers
App 20140343223 - Reinerth; William A. ;   et al.
2014-11-20
Thermally cured underlayer for lithographic application
Grant 8,535,872 - De , et al. September 17, 2
2013-09-17
Thermally Cured Underlayer For Lithographic Application
App 20120178871 - De; Binod B. ;   et al.
2012-07-12
Thermally cured underlayer for lithographic application
Grant 8,153,346 - De , et al. April 10, 2
2012-04-10
Chemically Amplified Positive Photoresist Composition
App 20100304299 - Dimov; Ognian N. ;   et al.
2010-12-02
High etch resistant underlayer compositions for multilayer lithographic processes
Grant 7,727,705 - De , et al. June 1, 2
2010-06-01
Process for highly purified polyhedral oligomeric silsesquioxane monomers
Grant 7,491,783 - Schwab , et al. February 17, 2
2009-02-17
High Etch Resistant Underlayer Compositions For Multilayer Lithographic Processes
App 20080206667 - De; Binod B. ;   et al.
2008-08-28
Thermally Cured Underlayer For Lithographic Application
App 20080206676 - De; Binod B. ;   et al.
2008-08-28
Thermally cured undercoat for lithographic application
Grant 7,416,821 - De , et al. August 26, 2
2008-08-26
Photosensitive Compositions Employing Silicon-containing Additives
App 20080199805 - RUSHKIN; IL'YA ;   et al.
2008-08-21
Process for highly purified polyhedral oligomeric silsesquioxane monomers
App 20070065750 - Schwab; Joseph J. ;   et al.
2007-03-22
Thermally cured undercoat for lithographic application
App 20050238997 - De, Binod B. ;   et al.
2005-10-27
Photosensitive bilayer composition
Grant 6,929,897 - Foster , et al. August 16, 2
2005-08-16
Thermally cured underlayer for lithographic application
Grant 6,924,339 - De , et al. August 2, 2
2005-08-02
Copolymer, photoresist compositions thereof and deep UV bilayer system thereof
Grant 6,916,543 - De , et al. July 12, 2
2005-07-12
Novel photosensitive bilayer composition
App 20050042542 - Foster, Patrick ;   et al.
2005-02-24
Acetal protected polymers and photoresists compositions thereof
Grant 6,830,870 - Malik , et al. December 14, 2
2004-12-14
Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof
App 20040137362 - De, Binod B. ;   et al.
2004-07-15
Acetal protected polymers and photoresists compositions thereof
App 20040034160 - Malik, Sanjay ;   et al.
2004-02-19
Thermally cured underlayer for lithographic application
App 20030204035 - De, Binod B. ;   et al.
2003-10-30
Thermally cured underlayer for lithographic application
Grant 6,610,808 - De , et al. August 26, 2
2003-08-26
Thermally cured underlayer for lithographic application
App 20020173594 - De, Binod B. ;   et al.
2002-11-21

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