loadpatents
Patent applications and USPTO patent grants for De; Binod B..The latest application filed is for "dielectric film-forming composition".
Patent | Date |
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Dielectric Film-Forming Composition App 20220127459 - De; Binod B. ;   et al. | 2022-04-28 |
Dielectric Film Forming Compositions App 20220017673 - Malik; Sanjay ;   et al. | 2022-01-20 |
Dielectric Film-Forming Composition App 20220002463 - De; Binod B. ;   et al. | 2022-01-06 |
Polyimides App 20210355279 - De; Binod B. ;   et al. | 2021-11-18 |
Photosensitive stacked structure Grant 11,175,582 - Malik , et al. November 16, 2 | 2021-11-16 |
Polyimides Grant 11,061,327 - Reinerth , et al. July 13, 2 | 2021-07-13 |
Polyimides Grant 10,793,676 - Malik , et al. October 6, 2 | 2020-10-06 |
Polyimide compositions Grant 10,781,341 - Malik , et al. Sept | 2020-09-22 |
Polyimides App 20200262978 - De; Binod B. ;   et al. | 2020-08-20 |
Photosensitive Polyimide Compositions App 20200218152 - De; Binod B. ;   et al. | 2020-07-09 |
Cleaning composition Grant 10,696,932 - Sakamuri , et al. June 30, 2 | 2020-06-30 |
Polymer and thermosetting composition containing same Grant 10,604,628 - Malik , et al. | 2020-03-31 |
Dielectric film forming composition Grant 10,563,014 - Malik , et al. Feb | 2020-02-18 |
Polyimides App 20190263969 - Malik; Sanjay ;   et al. | 2019-08-29 |
Photosensitive Polyimide Compositions App 20190171105 - Malik; Sanjay ;   et al. | 2019-06-06 |
Polyimides App 20190129303 - Reinerth; William A. ;   et al. | 2019-05-02 |
Dielectric Film Forming Composition App 20190077913 - Malik; Sanjay ;   et al. | 2019-03-14 |
Photosensitive Stacked Structure App 20190018321 - Malik; Sanjay ;   et al. | 2019-01-17 |
Cleaning Composition App 20190016999 - Sakamuri; Raj ;   et al. | 2019-01-17 |
Photosensitive polyimide compositions Grant 10,036,952 - Malik , et al. July 31, 2 | 2018-07-31 |
Process for the production of polyimide and polyamic ester polymers Grant 9,777,117 - Reinerth , et al. October 3, 2 | 2017-10-03 |
Novel Polymer and Thermosetting Composition Containing Same App 20170260330 - Malik; Sanjay ;   et al. | 2017-09-14 |
Polymer and thermosetting composition containing same Grant 9,695,284 - Malik , et al. July 4, 2 | 2017-07-04 |
Process For The Production Of Polyimide And Polyamic Ester Polymers App 20170174837 - Reinerth; William A. ;   et al. | 2017-06-22 |
Process for the production of polyimide and polyamic ester polymers Grant 9,617,386 - Reinerth , et al. April 11, 2 | 2017-04-11 |
Photosensitive Polyimide Compositions App 20160313641 - De; Binod B. ;   et al. | 2016-10-27 |
Photosensitive Polyimide Compositions App 20160313642 - Malik; Sanjay ;   et al. | 2016-10-27 |
Novel Polyimide Compositions App 20150219990 - Malik; Sanjay ;   et al. | 2015-08-06 |
Chemically amplified positive photoresist composition Grant 9,034,557 - Dimov , et al. May 19, 2 | 2015-05-19 |
Novel Polymer and Thermosetting Composition Containing Same App 20140343199 - Malik; Sanjay ;   et al. | 2014-11-20 |
Process For The Production Of Polyimide And Polyamic Ester Polymers App 20140343223 - Reinerth; William A. ;   et al. | 2014-11-20 |
Thermally cured underlayer for lithographic application Grant 8,535,872 - De , et al. September 17, 2 | 2013-09-17 |
Thermally Cured Underlayer For Lithographic Application App 20120178871 - De; Binod B. ;   et al. | 2012-07-12 |
Thermally cured underlayer for lithographic application Grant 8,153,346 - De , et al. April 10, 2 | 2012-04-10 |
Chemically Amplified Positive Photoresist Composition App 20100304299 - Dimov; Ognian N. ;   et al. | 2010-12-02 |
High etch resistant underlayer compositions for multilayer lithographic processes Grant 7,727,705 - De , et al. June 1, 2 | 2010-06-01 |
Process for highly purified polyhedral oligomeric silsesquioxane monomers Grant 7,491,783 - Schwab , et al. February 17, 2 | 2009-02-17 |
High Etch Resistant Underlayer Compositions For Multilayer Lithographic Processes App 20080206667 - De; Binod B. ;   et al. | 2008-08-28 |
Thermally Cured Underlayer For Lithographic Application App 20080206676 - De; Binod B. ;   et al. | 2008-08-28 |
Thermally cured undercoat for lithographic application Grant 7,416,821 - De , et al. August 26, 2 | 2008-08-26 |
Photosensitive Compositions Employing Silicon-containing Additives App 20080199805 - RUSHKIN; IL'YA ;   et al. | 2008-08-21 |
Process for highly purified polyhedral oligomeric silsesquioxane monomers App 20070065750 - Schwab; Joseph J. ;   et al. | 2007-03-22 |
Thermally cured undercoat for lithographic application App 20050238997 - De, Binod B. ;   et al. | 2005-10-27 |
Photosensitive bilayer composition Grant 6,929,897 - Foster , et al. August 16, 2 | 2005-08-16 |
Thermally cured underlayer for lithographic application Grant 6,924,339 - De , et al. August 2, 2 | 2005-08-02 |
Copolymer, photoresist compositions thereof and deep UV bilayer system thereof Grant 6,916,543 - De , et al. July 12, 2 | 2005-07-12 |
Novel photosensitive bilayer composition App 20050042542 - Foster, Patrick ;   et al. | 2005-02-24 |
Acetal protected polymers and photoresists compositions thereof Grant 6,830,870 - Malik , et al. December 14, 2 | 2004-12-14 |
Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof App 20040137362 - De, Binod B. ;   et al. | 2004-07-15 |
Acetal protected polymers and photoresists compositions thereof App 20040034160 - Malik, Sanjay ;   et al. | 2004-02-19 |
Thermally cured underlayer for lithographic application App 20030204035 - De, Binod B. ;   et al. | 2003-10-30 |
Thermally cured underlayer for lithographic application Grant 6,610,808 - De , et al. August 26, 2 | 2003-08-26 |
Thermally cured underlayer for lithographic application App 20020173594 - De, Binod B. ;   et al. | 2002-11-21 |
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