de Avila Ribas; Morgana
Patent Applications and Registrations
Patent applications and USPTO patent grants for de Avila Ribas; Morgana.The latest application filed is for "sintering powder".
- de Avila Ribas; Morgana - Bangalore IN
- De Avila Ribas; Morgana - Waterbury CT
- De Avila Ribas; Morgana - South Plainfield NJ
| Patent | Date |
|---|---|
| Advanced solder alloys for electronic interconnects Grant 11,411,150 - de Avila Ribas , et al. August 9, 2 | 2022-08-09 |
| Sintering Powder App 20220169905 - Ghosal; Shamik ; et al. | 2022-06-02 |
| Sintering paste Grant 11,162,007 - Ghosal , et al. November 2, 2 | 2021-11-02 |
| Lead-free and antimony-free tin solder reliable at high temperatures Grant 11,090,768 - Choudhury , et al. August 17, 2 | 2021-08-17 |
| Engineered polymer-based electronic materials Grant 10,682,732 - Venkatagiriyappa , et al. | 2020-06-16 |
| High Impact Solder Toughness Alloy App 20190262951 - Pandher; Ranjit ; et al. | 2019-08-29 |
| High Impact Solder Toughness Alloy App 20190255662 - Pandher; Ranjit ; et al. | 2019-08-22 |
| Sintering Powder App 20190194517 - Ghosal; Shamik ; et al. | 2019-06-27 |
| Low temperature high reliability alloy for solder hierarchy Grant 10,322,471 - Choudhury , et al. | 2019-06-18 |
| Advanced Solder Alloys For Electronic Interconnects App 20190157535 - de Avila Ribas; Morgana ; et al. | 2019-05-23 |
| Engineered Polymer-Based Electronic Materials App 20190143461 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2019-05-16 |
| High Impact Solder Toughness Alloy App 20180290244 - Pandher; Ranjit ; et al. | 2018-10-11 |
| Advanced Solder Alloys For Electronic Interconnects App 20180102464 - de Avila Ribas; Morgana ; et al. | 2018-04-12 |
| Engineered Polymer-Based Electronic Materials App 20180056455 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2018-03-01 |
| High Impact Solder Toughness Alloy App 20170304955 - Pandher; Ranjit ; et al. | 2017-10-26 |
| Low Temperature High Reliability Alloy for Solder Hierarchy App 20170197281 - Choudhury; Pritha ; et al. | 2017-07-13 |
| High Impact Solder Toughness Alloy App 20170136583 - Pandher; Ranjit ; et al. | 2017-05-18 |
| Engineered Residue Solder Paste Technology App 20170135227 - Ramakrishna; Hosur Venkatagiriyappa ; et al. | 2017-05-11 |
| High Impact Solder Toughness Alloy App 20160214213 - Pandher; Ranjit ; et al. | 2016-07-28 |
| High Impact Solder Toughness Alloy App 20160144462 - Pandher; Ranjit ; et al. | 2016-05-26 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20160023309 - Choudhury; Pritha ; et al. | 2016-01-28 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150266137 - Choudhury; Pritha ; et al. | 2015-09-24 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150224604 - Choudhury; Pritha ; et al. | 2015-08-13 |
| High Impact Toughness Solder Alloy App 20140219711 - Pandher; Ranjit ; et al. | 2014-08-07 |
| Solder Compositions App 20140199115 - de Avila Ribas; Morgana ; et al. | 2014-07-17 |
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