Dayrit; Richard M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dayrit; Richard M..The latest application filed is for "ballistic-resistant composite assembly".

Company Profile

2.11.12

Dayrit; Richard M. - Simpsonville SC US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bag made from high-strength heat-shrinkable film exhibiting directional tear, and process utilizing same Grant 10,189,621 - Dayrit , et al. Ja	2019-01-29
Easy opening packaging article made from heat-shrinkable film exhibiting directional tear Grant 9,561,889 - Dayrit , et al. February 7, 2	2017-02-07
Ballistic-resistant composite assembly Grant 9,291,433 - Compton , et al. March 22, 2	2016-03-22
Ballistic-Resistant Composite Assembly App 20130213208 - Compton; Stephen F. ; et al.	2013-08-22
Multilayer Active Oxygen Barrier Film Comprising a Plurality of Microlayers App 20110229701 - Rivett; Janet W. ; et al.	2011-09-22
Multilayer Oxygen Barrier Film Comprising a Plurality of Adjoining Microlayers Comprising Ethylene/Vinyl Alcohol Copolymer App 20110229722 - Rivett; Janet W. ; et al.	2011-09-22
Process for making shrink film comprising rapidly-quenched semi-crystalline polyamide Grant 7,744,806 - Broadus , et al. June 29, 2	2010-06-29
Shrink film containing semi-crystalline polyamide and process for making same Grant 7,687,123 - Broadus , et al. March 30, 2	2010-03-30
Bag made from high-strength heat-shrinkable film exhibiting directional tear, and process utilizing same App 20080292225 - Dayrit; Richard M. ; et al.	2008-11-27
Easy opening packaging article made from heat-shrinkable film exhibiting directional tear App 20080292821 - Dayrit; Richard M. ; et al.	2008-11-27
Process for making shrink film comprising rapidly-quenched semi-crystalline polyamide App 20080179780 - Broadus; Michael E. ; et al.	2008-07-31
Multilayer heat-shrinkable film of high transparency, low haze, and high semi-crystalline polyamide content App 20080182052 - Broadus; Michael E. ; et al.	2008-07-31
Shrink film containing semi-crystalline polyamide and process for making same App 20080182053 - Broadus; Michael E. ; et al.	2008-07-31
High modulus, temperature-resistant film for form fill and seal packaging Grant 7,051,493 - Cook , et al. May 30, 2	2006-05-30
High free shrink, high modulus, low shrink tension film with elastic recovery Grant 6,872,462 - Roberts , et al. March 29, 2	2005-03-29
High free shrink, high modulus, low shrink tension film with elastic recovery App 20040142195 - Roberts, William P. ; et al.	2004-07-22
High modulus, temperature-resistant film for form fill and seal packaging App 20040038012 - Cook, Hubert J. ; et al.	2004-02-26
Coextruded, retortable multilayer film Grant 6,599,639 - Dayrit , et al. July 29, 2	2003-07-29
Coextruded, retortable multilayer film App 20030017352 - Dayrit, Richard M. ; et al.	2003-01-23

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