Davis; Kenneth M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Davis; Kenneth M..The latest application filed is for "light-emitting diode packages".

Company Profile

7.12.9

Davis; Kenneth M. - Raleigh NC
Davis; Kenneth M. - Newburgh NY
Davis; Kenneth M. - Nara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting diodes, light-emitting diode arrays and related devices Grant 11,335,833 - Joo , et al. May 17, 2	2022-05-17
Light-emitting diodes, light-emitting diode arrays and related devices Grant 11,233,183 - Suich , et al. January 25, 2	2022-01-25
Light-emitting diode packages with individually controllable light-emitting diode chips Grant 11,121,298 - Murthy , et al. September 14, 2	2021-09-14
Light-emitting Diode Packages App 20210265544 - Murthy; Roshan ; et al.	2021-08-26
Light-emitting diode packages Grant 11,024,785 - Murthy , et al. June 1, 2	2021-06-01
Light-emitting diode packages Grant 10,991,862 - Murthy , et al. April 27, 2	2021-04-27
Light emitting diode package Grant D902,448 - Murthy , et al. November 17, 2	2020-11-17
Light-emitting Diodes, Light-emitting Diode Arrays And Related Devices App 20200075813 - Joo; Sung Chul ; et al.	2020-03-05
Light-emitting Diodes, Light-emitting Diode Arrays And Related Devices App 20200075822 - Suich; David ; et al.	2020-03-05
Light-emitting Diode Packages With Individually Controllable Light-emitting Diode Chips App 20190363232 - Murthy; Roshan ; et al.	2019-11-28
Light-emitting Diode Packages App 20190363223 - Murthy; Roshan ; et al.	2019-11-28
Copper recess process with application to selective capping and electroless plating Grant 7,064,064 - Chen , et al. June 20, 2	2006-06-20
Copper recess process with application to selective capping and electroless plating Grant 6,975,032 - Chen , et al. December 13, 2	2005-12-13
Copper recess process with application to selective capping and electroless plating App 20050158985 - Chen, Shyng-Tsong ; et al.	2005-07-21
Copper recess process with application to selective capping and electroless plating App 20040113279 - Chen, Shyng-Tsong ; et al.	2004-06-17
Grooved polishing pads and methods of use Grant 6,685,548 - Chen , et al. February 3, 2	2004-02-03
Grooved polishing pads and methods of use Grant 6,656,019 - Chen , et al. December 2, 2	2003-12-02
Grooved polishing pads and methods of use App 20030199234 - Chen, Shyng-Tsong ; et al.	2003-10-23
Slurry for mechanical polishing (CMP) of metals and use thereof App 20030073593 - Brigham, Michael Todd ; et al.	2003-04-17
Apparatus and method for controlling polishing of integrated circuit substrates Grant 6,102,776 - Boggs , et al. August 15, 2	2000-08-15
Optical device and formation of optical waveguide using light-induced effect on refractive index Grant 5,978,538 - Miura , et al. November 2, 1	1999-11-02

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.