Davis; Brennan V.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Davis; Brennan V..The latest application filed is for "soi die analysis of circuitry logic states via coupling through the insulator".
- Davis; Brennan V. - Austin TX
| Patent | Date |
|---|---|
| Optical analysis of integrated circuits Grant 7,019,511 - Birdsley , et al. March 28, 2 | 2006-03-28 |
| Indirect stimulation of an integrated circuit die Grant 6,870,379 - Davis , et al. March 22, 2 | 2005-03-22 |
| IC die analysis via back side lens Grant 6,864,972 - Birdsley , et al. March 8, 2 | 2005-03-08 |
| Semiconductor die analysis via fiber optic communication Grant 6,850,081 - Birdsley , et al. February 1, 2 | 2005-02-01 |
| Fiber optic semiconductor analysis arrangement and method therefor Grant 6,844,928 - Gilfeather , et al. January 18, 2 | 2005-01-18 |
| Substrate removal as a function of emitted photons at the back side of a semiconductor chip Grant 6,806,166 - Birdsley , et al. October 19, 2 | 2004-10-19 |
| Real-time photoemission detection system Grant 6,724,928 - Davis April 20, 2 | 2004-04-20 |
| Semiconductor analysis arrangement and method therefor Grant 6,700,659 - Chunduri , et al. March 2, 2 | 2004-03-02 |
| Defect detection in semiconductor devices Grant 6,686,757 - Ring , et al. February 3, 2 | 2004-02-03 |
| Semiconductor analysis arrangement and method therefor Grant 6,635,839 - Gilfeather , et al. October 21, 2 | 2003-10-21 |
| SOI die analysis of circuitry logic states via coupling through the insulator Grant 6,621,281 - Birdsley , et al. September 16, 2 | 2003-09-16 |
| IC die analysis via back side circuit construction with heat dissipation Grant 6,576,484 - Birdsley , et al. June 10, 2 | 2003-06-10 |
| Test fixture for future integration Grant 6,500,699 - Birdsley , et al. December 31, 2 | 2002-12-31 |
| Quadrant avalanche photodiode time-resolved detection Grant 6,483,327 - Bruce , et al. November 19, 2 | 2002-11-19 |
| Arrangement and method for using electron channeling patterns to detect substrate damage Grant 6,452,176 - Davis September 17, 2 | 2002-09-17 |
| Circuit access and analysis for a SOI flip-chip die Grant 6,448,095 - Birdsley , et al. September 10, 2 | 2002-09-10 |
| SOI die analysis of circuitry logic states via coupling through the insulator App 20020084792 - Birdsley, Jeffrey D. ; et al. | 2002-07-04 |
| Selective state change analysis of a SOI die Grant 6,414,335 - Goruganthu , et al. July 2, 2 | 2002-07-02 |
| Selectively activatable solar cells for integrated circuit analysis Grant 6,391,664 - Goruganthu , et al. May 21, 2 | 2002-05-21 |
| Integrated circuit defect detection via laser heat and IR thermography Grant 6,387,715 - Davis , et al. May 14, 2 | 2002-05-14 |
| Substrate removal as a functional of sonic analysis Grant 6,350,624 - Goruganthu , et al. February 26, 2 | 2002-02-26 |
| Substrate removal as a function of resistance at the back side of a semiconductor device Grant 6,303,396 - Ring , et al. October 16, 2 | 2001-10-16 |
| Substrate removal as a function of SIMS analysis Grant 6,281,025 - Ring , et al. August 28, 2 | 2001-08-28 |
| Led in substrate with back side monitoring Grant 6,248,600 - Bruce , et al. June 19, 2 | 2001-06-19 |
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