Davies-Venn; Emile
Patent Applications and Registrations
Patent applications and USPTO patent grants for Davies-Venn; Emile.The latest application filed is for "conductive coating for a microelectronics package".
- Davies-Venn; Emile - Gilbert AZ
- Davies-Venn; Emile - Phoenix AZ US
- Davies-Venn; Emile - Chandler AZ
| Patent | Date |
|---|---|
| Stiffener and package substrate for a semiconductor package Grant 11,295,998 - Christianson , et al. April 5, 2 | 2022-04-05 |
| Conductive coating for a microelectronics package Grant 10,910,314 - Weng , et al. February 2, 2 | 2021-02-02 |
| Conductive Coating For A Microelectronics Package App 20200118930 - Weng; Li-Sheng ; et al. | 2020-04-16 |
| Conductive coating for a microelectronics package Grant 10,510,667 - Weng , et al. Dec | 2019-12-17 |
| Stiffener And Package Substrate For A Semiconductor Package App 20190311963 - CHRISTIANSON; Stephen ; et al. | 2019-10-10 |
| Conductive Coating For A Microelectronics Package App 20180174972 - Weng; Li-Sheng ; et al. | 2018-06-21 |
| Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer Grant 9,520,350 - Teh , et al. December 13, 2 | 2016-12-13 |
| Bumpless Build-up Layer (bbul) Semiconductor Package With Ultra-thin Dielectric Layer App 20140264830 - Teh; Weng Hong ; et al. | 2014-09-18 |
| Package-based filtering and matching solutions Grant 8,804,366 - Kamgaing , et al. August 12, 2 | 2014-08-12 |
| Package-based Filtering And Matching Solutions App 20120092076 - Kamgaing; Telesphor ; et al. | 2012-04-19 |
| Package-based filtering and matching solutions Grant 8,111,521 - Kamgaing , et al. February 7, 2 | 2012-02-07 |
| Package embedded three dimensional balun Grant 7,626,472 - Davies-Venn , et al. December 1, 2 | 2009-12-01 |
| Package-based Filtering And Matching Solutions App 20090039986 - Kamgaing; Telesphor ; et al. | 2009-02-12 |
| Package embedded three dimensional balun App 20080238568 - Davies-venn; Emile ; et al. | 2008-10-02 |
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