Daves; Glenn G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Daves; Glenn G..The latest application filed is for "method for forming die assembly with heat spreader".

Company Profile

0.28.22

Daves; Glenn G. - Austin TX
Daves; Glenn G. - Fishkill NY US
Daves; Glenn G. - Beacon NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for assembling a semiconductor package Grant 9,461,009 - Higgins, III , et al. October 4, 2	2016-10-04
Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits Grant 9,142,502 - Gong , et al. September 22, 2	2015-09-22
Method for forming die assembly with heat spreader Grant 9,059,144 - Higgins, III , et al. June 16, 2	2015-06-16
Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits Grant 8,916,421 - Gong , et al. December 23, 2	2014-12-23
Multicore processor and method of use that adapts core functions based on workload execution Grant 8,645,673 - Bell, Jr. , et al. February 4, 2	2014-02-04
Semiconductor device packaging having substrate with pre-encapsulation through via formation Grant 8,597,983 - Gong , et al. December 3, 2	2013-12-03
Method For Forming Die Assembly With Heat Spreader App 20130221511 - Higgins, III; Leo M. ; et al.	2013-08-29
Semiconductor Device Packaging Having Substrate With Pre-encapsulation Through Via Formation App 20130127030 - Gong; Zhiwei ; et al.	2013-05-23
Semiconductor Device Packaging Having Pre-encapsulation Through Via Formation App 20130049218 - Gong; Zhiwei ; et al.	2013-02-28
Semiconductor Device Packaging Having Pre-encapsulation Through Via Formation Using Drop-in Signal Conduits App 20130049217 - Gong; Zhiwei ; et al.	2013-02-28
Semiconductor Device Packaging Having Pre-encapsulation Through Via Formation Using Lead Frames With Attached Signal Conduits App 20130049182 - Gong; Zhiwei ; et al.	2013-02-28
Multicore Processor and Method of Use That Adapts Core Functions Based on Workload Execution App 20130013903 - Bell, JR.; Robert H. ; et al.	2013-01-10
Multicore processor and method of use that adapts core functions based on workload execution Grant 8,327,126 - Bell, Jr. , et al. December 4, 2	2012-12-04
Solder interconnection array with optimal mechanical integrity Grant 7,900,809 - Daves , et al. March 8, 2	2011-03-08
Multicore Processor and Method of Use That Adapts Core Functions Based on Workload Execution App 20100049963 - Bell, JR.; Robert H. ; et al.	2010-02-25
Power grid structure to optimize performance of a multiple core processor Grant 7,667,470 - Audet , et al. February 23, 2	2010-02-23
Solder interconnection array with optimal mechanical integrity Grant 7,445,141 - Daves , et al. November 4, 2	2008-11-04
Solder Interconnection Array With Optimal Mechanical Integrity App 20080261350 - Daves; Glenn G. ; et al.	2008-10-23
Power Grid Structure to Optimize Performance of a Multiple Core Processor App 20080252308 - Audet; Jean ; et al.	2008-10-16
Power grid structure to optimize performance of a multiple core processor Grant 7,420,378 - Audet , et al. September 2, 2	2008-09-02
Power Grid Structure To Optimize Performance Of A Multiple Core Processor App 20080012583 - AUDET; JEAN ; et al.	2008-01-17
Apparatus and method for customized burn-in of cores on a multicore microprocessor integrated circuit chip Grant 7,268,570 - Audet , et al. September 11, 2	2007-09-11
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip Grant 7,239,516 - Long , et al. July 3, 2	2007-07-03
Fluidic cooling systems and methods for electronic components Grant 7,079,393 - Colgan , et al. July 18, 2	2006-07-18
Solder Interconnection Array With Optimal Mechanical Integrity App 20060060636 - Daves; Glenn G. ; et al.	2006-03-23
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip App 20060056156 - Long; David C. ; et al.	2006-03-16
Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules Grant 6,974,722 - Daves , et al. December 13, 2	2005-12-13
Method of manufacture of silicon based package Grant 6,878,608 - Brofman , et al. April 12, 2	2005-04-12
Jogging Structure For Wiring Translation Between Grids With Non-integral Pitch Ratios In Chip Carrier Modules App 20040188823 - Daves, Glenn G. ; et al.	2004-09-30
Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules Grant 6,762,489 - Daves , et al. July 13, 2	2004-07-13
Structure and method for wiring translation between grids with non-integral pitch ratios in chip carrier modules App 20030094687 - Daves, Glenn G. ; et al.	2003-05-22
Insulating interposer between two electronic components and process thereof Grant 6,541,365 - Edwards , et al. April 1, 2	2003-04-01
Method of manufacture of silicon based package and device manufactured thereby App 20020180013 - Brofman, Peter J. ; et al.	2002-12-05
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof Grant 6,444,496 - Edwards , et al. September 3, 2	2002-09-03
Insulating interposer between two electronic components and process thereof App 20020034888 - Edwards, David L. ; et al.	2002-03-21
Methods for customizing lid for improved thermal performance of modules using flip chips Grant 6,292,369 - Daves , et al. September 18, 2	2001-09-18
Thermal Paste Preforms As A Heat Transfer Media Between A Chip And A Heat Sink And Method Thereof App 20010021102 - EDWARDS, DAVID L ; et al.	2001-09-13
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof Grant 6,275,381 - Edwards , et al. August 14, 2	2001-08-14
Customizable lid for improved thermal performance of modules using flip chips Grant 6,091,603 - Daves , et al. July 18, 2	2000-07-18
High performance, low cost multi-chip modle package Grant 5,838,545 - Clocher , et al. November 17, 1	1998-11-17

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