loadpatents
Patent applications and USPTO patent grants for Daval; Nicolas.The latest application filed is for "method for manufacturing a substrate for a front-facing image sensor".
Patent | Date |
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Method For Manufacturing A Substrate For A Front-facing Image Sensor App 20220059603 - Schwarzenbach; Walter ;   et al. | 2022-02-24 |
Method For Fabricating A Strained Semiconductor-on-insulator Substrate App 20210225695 - Schwarzenbach; Walter ;   et al. | 2021-07-22 |
Method For Manufacturing A Cfet Device App 20210202326 - Schwarzenbach; Walter ;   et al. | 2021-07-01 |
Method for fabricating a strained semiconductor-on-insulator substrate Grant 10,957,577 - Schwarzenbach , et al. March 23, 2 | 2021-03-23 |
Method For Fabricating A Strained Semiconductor-on-insulator Substrate App 20200321243 - Schwarzenbach; Walter ;   et al. | 2020-10-08 |
Method for fabricating a strained semiconductor-on-insulator substrate Grant 10,672,646 - Schwarzenbach , et al. | 2020-06-02 |
Method For Fabricating A Strained Semiconductor-on-insulator Substrate App 20190181035 - Schwarzenbach; Walter ;   et al. | 2019-06-13 |
Method for transferring a layer from a single-crystal substrate Grant 9,768,057 - Ecarnot , et al. September 19, 2 | 2017-09-19 |
Method For Transferring A Layer From A Single-crystal Substrate App 20160351438 - Ecarnot; Ludovic ;   et al. | 2016-12-01 |
Wafer with intrinsic semiconductor layer Grant 9,177,961 - Daval , et al. November 3, 2 | 2015-11-03 |
Method for forming a Ge on III/V-on-insulator structure Grant 9,018,678 - Daval , et al. April 28, 2 | 2015-04-28 |
Etchant for controlled etching of Ge and Ge-rich silicon germanium alloys Grant 8,753,528 - Bedell , et al. June 17, 2 | 2014-06-17 |
Etchant For Controlled Etching Of Ge And Ge-rich Silicon Germanium Alloys App 20130146805 - Bedell; Stephen W. ;   et al. | 2013-06-13 |
Manufacture of thin silicon-on-insulator (SOI) structures Grant 8,367,521 - Daval , et al. February 5, 2 | 2013-02-05 |
Method For Forming A Ge On Iii/v-on-insulator Structure App 20120228672 - Daval; Nicolas ;   et al. | 2012-09-13 |
Wafer With Intrinsic Semiconductor Layer App 20120228689 - Daval; Nicolas ;   et al. | 2012-09-13 |
Method of reducing roughness of a thick insulating layer Grant 8,183,128 - Daval , et al. May 22, 2 | 2012-05-22 |
Etchant For Controlled Etching Of Ge And Ge-rich Silicon Germanium Alloys App 20120091100 - Bedell; Stephen W. ;   et al. | 2012-04-19 |
Process For Manufacturing A Structure Comprising A Germanium Layer On A Substrate App 20110183493 - Daval; Nicolas ;   et al. | 2011-07-28 |
Manufacture Of Thin Silicon-on-insulator (soi) Structures App 20110140230 - Daval; Nicolas ;   et al. | 2011-06-16 |
Method of manufacturing a silicon dioxide layer Grant 7,645,486 - Bourdelle , et al. January 12, 2 | 2010-01-12 |
Thermal oxidation of a SiGe layer and applications thereof Grant 7,531,427 - Daval May 12, 2 | 2009-05-12 |
Method Of Reducing Roughness Of A Thick Insulating Layer App 20090023267 - Daval; Nicolas ;   et al. | 2009-01-22 |
Method of manufacturing a semiconductor heterostructure Grant 7,459,374 - Aulnette , et al. December 2, 2 | 2008-12-02 |
Relaxation of layers Grant 7,452,792 - Daval , et al. November 18, 2 | 2008-11-18 |
Atomic implantation and thermal treatment of a semiconductor layer Grant 7,449,394 - Akatsu , et al. November 11, 2 | 2008-11-11 |
Method of reducing roughness of a thick insulating layer Grant 7,446,019 - Daval , et al. November 4, 2 | 2008-11-04 |
Method Of Manufacturing A Semiconductor Heterostructure App 20080132031 - Aulnette; Cecile ;   et al. | 2008-06-05 |
Thermal Oxidation Of A Sige Layer And Applications Thereof App 20070254440 - DAVAL; Nicolas | 2007-11-01 |
Methods for thermally treating a semiconductor layer Grant 7,285,495 - Daval , et al. October 23, 2 | 2007-10-23 |
Thermal treatment of a semiconductor layer Grant 7,282,449 - Daval , et al. October 16, 2 | 2007-10-16 |
Methods for forming a semiconductor structure Grant 7,276,428 - Daval , et al. October 2, 2 | 2007-10-02 |
Treatment of a removed layer of silicon-germanium Grant 7,232,737 - Daval June 19, 2 | 2007-06-19 |
Method Of Manufacturing A Silicon Dioxide Layer App 20070134887 - Bourdelle; Konstantin ;   et al. | 2007-06-14 |
Treating a SiGe layer for selective etching App 20070111474 - Delattre; Cecile ;   et al. | 2007-05-17 |
Relaxation of layers App 20070099399 - Daval; Nicolas ;   et al. | 2007-05-03 |
Method of reducing roughness of a thick insulating layer App 20070020947 - Daval; Nicolas ;   et al. | 2007-01-25 |
Schottky power diode with SiCOI substrate and process for making such diode Grant 7,166,894 - Templier , et al. January 23, 2 | 2007-01-23 |
Method of fabricating a structure with an oxide layer of a desired thickness on a Ge or SiGe substrate App 20060270244 - Daval; Nicolas ;   et al. | 2006-11-30 |
Treatment of a removed layer of silicon-germanium App 20060160328 - Daval; Nicolas | 2006-07-20 |
Indirect bonding with disappearance of bonding layer Grant 7,078,353 - Daval , et al. July 18, 2 | 2006-07-18 |
Thermal treament of a semiconductor layer App 20060141748 - Daval; Nicolas ;   et al. | 2006-06-29 |
Methods for transferring a thin layer from a wafer having a buffer layer Grant 6,991,956 - Ghyselen , et al. January 31, 2 | 2006-01-31 |
Thermal treatment of a semiconductor layer App 20060014363 - Daval; Nicolas ;   et al. | 2006-01-19 |
Atomic implantation and thermal treatment of a semiconductor layer App 20050245049 - Akatsu, Takeshi ;   et al. | 2005-11-03 |
Methods for forming a semiconductor structure App 20050196937 - Daval, Nicolas ;   et al. | 2005-09-08 |
Methods for thermally treating a semiconductor layer App 20050196936 - Daval, Nicolas ;   et al. | 2005-09-08 |
Methods for transferring a thin layer from a wafer having a buffer layer App 20050191825 - Ghyselen, Bruno ;   et al. | 2005-09-01 |
Schottky power diode comprising a sicoi substrate and the method of producing one such diode App 20050161760 - Templier, Francois ;   et al. | 2005-07-28 |
Indirect bonding with disappearance of bonding layer App 20050070078 - Daval, Nicolas ;   et al. | 2005-03-31 |
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