Datta; Devesh Kumar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Datta; Devesh Kumar.The latest application filed is for "integrated assemblies having barrier material between silicon-containing material and another material reactive with silicon".

Company Profile

1.4.6

Datta; Devesh Kumar - Singapore SG
DATTA; DEVESH KUMAR - WOODSVALE SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Assemblies Having Barrier Material Between Silicon-Containing Material and Another Material Reactive with Silicon App 20210091009 - Datta; Devesh Kumar ; et al.	2021-03-25
Conductive components and memory assemblies Grant 10,475,810 - Bandyopadhyay , et al. Nov	2019-11-12
Conductive Components and Memory Assemblies App 20180308861 - Bandyopadhyay; Sudip ; et al.	2018-10-25
Conductive components and memory assemblies Grant 10,014,319 - Bandyopadhyay , et al. July 3, 2	2018-07-03
Conductive components and memory assemblies Grant 9,773,807 - Bandyopadhyay , et al. September 26, 2	2017-09-26
Shallow Trench Isolation In Dynamic Random Access Memory And Manufacturing Method Thereof App 20130234280 - KUMAR; ARVIND ; et al.	2013-09-12
Method to improve transistor performance matching for plasma-assisted source/drain formation App 20110201185 - Datta; Devesh Kumar ; et al.	2011-08-18
Method for passivation of plasma etch defects in DRAM devices Grant 7,407,871 - Kumar , et al. August 5, 2	2008-08-05
Method for passivation of plasma etch defects in DRAM devices App 20080124814 - Kumar; Arvind ; et al.	2008-05-29

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