| Patent | Date |
|---|
Superconducting integrated circuit
Grant 10,658,424 - Oliver , et al. | 2020-05-19 |
Cryogenic electronic packages and assemblies
Grant 10,586,909 - Das , et al. | 2020-03-10 |
Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure
Grant 10,418,350 - Das , et al. Sept | 2019-09-17 |
Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
Grant 10,396,269 - Oliver , et al. A | 2019-08-27 |
Cryogenic electronic packages and methods for fabricating cryogenic electronic packages
Grant 10,381,541 - Das , et al. A | 2019-08-13 |
Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
Grant 10,242,968 - Das , et al. | 2019-03-26 |
Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structures
Grant 10,229,897 - Das | 2019-03-12 |
Shielded through via structures and methods for fabricating shielded through via structures
Grant 10,199,553 - Oliver , et al. Fe | 2019-02-05 |
Qubit and coupler circuit structures and coupling techniques
Grant 10,134,972 - Oliver , et al. November 20, 2 | 2018-11-20 |
Interconnect structures and methods for fabricating interconnect structures
Grant 10,121,754 - Oliver , et al. November 6, 2 | 2018-11-06 |
Interconnect structures for assembly of semiconductor structures including at least one integrated circuit structure
Grant 10,079,224 - Das , et al. September 18, 2 | 2018-09-18 |
Superconducting Integrated Circuit
App 20180247974 - Oliver; William D. ; et al. | 2018-08-30 |
Cryogenic Electronic Packages And Assemblies
App 20180102470 - Das; Rabindra N. ; et al. | 2018-04-12 |
Cryogenic Electronic Packages And Methods For Fabricating Cryogenic Electronic Packages
App 20180102469 - Das; Rabindra N. ; et al. | 2018-04-12 |
Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques
Grant 9,881,904 - Das , et al. January 30, 2 | 2018-01-30 |
Qubit and Coupler Circuit Structures and Coupling Techniques
App 20180013052 - Oliver; William D. ; et al. | 2018-01-11 |
Interconnect Structures For Assembly Of Semiconductor Structures Including Superconducting Integrated Circuits
App 20180012932 - Oliver; William D. ; et al. | 2018-01-11 |
Interconnect Structures And Semiconductor Structures For Assembly Of Cryogenic Electronic Packages
App 20170373044 - Das; Rabindra N. ; et al. | 2017-12-28 |
Interconnect structures for assembly of multi-layer semiconductor devices
Grant 9,812,429 - Das , et al. November 7, 2 | 2017-11-07 |
Interconnect structures for fine pitch assembly of semiconductor structures and related techniques
Grant 9,786,633 - Das , et al. October 10, 2 | 2017-10-10 |
Interconnect structures for assembly of multi-layer semiconductor devices
Grant 9,780,075 - Das , et al. October 3, 2 | 2017-10-03 |
Method of making a circuitized substrate
Grant 9,756,724 - Das , et al. September 5, 2 | 2017-09-05 |
Interconnect Structures for Assembly of Multi-Layer Semiconductor Devices
App 20170200700 - Das; Rabindra N. ; et al. | 2017-07-13 |
Multi-Layer Semiconductor Structure and Methods for Fabricating Multi-Layer Semiconductor Structures
App 20170194248 - Das; Rabindra N. | 2017-07-06 |
Semiconductor Structures For Assembly In Multi-Layer Semiconductor Devices Including At Least One Semiconductor Structure
App 20170162507 - Das; Rabindra N. ; et al. | 2017-06-08 |
Interconnect Structures For Assembly Of Semiconductor Structures Including At Least One Integrated Circuit Structure
App 20170162550 - Das; Rabindra N. ; et al. | 2017-06-08 |
Interconnect Structures And Methods For Fabricating Interconnect Structures
App 20170133336 - Oliver; William D. ; et al. | 2017-05-11 |
Interconnect Structures For Fine Pitch Assembly Of Semiconductor Structures
App 20170098627 - Das; Rabindra N. ; et al. | 2017-04-06 |
Interconnect Structures for Assembly of Multi-Layer Semiconductor Devices
App 20170092621 - DAS; Rabindra N. ; et al. | 2017-03-30 |
Multi-Layer Semiconductor Devices Fabricated Using a Combination of Substrate and Via Structures and Fabrication Techniques
App 20170040296 - Das; Rabindra N. ; et al. | 2017-02-09 |
Electrically conductive adhesive (ECA) for multilayer device interconnects
Grant 9,451,693 - Das , et al. September 20, 2 | 2016-09-20 |
Method of making a circuitized substrate
Grant 9,420,689 - Das , et al. August 16, 2 | 2016-08-16 |
Coreless layer buildup structure with LGA and joining layer
Grant 9,351,408 - Markovich , et al. May 24, 2 | 2016-05-24 |
Conducting paste for device level interconnects
Grant 8,685,284 - Das , et al. April 1, 2 | 2014-04-01 |
Substrate having internal capacitor and method of making same
Grant 8,607,445 - Das , et al. December 17, 2 | 2013-12-17 |
Solder and electrically conductive adhesive based interconnection for CZT crystal attach
Grant 8,592,299 - Markovich , et al. November 26, 2 | 2013-11-26 |
Electronic package with thermal interposer and method of making same
Grant 8,558,374 - Markovich , et al. October 15, 2 | 2013-10-15 |
Coreless layer buildup structure
Grant 8,541,687 - Markovich , et al. September 24, 2 | 2013-09-24 |
Coreless layer buildup structure with LGA
Grant 8,536,459 - Markovich , et al. September 17, 2 | 2013-09-17 |
Method of forming an electrically conductive printed line
Grant 8,499,445 - Das , et al. August 6, 2 | 2013-08-06 |
Method of forming multilayer capacitors in a printed circuit substrate
Grant 8,501,575 - Das , et al. August 6, 2 | 2013-08-06 |
Circuitized substrate with low loss capacitive material and method of making same
Grant 8,446,707 - Das , et al. May 21, 2 | 2013-05-21 |
Electrically Conductive Adhesive (eca) For Multilayer Device Interconnects
App 20130033827 - Das; Rabindra N. ; et al. | 2013-02-07 |
Circuitized substrate with dielectric interposer assembly and method
Grant 8,299,371 - Das , et al. October 30, 2 | 2012-10-30 |
Anti-tamper microchip package based on thermal nanofluids or fluids
Grant 8,288,857 - Das , et al. October 16, 2 | 2012-10-16 |
Conductive Metal Micro-pillars For Enhanced Electrical Interconnection
App 20120257343 - Das; Rabindra N. ; et al. | 2012-10-11 |
Conductive Metal Nub For Enhanced Electrical Interconnection, And Information Handling System Utilizing Same
App 20120243155 - Matienzo; Luis J. ; et al. | 2012-09-27 |
Circuitized Substrate With Internal Thin Film Capacitor And Method Of Making Same
App 20120228014 - Das; Rabindra N. ; et al. | 2012-09-13 |
Method Of Forming Multilayer Capacitors In A Printed Circuit Substrate
App 20120223047 - Das; Rabindra N. ; et al. | 2012-09-06 |
Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
Grant 8,247,703 - Das , et al. August 21, 2 | 2012-08-21 |
Method of joining a semiconductor device/chip to a printed wiring board
Grant 8,240,031 - Markovich , et al. August 14, 2 | 2012-08-14 |
Electronic Package With Thermal Interposer And Method Of Making Same
App 20120201006 - Markovich; Voya R. ; et al. | 2012-08-09 |
Coreless Layer Buildup Structure With Lga
App 20120160544 - Antesberger; Timothy ; et al. | 2012-06-28 |
Coreless Layer Buildup Structure
App 20120160547 - Antesberger; Timothy ; et al. | 2012-06-28 |
Electronic Package And Method Of Making Same
App 20120162928 - Das; Rabindra N. ; et al. | 2012-06-28 |
Circuitized Substrate With Dielectric Interposer Assembly And Method
App 20120152605 - Das; Rabindra N. ; et al. | 2012-06-21 |
Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
Grant 8,143,530 - Das , et al. March 27, 2 | 2012-03-27 |
Multi-layer embedded capacitance and resistance substrate core
Grant 8,144,480 - Das , et al. March 27, 2 | 2012-03-27 |
Conducting Paste For Device Level Interconnects
App 20120069531 - Das; Rabindra N. ; et al. | 2012-03-22 |
Anti-tamper Microchip Package Based On Thermal Nanofluids Or Fluids
App 20120068326 - Das; Rabindra N. ; et al. | 2012-03-22 |
Coreless Layer Buildup Structure With Lga And Joining Layer
App 20120031649 - Antesberger; Timothy ; et al. | 2012-02-09 |
Circuitized Substrate With Conductive Paste, Electrical Assembly Including Said Circuitized Substrate And Method Of Making Said Substrate
App 20120017437 - Das; Rabindra N. ; et al. | 2012-01-26 |
High Density Decal And Method For Attaching Same
App 20120015532 - Markovich; Voya R. ; et al. | 2012-01-19 |
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
Grant 8,063,315 - Das , et al. November 22, 2 | 2011-11-22 |
Capacitive substrate
Grant 7,897,877 - Das , et al. March 1, 2 | 2011-03-01 |
Method Of Making Circuitized Substrate With Resistor Including Material With Metal Component And Electrical Assembly And Information Handling System Utilizing Said Circuitized Substrate
App 20110043987 - Das; Rabindra N. ; et al. | 2011-02-24 |
Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
App 20110039212 - Das; Rabindra N. ; et al. | 2011-02-17 |
Method of making circuitized substrate with a resistor
Grant 7,870,664 - Das , et al. January 18, 2 | 2011-01-18 |
Capacitive substrate and method of making same
Grant 7,803,688 - Das , et al. September 28, 2 | 2010-09-28 |
Multi-layer embedded capacitance and resistance substrate core
Grant 7,791,897 - Das , et al. September 7, 2 | 2010-09-07 |
Multi-layer Embedded Capacitance And Resistance Substrate Core
App 20100167210 - Das; Rabindra N. ; et al. | 2010-07-01 |
Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
Grant 7,687,724 - Das , et al. March 30, 2 | 2010-03-30 |
Mulit-layer embedded capacitance and resistance substrate core
App 20100060381 - Das; Rabindra N. ; et al. | 2010-03-11 |
Capacitive substrate and method of making same
App 20090206051 - Das; Rabindra N. ; et al. | 2009-08-20 |
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
Grant 7,541,265 - Das , et al. June 2, 2 | 2009-06-02 |
Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
Grant 7,449,381 - Das , et al. November 11, 2 | 2008-11-11 |
Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate
Grant 7,442,879 - Das , et al. October 28, 2 | 2008-10-28 |
Method of making a circuitized substrate having at least one capacitor therein
App 20080248596 - Das; Rabindra N. ; et al. | 2008-10-09 |
Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
Grant 7,429,510 - Das , et al. September 30, 2 | 2008-09-30 |
Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
App 20080151515 - Das; Rabindra N. ; et al. | 2008-06-26 |
Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate
Grant 7,384,856 - Das , et al. June 10, 2 | 2008-06-10 |
Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
App 20080087459 - Das; Rabindra N. ; et al. | 2008-04-17 |
Capacitive substrate and method of making same
App 20070275525 - Das; Rabindra N. ; et al. | 2007-11-29 |
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
App 20070221404 - Das; Rabindra N. ; et al. | 2007-09-27 |
Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate
App 20070177331 - Das; Rabindra N. ; et al. | 2007-08-02 |
Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate
Grant 7,235,745 - Das , et al. June 26, 2 | 2007-06-26 |
Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
App 20070010065 - Das; Rabindra N. ; et al. | 2007-01-11 |
Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate
App 20070007033 - Das; Rabindra N. ; et al. | 2007-01-11 |
Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
App 20070010064 - Das; Rabindra N. ; et al. | 2007-01-11 |
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
App 20060151863 - Das; Rabindra N. ; et al. | 2006-07-13 |
Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate
App 20060151202 - Das; Rabindra N. ; et al. | 2006-07-13 |
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
App 20060154501 - Das; Rabindra N. ; et al. | 2006-07-13 |
Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate
App 20060154434 - Das; Rabindra N. ; et al. | 2006-07-13 |
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
Grant 7,025,607 - Das , et al. April 11, 2 | 2006-04-11 |
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