Darveaux; Robert F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Darveaux; Robert F..The latest application filed is for "methods and structures for increasing the allowable die size in tmv packages".

Company Profile

1.26.3

Darveaux; Robert F. - Gilbert AZ
Darveaux; Robert F. - Higley AZ
Darveaux; Robert F. - Coral Springs FL
Darveaux; Robert F. - Raleigh NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods And Structures For Increasing The Allowable Die Size In Tmv Packages App 20210166992 - Nicholls; Louis W. ; et al.	2021-06-03
Semiconductor devices and methods of making semiconductor devices Grant 10,714,408 - Nicholls , et al.	2020-07-14
Methods And Structures For Increasing The Allowable Die Size In Tmv Packages App 20190371706 - Nicholls; Louis W. ; et al.	2019-12-05
Methods and structures for increasing the allowable die size in TMV packages Grant 10,347,562 - Nicholls , et al. July 9, 2	2019-07-09
Methods and structures for increasing the allowable die size in TMV packages Grant 9,721,872 - Nicholls , et al. August 1, 2	2017-08-01
Metal etch stop fabrication method and structure Grant 8,383,950 - Huemoeller , et al. February 26, 2	2013-02-26
Bend test method and apparatus for flip chip devices Grant 8,365,611 - Darveaux , et al. February 5, 2	2013-02-05
Shielding for a semiconductor package Grant 8,129,824 - St. Amand , et al. March 6, 2	2012-03-06
Thin substrate fabrication method and structure Grant 8,017,436 - Huemoeller , et al. September 13, 2	2011-09-13
Metal etch stop fabrication method and structure Grant 7,923,645 - Huemoeller , et al. April 12, 2	2011-04-12
Direct glass attached on die optical module Grant 7,911,017 - de Guzman , et al. March 22, 2	2011-03-22
Direct glass attached on die optical module Grant 7,576,401 - de Guzman , et al. August 18, 2	2009-08-18
Integrated circuit device packages and substrates for making the packages Grant 7,253,503 - Fusaro , et al. August 7, 2	2007-08-07
Thin integrated circuit device packages for improved radio frequency performance App 20070176287 - Crowley; Sean T. ; et al.	2007-08-02
Embedded heat spreader ball grid array Grant 7,126,218 - Darveaux , et al. October 24, 2	2006-10-24
Integrated circuit device packages and substrates for making the packages Grant 6,833,609 - Fusaro , et al. December 21, 2	2004-12-21
Integrated circuit device packages and substrates for making the packages Grant 6,580,159 - Fusaro , et al. June 17, 2	2003-06-17
Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages Grant 6,331,451 - Fusaro , et al. December 18, 2	2001-12-18
Making solder ball mounting pads on substrates Grant 6,201,305 - Darveaux , et al. March 13, 2	2001-03-13
Carrier strip and molded flex circuit ball grid array and method of making Grant 6,124,637 - Freyman , et al. September 26, 2	2000-09-26
Carrier strip and molded flex circuit ball grid array Grant 5,859,475 - Freyman , et al. January 12, 1	1999-01-12
Discrete transitor assembly Grant 5,552,636 - Darveaux September 3, 1	1996-09-03
Leaded semiconductor package having temperature controlled lead length Grant 5,455,446 - Suppelsa , et al. October 3, 1	1995-10-03
High performance integrated circuit chip package Grant 5,325,265 - Turlik , et al. June 28, 1	1994-06-28
Vacuum infiltration of underfill material for flip-chip devices Grant 5,203,076 - Banerji , et al. April 20, 1	1993-04-20
Controlled solder oxidation process Grant 5,152,451 - Darveaux , et al. October 6, 1	1992-10-06

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