| Patent | Date |
|---|
Embedded Bridge Architecture With Thinned Surface
App 20220310518 - CHEN; Haobo ; et al. | 2022-09-29 |
Thin film barrier seed metallization in magnetic-plugged through hole inductor
Grant 11,443,885 - Darmawikarta , et al. September 13, 2 | 2022-09-13 |
Coreless Electronic Substrates Having Embedded Inductors
App 20220285079 - Pietambaram; Srinivas ; et al. | 2022-09-08 |
Nested Interposer With Through-silicon Via Bridge Die
App 20220278032 - PIETAMBARAM; Srinivas V. ; et al. | 2022-09-01 |
Microelectronic device with embedded die substrate on interposer
Grant 11,430,740 - May , et al. August 30, 2 | 2022-08-30 |
Substrate Embedded Magnetic Core Inductors And Method Of Making
App 20220254559 - Pietambaram; Srinivas Venkata Ramanuja ; et al. | 2022-08-11 |
In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages
Grant 11,404,389 - Ecton , et al. August 2, 2 | 2022-08-02 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20220230965 - MAY; Robert Alan ; et al. | 2022-07-21 |
Multi-chip package with high density interconnects
Grant 11,393,766 - Aleksov , et al. July 19, 2 | 2022-07-19 |
Lithographic Cavity Formation To Enable Emib Bump Pitch Scaling
App 20220223527 - DARMAWIKARTA; Kristof ; et al. | 2022-07-14 |
High-permeability magnetic-dielectric film-based inductors
Grant 11,380,472 - Pietambaram , et al. July 5, 2 | 2022-07-05 |
Electromigration Resistant And Profile Consistent Contact Arrays
App 20220199515 - PIETAMBARAM; Srinivas V. ; et al. | 2022-06-23 |
Apparatus With Embedded Fine Line Space In A Cavity, And A Method For Forming The Same
App 20220183157 - Darmawikarta; Kristof ; et al. | 2022-06-09 |
Substrate embedded magnetic core inductors and method of making
Grant 11,348,718 - Pietambaram , et al. May 31, 2 | 2022-05-31 |
High Bandwidth Optical Interconnection Architectures
App 20220155539 - PIETAMBARAM; Srinivas V. ; et al. | 2022-05-19 |
Lithographic cavity formation to enable EMIB bump pitch scaling
Grant 11,322,444 - Darmawikarta , et al. May 3, 2 | 2022-05-03 |
Sacrificial Dielectric For Lithographic Via Formation To Enable Via Scaling In High Density Interconnect Packaging
App 20220122935 - Darmawikarta; Kristof ; et al. | 2022-04-21 |
Electromigration resistant and profile consistent contact arrays
Grant 11,309,239 - Pietambaram , et al. April 19, 2 | 2022-04-19 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20220108957 - MAY; Robert Alan ; et al. | 2022-04-07 |
Electroless Metal-defined Thin Pad First Level Interconnects For Lithographically Defined Vias
App 20220084927 - Aleksov; Aleksandar ; et al. | 2022-03-17 |
In-package Rf Waveguides As High Bandwidth Chip-to-chip Interconnects And Methods For Using The Same
App 20220084965 - ALEKSOV; Aleksandar ; et al. | 2022-03-17 |
Radio Frequency Antennas And Waveguides For Communication Between Integrated Circuit Devices
App 20220084962 - Aleksov; Aleksandar ; et al. | 2022-03-17 |
Apparatus with embedded fine line space in a cavity, and a method for forming the same
Grant 11,272,619 - Darmawikarta , et al. March 8, 2 | 2022-03-08 |
Polarization defined zero misalignment vias for semiconductor packaging
Grant 11,264,239 - Tanaka , et al. March 1, 2 | 2022-03-01 |
Dual-damascene zero-misalignment-via process for semiconductor packaging
Grant 11,264,307 - Aleksov , et al. March 1, 2 | 2022-03-01 |
Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging
Grant 11,264,346 - Darmawikarta , et al. March 1, 2 | 2022-03-01 |
Electroless metal-defined thin pad first level interconnects for lithographically defined vias
Grant 11,257,745 - Aleksov , et al. February 22, 2 | 2022-02-22 |
Inorganic-based Embedded-die Layers For Modular Semiconductive Devices
App 20220028788 - PIETAMBARAM; Srinivas V. ; et al. | 2022-01-27 |
Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures
Grant 11,227,849 - Marin , et al. January 18, 2 | 2022-01-18 |
In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same
Grant 11,211,345 - Aleksov , et al. December 28, 2 | 2021-12-28 |
Panel Level Packaging For Multi-die Products Interconnected With Very High Density (vhd) Interconnect Layers
App 20210343653 - PIETAMBARAM; Srinivas V. ; et al. | 2021-11-04 |
Inorganic-based embedded-die layers for modular semiconductive devices
Grant 11,164,818 - Pietambaram , et al. November 2, 2 | 2021-11-02 |
Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
App 20210320066 - MAY; Robert Alan ; et al. | 2021-10-14 |
An Apparatus With Embedded Fine Line Space In A Cavity, And A Method For Forming The Same
App 20210307172 - Darmawikarta; Kristof ; et al. | 2021-09-30 |
Fabricating An Rf Filter On A Semiconductor Package Using Selective Seeding
App 20210305668 - MARIN; Brandon C. ; et al. | 2021-09-30 |
Device And Method Of Very High Density Routing Used With Embedded Multi-die Interconnect Bridge
App 20210280517 - May; Robert Alan ; et al. | 2021-09-09 |
Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers
Grant 11,101,222 - Pietambaram , et al. August 24, 2 | 2021-08-24 |
Fabricating an RF filter on a semiconductor package using selective seeding
Grant 11,081,768 - Marin , et al. August 3, 2 | 2021-08-03 |
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
Grant 11,069,620 - May , et al. July 20, 2 | 2021-07-20 |
Package Architecture Utilizing Photoimageable Dielectric (pid) For Reduced Bump Pitch
App 20210134727 - May; Robert A. ; et al. | 2021-05-06 |
A Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
App 20210134723 - MAY; Robert Alan ; et al. | 2021-05-06 |
Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate
Grant 10,978,399 - Darmawikarta , et al. April 13, 2 | 2021-04-13 |
Electroless-catalyst Doped-mold Materials For Integrated-circuit Die Packaging Architectures
App 20210091030 - Marin; Brandon C. ; et al. | 2021-03-25 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates
Grant 10,937,594 - Sounart , et al. March 2, 2 | 2021-03-02 |
Electromigration Resistant And Profile Consistent Contact Arrays
App 20210035901 - PIETAMBARAM; Srinivas V. ; et al. | 2021-02-04 |
Lithographically Defined Vertical Interconnect Access (via) For A Bridge Die First Level Interconnect (fli)
App 20200411441 - DARMAWIKARTA; Kristof ; et al. | 2020-12-31 |
Embedded Thin Film Capacitor With Nanocube Film And Process For Forming Such
App 20200402720 - MARIN; Brandon C. ; et al. | 2020-12-24 |
Electronic assembly that includes void free holes
Grant 10,856,424 - Boyapati , et al. December 1, 2 | 2020-12-01 |
Electromigration resistant and profile consistent contact arrays
Grant 10,854,541 - Pietambaram , et al. December 1, 2 | 2020-12-01 |
Fabricating An Rf Filter On A Semiconductor Package Using Selective Seeding
App 20200373261 - MARIN; Brandon C. ; et al. | 2020-11-26 |
Etch Barrier For Microelectronic Packaging Conductive Structures
App 20200365534 - DARMAWIKARTA; KRISTOF ; et al. | 2020-11-19 |
Method To Form High Capacitance Thin Film Capacitors (tfcs) As Embedded Passives In Organic Substrate Packages
App 20200343049 - PAITAL; Sameer ; et al. | 2020-10-29 |
Method For Forming Embedded Grounding Planes On Interconnect Layers
App 20200328131 - MARIN; Brandon C. ; et al. | 2020-10-15 |
Multi-chip Package With High Density Interconnects
App 20200321281 - Aleksov; Aleksandar ; et al. | 2020-10-08 |
Inorganic-based Embedded-die Layers For Modular Semiconductive Devices
App 20200312767 - Pietambaram; Srinivas V. ; et al. | 2020-10-01 |
Patternable Die Attach Materials And Processes For Patterning
App 20200312771 - NIE; Bai ; et al. | 2020-10-01 |
Patch Accomodating Embedded Dies Having Different Thicknesses
App 20200266184 - PIETAMBARAM; Srinivas ; et al. | 2020-08-20 |
Electroless Metal-defined Thin Pad First Level Interconnects For Lithographically Defined Vias
App 20200258827 - A1 | 2020-08-13 |
Multi-die microelectronic device with integral heat spreader
Grant 10,741,534 - Aleksov , et al. A | 2020-08-11 |
Multi-chip package with high density interconnects
Grant 10,727,185 - Aleksov , et al. | 2020-07-28 |
Integrated magnetic inductors for embedded-multi-die interconnect bridge substrates
Grant 10,714,434 - Pietambaram , et al. | 2020-07-14 |
Substrate integrated waveguide
Grant 10,705,293 - May , et al. | 2020-07-07 |
Integrated Magnetic Inductors For Embedded-multi-die Interconnect Bridge Substrates
App 20200211985 - Pietambaram; Srinivas V. ; et al. | 2020-07-02 |
Inorganic interposer for multi-chip packaging
Grant 10,692,847 - Sobieski , et al. | 2020-06-23 |
Substrate Embedded Heat Pipe
App 20200176355 - May; Robert A. ; et al. | 2020-06-04 |
In-package Rf Waveguides As High Bandwidth Chip-to-chip Interconnects And Methods For Using The Same
App 20200118951 - ALEKSOV; Aleksandar ; et al. | 2020-04-16 |
Dielectric For High Density Substrate Interconnects
App 20200118917 - MAY; Robert A. ; et al. | 2020-04-16 |
Multi-die Microelectronic Device With Integral Heat Spreader
App 20200105731 - Aleksov; Aleksandar ; et al. | 2020-04-02 |
In-situ Component Fabrication Of A Highly Efficient, High Inductance Air Core Inductor Integrated Into Substrate Packages
App 20200105685 - ECTON; Jeremy ; et al. | 2020-04-02 |
High-permeability Magnetic-dielectric Film-based Inductors
App 20200098503 - Pietambaram; Srinivas V. ; et al. | 2020-03-26 |
Die Interconnect Substrate, an Electrical Device, and a Method for Forming a Die Interconnect Substrate
App 20200051915 - Darmawikarta; Kristof ; et al. | 2020-02-13 |
Microelectronic Devices Designed With Ultra-high-k Dielectric Capacitors Integrated With Package Substrates
App 20200051743 - SOUNART; Thomas L. ; et al. | 2020-02-13 |
Systems and methods for semiconductor packages using photoimageable layers
Grant 10,553,453 - Chavali , et al. Fe | 2020-02-04 |
Structures Within A Substrate Layer To Cure Magnetic Paste
App 20200005990 - PAITAL; Sameer ; et al. | 2020-01-02 |
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
App 20200006258 - ALEKSOV; Aleksandar ; et al. | 2020-01-02 |
Substrate Embedded Magnetic Core Inductors And Method Of Making
App 20200005987 - Pietambaram; Srinivas ; et al. | 2020-01-02 |
Electromigration Resistant And Profile Consistent Contact Arrays
App 20190393145 - Pietambaram; Srinivas V. ; et al. | 2019-12-26 |
Polarization Defined Zero Misalignment Vias For Semiconductor Packaging
App 20190363059 - TANAKA; Hiroki ; et al. | 2019-11-28 |
Dual-damascene Zero-misalignment-via Process For Semiconductor Packaging
App 20190355647 - ALEKSOV; Aleksandar ; et al. | 2019-11-21 |
Via architecture for increased density interface
Grant 10,475,736 - Aleksov , et al. Nov | 2019-11-12 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20190341351 - May; Robert Alan ; et al. | 2019-11-07 |
Polarization defined zero misalignment vias for semiconductor packaging
Grant 10,453,812 - Tanaka , et al. Oc | 2019-10-22 |
Systems And Methods For Semiconductor Packages Using Photoimageable Layers
App 20190311916 - CHAVALI; Sri Chaitra ; et al. | 2019-10-10 |
Electromigration resistant and profile consistent contact arrays
Grant 10,431,537 - Pietambaram , et al. O | 2019-10-01 |
Lithographic Cavity Formation To Enable Emib Bump Pitch Scaling
App 20190295951 - DARMAWIKARTA; Kristof ; et al. | 2019-09-26 |
Thin Film Barrier Seed Matallization In Magnetic-plugged Through Hole Inductor
App 20190279806 - DARMAWIKARTA; Kristof ; et al. | 2019-09-12 |
Dual-damascene zero-misalignment-via process for semiconductor packaging
Grant 10,403,564 - Aleksov , et al. Sep | 2019-09-03 |
Substrate Integrated Waveguide
App 20190250326 - May; Robert Alan ; et al. | 2019-08-15 |
Aluminum oxide for thermal management or adhesion
Grant 10,361,121 - Darmawikarta , et al. | 2019-07-23 |
Thin Film Passive Devices Integrated In A Package Substrate
App 20190206786 - ALEKSOV; Aleksandar ; et al. | 2019-07-04 |
Sacrificial Dielectric For Lithographic Via Formation To Enable Via Scaling In High Density Interconnect Packaging
App 20190206823 - Darmawikarta; Kristof ; et al. | 2019-07-04 |
Substrate With Variable Height Conductive And Dielectric Elements
App 20190206781 - ALEKSOV; Aleksandar ; et al. | 2019-07-04 |
Dual-damascene Zero-misalignment-via Process For Semiconductor Packaging
App 20190206767 - ALEKSOV; Aleksandar ; et al. | 2019-07-04 |
Multi-chip Package With High Density Interconnects
App 20190198447 - Aleksov; Aleksandar ; et al. | 2019-06-27 |
Polarization Defined Zero Misalignment Vias For Semiconductor Packaging
App 20190198467 - Tanaka; Hiroki ; et al. | 2019-06-27 |
Panel Level Packaging For Multi-die Products Interconnected With Very High Density (vhd) Interconnect Layers
App 20190189563 - PIETAMBARAM; Srinivas V. ; et al. | 2019-06-20 |
Package Substrate Integrated Devices
App 20190169020 - ALEKSOV; Aleksandar ; et al. | 2019-06-06 |
Via Architecture For Increased Density Interface
App 20190096798 - Aleksov; Aleksandar ; et al. | 2019-03-28 |
Package Integrated Passives
App 20190006457 - Aleksov; Aleksandar ; et al. | 2019-01-03 |
Package substrate first-level-interconnect architecture
Grant 10,121,679 - Aleksov , et al. November 6, 2 | 2018-11-06 |
Electronic Assembly That Includes Void Free Holes
App 20180288885 - Boyapati; Sri Ranga Sai ; et al. | 2018-10-04 |
Inorganic Interposer For Multi-chip Packaging
App 20180240788 - Sobieski; Daniel ; et al. | 2018-08-23 |
Package with passivated interconnects
Grant 10,043,740 - Boyapati , et al. August 7, 2 | 2018-08-07 |
Metal protected fan-out cavity
Grant 9,953,959 - Darmawikarta , et al. April 24, 2 | 2018-04-24 |
Package With Passivated Interconnects
App 20180019197 - BOYAPATI; SRI RANGA SAI ; et al. | 2018-01-18 |
Aluminum Oxide For Thermal Management Or Adhesion
App 20170330795 - Darmawikarta; Kristof ; et al. | 2017-11-16 |
Plasma etching of solder resist openings
Grant 9,820,386 - Darmawikarta , et al. November 14, 2 | 2017-11-14 |
Electronic Package And Method Forming An Electrical Package
App 20170318669 - Darmawikarta; Kristof ; et al. | 2017-11-02 |
Plasma Etching Of Solder Resist Openings
App 20170273187 - Darmawikarta; Kristof ; et al. | 2017-09-21 |
Electronic Package And Method Forming An Electrical Package
App 20170064821 - Darmawikarta; Kristof ; et al. | 2017-03-02 |
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