Darbha; Krishna
Patent Applications and Registrations
Patent applications and USPTO patent grants for Darbha; Krishna.The latest application filed is for "graphic formation via material ablation".
- Darbha; Krishna - Redmond WA
- Darbha; Krishna - Seattle WA
- Darbha; Krishna - Johnson City NY
- Darbha; Krishna - Bothell WA
- Darbha, Krishna - Kirkland WA
| Patent | Date |
|---|---|
| Graphic formation via material ablation Grant 9,661,770 - McCormack , et al. May 23, 2 | 2017-05-23 |
| Graphic Formation via Material Ablation App 20160143170 - McCormack; Mark Thomas ; et al. | 2016-05-19 |
| Graphic Formation via Material Ablation App 20140248506 - McCormack; Mark Thomas ; et al. | 2014-09-04 |
| Multi-mode optical navigation Grant 8,253,688 - Bohn , et al. August 28, 2 | 2012-08-28 |
| Reduced impact keyboard with cushioned keys Grant 8,132,976 - Odell , et al. March 13, 2 | 2012-03-13 |
| Multi-Mode Optical Navigation App 20100271306 - Bohn; David ; et al. | 2010-10-28 |
| Flexible circuit connection Grant 7,796,883 - Darbha , et al. September 14, 2 | 2010-09-14 |
| Multi-mode optical navigation Grant 7,777,722 - Bohn , et al. August 17, 2 | 2010-08-17 |
| Method to accommodate increase in volume expansion during solder reflow Grant 7,703,199 - Caletka , et al. April 27, 2 | 2010-04-27 |
| Reduced Impact Keyboard With Cushioned Keys App 20090148219 - Odell; Dan ; et al. | 2009-06-11 |
| Force measuring systems for digital pens and other products Grant 7,454,977 - Larsen , et al. November 25, 2 | 2008-11-25 |
| Flexible circuit connection App 20080247747 - Darbha; Krishna ; et al. | 2008-10-09 |
| Multi-mode Optical Navigation App 20070296699 - Bohn; David ; et al. | 2007-12-27 |
| Electronic packaging for optical emitters and sensors Grant 7,233,025 - Davuluri , et al. June 19, 2 | 2007-06-19 |
| Electronic packaging for optical emitters and sensors App 20070102777 - Davuluri; Pavan ; et al. | 2007-05-10 |
| Structure to accommodate increase in volume expansion during solder reflow App 20060208030 - Caletka; David Vincent ; et al. | 2006-09-21 |
| Force measuring systems for digital pens and other products App 20060181525 - Larsen; Glen C. ; et al. | 2006-08-17 |
| Method of accommodating in volume expansion during solder reflow Grant 7,086,147 - Caletka , et al. August 8, 2 | 2006-08-08 |
| Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers Grant 6,989,607 - Darbha , et al. January 24, 2 | 2006-01-24 |
| Land grid array stiffener for use with flexible chip carriers Grant 6,905,961 - Caletka , et al. June 14, 2 | 2005-06-14 |
| Structure to accommodate increase in volume expansion during solder reflow App 20040183094 - Caletka, David Vincent ; et al. | 2004-09-23 |
| Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers App 20040021205 - Darbha, Krishna ; et al. | 2004-02-05 |
| Structure to accommodate increase in volume expansion during solder reflow Grant 6,686,664 - Caletka , et al. February 3, 2 | 2004-02-03 |
| Negative volume expansion lead-free electrical connection Grant 6,649,833 - Caletka , et al. November 18, 2 | 2003-11-18 |
| Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries Grant 6,639,302 - Darbha , et al. October 28, 2 | 2003-10-28 |
| Electronic package with thermally conductive standoff Grant 6,631,078 - Alcoe , et al. October 7, 2 | 2003-10-07 |
| Stress Reduction In Flip-chip Pbga Packaging By Utilizing Segmented Chip Carriers App 20030178649 - Darbha, Krishna ; et al. | 2003-09-25 |
| Heat sink structure with pyramidic and base-plate cut-outs Grant 6,622,786 - Calmidi , et al. September 23, 2 | 2003-09-23 |
| Electronic Package With Thermally Conductive Standoff App 20030129863 - Alcoe, David J. ; et al. | 2003-07-10 |
| Land grid array stiffener for use with flexible chip carriers App 20030090000 - Caletka, David Vincent ; et al. | 2003-05-15 |
| Land grid array stiffener use with flexible chip carriers App 20020180061 - Caletka, David Vincent ; et al. | 2002-12-05 |
| Structure to accommodate increase in volume expansion during solder reflow App 20020158110 - Caletka, David Vincent ; et al. | 2002-10-31 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 