Danovitch; David D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Danovitch; David D..The latest application filed is for "structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties".
- Danovitch; David D. - Quebec CA
- Danovitch; David D. - Canton de Granby CA
| Patent | Date |
|---|---|
| Composite interconnect structure using injection molded solder technique Grant 7,786,588 - Danovitch , et al. August 31, 2 | 2010-08-31 |
| Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties Grant 7,498,198 - Charles , et al. March 3, 2 | 2009-03-03 |
| Structure And Method For Stress Reduction In Flip Chip Microelectronic Packages Using Underfill Materials With Spatially Varying Properties App 20080265435 - Charles; Sylvie S. ; et al. | 2008-10-30 |
| Composite Interconnect Structure Using Injection Molded Solder Technique App 20070178625 - Danovitch; David D. ; et al. | 2007-08-02 |
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