Danovitch; David

Patent Applications and Registrations

Patent applications and USPTO patent grants for Danovitch; David.The latest application filed is for "gallium liquid metal embrittlement for device rework".

Company Profile

3.17.17

Danovitch; David - Granby CA
Danovitch; David - Bromont N/A CA
Danovitch; David - Quebec N/A CA
Danovitch; David - Canton de Granby CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gallium liquid metal embrittlement for device rework Grant 10,679,966 - Danovitch , et al.	2020-06-09
Gallium liquid metal embrittlement for device rework Grant 10,559,549 - Danovitch , et al. Feb	2020-02-11
Gallium Liquid Metal Embrittlement For Device Rework App 20180233483 - Danovitch; David ; et al.	2018-08-16
Gallium Liquid Metal Embrittlement For Device Rework App 20180233482 - Danovitch; David ; et al.	2018-08-16
Silicon carrier optoelectronic packaging Grant 8,559,474 - Andry , et al. October 15, 2	2013-10-15
Achieving mechanical and thermal stability in a multi-chip package Grant 8,421,217 - Casey , et al. April 16, 2	2013-04-16
Silicon Carrier Optoelectronic Packaging App 20120326290 - Andry; Paul S. ; et al.	2012-12-27
Silicon carrier optoelectronic packaging Grant 8,290,008 - Andry , et al. October 16, 2	2012-10-16
Multistack Solder Wafer Filling App 20120234902 - Chey; S. Jay ; et al.	2012-09-20
System And Method Of Achieving Mechanical And Thermal Stability In A Multi-chip Package App 20120175766 - Casey; Jon A. ; et al.	2012-07-12
Achieving mechanical and thermal stability in a multi-chip package Grant 8,202,765 - Casey , et al. June 19, 2	2012-06-19
Injection molded soldering process and arrangement for three-dimensional structures Grant 7,952,205 - Belanger , et al. May 31, 2	2011-05-31
Multistack Solder Wafer Filling App 20110079632 - Chey; S. Jay ; et al.	2011-04-07
Silicon Carrier Optoelectronic Packaging App 20110044369 - Andry; Paul S. ; et al.	2011-02-24
Injection Molded Soldering Process And Arrangement For Three-dimensional Structures App 20100276813 - Belanger; Luc ; et al.	2010-11-04
Injection molded soldering process and arrangement for three-dimensional structures Grant 7,820,483 - Belanger , et al. October 26, 2	2010-10-26
System and Method of Achieving Mechanical and Thermal Stability in a Multi-Chip Package App 20100181665 - CASEY; Jon A. ; et al.	2010-07-22
Temporary structure to reduce stress and warpage in a flip chip organic package Grant 7,538,432 - Danovitch , et al. May 26, 2	2009-05-26
Temporary structure to reduce stress and warpage in a flip chip organic package Grant 7,473,618 - Danovitch , et al. January 6, 2	2009-01-06
Injection Molded Soldering Process And Arrangement For Three-dimensional Structures App 20080185703 - Belanger; Luc ; et al.	2008-08-07
Composite solder transfer moldplate structure and method of making same App 20060289607 - Buchwalter; Stephen L. ; et al.	2006-12-28
Method and apparatus for transferring solder bumps Grant 7,070,087 - Brouillette , et al. July 4, 2	2006-07-04
Method and apparatus for electrical commoning of circuits Grant 7,038,462 - Danovitch , et al. May 2, 2	2006-05-02
Bilayer wafer-level underfill Grant 6,924,171 - Buchwalter , et al. August 2, 2	2005-08-02
Dual-solder flip-chip solder bump Grant 6,893,799 - Danovitch , et al. May 17, 2	2005-05-17
Method And Apparatus For Electrical Commoning Of Circuits App 20050062493 - Danovitch, David ; et al.	2005-03-24
Improvements In Grounding And Thermal Dissipation For Integrated Circuit Packages App 20040233638 - Danovitch, David ; et al.	2004-11-25
Grounding and thermal dissipation for integrated circuit packages Grant 6,819,566 - Danovitch , et al. November 16, 2	2004-11-16
Method And Apparatus For Transferring Solder Bumps App 20040214420 - Brouillette, Guy ; et al.	2004-10-28
Dual-solder Flip-chip Solder Bump App 20040175657 - Danovitch, David ; et al.	2004-09-09
Bilayer wafer-level underfill App 20020109228 - Buchwalter, Stephen L. ; et al.	2002-08-15
Low temperature solder column attach by injection molded solder and structure formed App 20020023945 - Gruber, Peter A. ; et al.	2002-02-28

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