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Patent applications and USPTO patent grants for Danisch; Lee.The latest application filed is for "shape-acceleration measurement device and method".
Patent | Date |
---|---|
Shape-acceleration measurement device and method Grant 7,296,363 - Danisch , et al. November 20, 2 | 2007-11-20 |
Shape-acceleration Measurement Device And Method App 20050284221 - Danisch, Lee ;   et al. | 2005-12-29 |
Pressure sensor based on illumination of a deformable integrating cavity Grant 5,917,180 - Reimer , et al. June 29, 1 | 1999-06-29 |
Fiber optic bending and positioning sensor with selected curved light emission surfaces Grant 5,633,494 - Danisch May 27, 1 | 1997-05-27 |
Plasma enhanced chemical vapor processing of semiconductor substrates Grant 5,225,375 - Aite , et al. July 6, 1 | 1993-07-06 |
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