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Patent applications and USPTO patent grants for Daniel; Timothy J..The latest application filed is for "temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor".
Patent | Date |
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Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor Grant 8,044,553 - Chen , et al. October 25, 2 | 2011-10-25 |
Temperature Compensated Surface Acoustic Wave Device and Method Having Buried Interdigital Transducers for Providing an Improved Insertion Loss and Quality Factor App 20110204747 - Chen; Alan S. ;   et al. | 2011-08-25 |
Temperature optimization of a physical vapor deposition process to prevent extrusion into openings Grant 7,033,931 - Lippitt, III , et al. April 25, 2 | 2006-04-25 |
Temperature optimization of a physical vapor deposition process App 20050023133 - Lippitt, Maxwell W. III ;   et al. | 2005-02-03 |
Wafer pedestal cover App 20040226516 - Daniel, Timothy J. ;   et al. | 2004-11-18 |
Apparatus and method for producing a <111> orientation aluminum film for an integrated circuit device App 20040229477 - Daniel, Timothy J. ;   et al. | 2004-11-18 |
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