| Patent | Date |
|---|
Substrate integrated inductor with composite magnetic resin layer
Grant 11,335,616 - Sankarasubramanian , et al. May 17, 2 | 2022-05-17 |
Substrate Integrated Inductor
App 20210098326 - Sankarasubramanian; Malavarayan ; et al. | 2021-04-01 |
Package structure to enhance yield of TMI interconnections
Grant 10,049,971 - De Bonis , et al. August 14, 2 | 2018-08-14 |
Package Structure To Enhance Yield of TMI Interconnections
App 20170207152 - De Bonis; Thomas J. ; et al. | 2017-07-20 |
Package structure to enhance yield of TMI interconnections
Grant 9,613,933 - De Bonis , et al. April 4, 2 | 2017-04-04 |
Package Structure To Enhance Yield of TMI Interconnections
App 20150255415 - De Bonis; Thomas J. ; et al. | 2015-09-10 |
Functional material systems and processes for package-level interconnects
Grant 9,024,453 - Sidhu , et al. May 5, 2 | 2015-05-05 |
Solder Paste Material Technology For Elimination Of High Warpage Surface Mount Assembly Defects
App 20140175160 - Sidhu; Rajen S. ; et al. | 2014-06-26 |
Substrate metallization and ball attach metallurgy with a novel dopant element
Grant 8,701,281 - Sidhu , et al. April 22, 2 | 2014-04-22 |
Heat dissipating device with preselected designed interface for thermal interface materials
Grant 7,996,989 - Dani , et al. August 16, 2 | 2011-08-16 |
Substrate Metallization And Ball Attach Metallurgy With A Novel Dopant Element
App 20110147066 - Sidhu; Rajen S. ; et al. | 2011-06-23 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
Grant 7,776,657 - Dani , et al. August 17, 2 | 2010-08-17 |
Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
Grant 7,727,815 - Kumaus , et al. June 1, 2 | 2010-06-01 |
Heat dissipating device with preselected designed interface for thermal interface materials
Grant 7,527,090 - Dani , et al. May 5, 2 | 2009-05-05 |
Heat Dissipating Device With Preselected Designed Interface For Thermal Interface Materials
App 20080185713 - Dani; Ashay A. ; et al. | 2008-08-07 |
Chip Package Thermal Interface Materials With Dielectric Obstructions For Body-biasing, Methods Of Using Same, And Systems Containing Same
App 20080064144 - Dani; Ashay A. ; et al. | 2008-03-13 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
Grant 7,332,807 - Dani , et al. February 19, 2 | 2008-02-19 |
Thermal interface material and electronic assembly having such a thermal interface material
Grant 7,311,967 - Dani , et al. December 25, 2 | 2007-12-25 |
Reworkable thermal interface material
Grant 7,253,523 - Dani , et al. August 7, 2 | 2007-08-07 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
App 20070158823 - Dani; Ashay A. ; et al. | 2007-07-12 |
Chip package dielectric sheet for body-biasing
App 20070152325 - Dani; Ashay A. ; et al. | 2007-07-05 |
Silicon wafer with non-soluble protective coating
App 20060289966 - Dani; Ashay A. ; et al. | 2006-12-28 |
Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
App 20060124700 - Houle; Sabina J. ; et al. | 2006-06-15 |
Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application
Grant 7,030,483 - Matayabas , et al. April 18, 2 | 2006-04-18 |
Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
App 20060065974 - Kumaus; Chad A. ; et al. | 2006-03-30 |
Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
Grant 7,014,093 - Houle , et al. March 21, 2 | 2006-03-21 |
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
Grant 6,974,723 - Matayabas, Jr. , et al. December 13, 2 | 2005-12-13 |
Silicon wafer with soluble protective coating
Grant 6,974,726 - Dani , et al. December 13, 2 | 2005-12-13 |
Silicon wafer with soluable protective coating
App 20050139962 - Dani, Ashay A. ; et al. | 2005-06-30 |
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
App 20050040507 - Matayabas, James C. JR. ; et al. | 2005-02-24 |
Reworkable thermal interface material
App 20050027055 - Dani, Ashay A. ; et al. | 2005-02-03 |
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
Grant 6,841,867 - Matayabas, Jr. , et al. January 11, 2 | 2005-01-11 |
Heat dissipating device with preselected designed interface for thermal interface materials
App 20040261980 - Dani, Ashay A. ; et al. | 2004-12-30 |
Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
App 20040262372 - Houle, Sabina J. ; et al. | 2004-12-30 |
Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application
App 20040262740 - Matayabas, James C. JR. ; et al. | 2004-12-30 |
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
App 20040124526 - Matayabas, James C. JR. ; et al. | 2004-07-01 |
Thermal interface material and electronic assembly having such a thermal interface material
App 20030077478 - Dani, Ashay A. ; et al. | 2003-04-24 |
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