Dangler; John Richard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dangler; John Richard.The latest application filed is for "method of manufacturing a venting device for tamper resistant electronic modules".

Company Profile

0.12.11

Dangler; John Richard - Rochester MN US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing a venting device for tamper resistant electronic modules Grant 8,961,280 - Dangler , et al. February 24, 2	2015-02-24
Method Of Manufacturing A Venting Device For Tamper Resistant Electronic Modules App 20150007427 - Dangler; John Richard ; et al.	2015-01-08
Controlling impedance and thickness variations for multilayer electronic structures Grant 8,863,046 - Dangler , et al. October 14, 2	2014-10-14
Controlling impedance and thickness variations for multilayer electronic structures Grant 8,549,444 - Dangler , et al. October 1, 2	2013-10-01
Method of manufacturing a venting device for tamper resistant electronic modules Grant 8,287,336 - Dangler , et al. October 16, 2	2012-10-16
Implementing impedance gradient connector for board-to-board applications Grant 8,251,749 - Dangler , et al. August 28, 2	2012-08-28
Implementing Impedance Gradient Connector For Board-to-board Applications App 20120122342 - Dangler; John Richard ; et al.	2012-05-17
Method of manufacturing a flexible printed circuit assembly Grant 8,015,701 - Abrahamson , et al. September 13, 2	2011-09-13
Controlling impedance and thickness variations for multilayer electronic structures Grant 7,921,403 - Dangler , et al. April 5, 2	2011-04-05
Controlling Impedance and Thickness Variations for Multilayer Electronic Structures App 20090255713 - Dangler; John Richard ; et al.	2009-10-15
Controlling Impedance and Thickness Variations for Multilayer Electronic Structures App 20090258194 - Dangler; John Richard ; et al.	2009-10-15
Controlling Impedance and Thickness Variations for Multilayer Electronic Structures App 20090255715 - Dangler; John Richard ; et al.	2009-10-15
Flexible Printed Circuit Assembly With Reduced Dielectric Loss App 20090211792 - Abrahamson; Paul V. ; et al.	2009-08-27
Method And Apparatus For Implementing Reduced Coupling Effects On Single Ended Clocks App 20090189635 - Booth, JR.; Roger Allen ; et al.	2009-07-30
Method Of Manufacturing A Venting Device For Tamper Resistant Electronic Modules App 20070155302 - Dangler; John Richard ; et al.	2007-07-05
Venting device for tamper resistant electronic modules Grant 7,214,874 - Dangler , et al. May 8, 2	2007-05-08
Flexible cable interconnect with integrated EMC shielding Grant 7,086,869 - Dangler , et al. August 8, 2	2006-08-08
Flexible cable interconnect with integrated EMC shielding App 20060160421 - Dangler; John Richard ; et al.	2006-07-20
Venting device for tamper resistant electronic modules App 20060090918 - Dangler; John Richard ; et al.	2006-05-04

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