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name:-0.084709882736206
name:-0.042279958724976
name:-0.012622833251953
Dangelmaier; Jochen Patent Filings

Dangelmaier; Jochen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dangelmaier; Jochen.The latest application filed is for "sensor packages and methods for producing sensor packages".

Company Profile
13.43.49
  • Dangelmaier; Jochen - Beratzhausen DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Package with selective corrosion protection of electric connection structure
Grant 11,410,942 - Dangelmaier , et al. August 9, 2
2022-08-09
Package comprising identifier on and/or in carrier
Grant 11,239,176 - Dangelmaier , et al. February 1, 2
2022-02-01
Sensor Packages And Methods For Producing Sensor Packages
App 20210300749 - SCHALLER; Rainer Markus ;   et al.
2021-09-30
Current sensor device with a routable molded lead frame
Grant 11,073,572 - Dangelmaier , et al. July 27, 2
2021-07-27
Photoacoustic Sensors And Mems Devices
App 20210181151 - SCHALLER; Rainer Markus ;   et al.
2021-06-17
Direct selective adhesion promotor plating
Grant 11,024,565 - Dangelmaier , et al. June 1, 2
2021-06-01
Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
Grant 10,978,418 - Mahler , et al. April 13, 2
2021-04-13
Chip Package, Method Of Forming A Chip Package And Method Of Forming An Electrical Contact
App 20210082861 - Mahler; Joachim ;   et al.
2021-03-18
Package With Selective Corrosion Protection Of Electric Connection Structure
App 20210028125 - Dangelmaier; Jochen ;   et al.
2021-01-28
Semiconductor sensor device and method for fabricating the same
Grant 10,818,805 - Kalz , et al. October 27, 2
2020-10-27
Package Comprising Identifier On And/or In Carrier
App 20200335451 - Dangelmaier; Jochen ;   et al.
2020-10-22
Molded lead frame sensor package
Grant 10,781,095 - Dangelmaier , et al. Sept
2020-09-22
Current Sensor Device With A Routable Molded Lead Frame
App 20200233044 - DANGELMAIER; Jochen ;   et al.
2020-07-23
Molded Lead Frame Sensor Package
App 20200189908 - DANGELMAIER; Jochen ;   et al.
2020-06-18
Chip Package And Method Of Forming A Chip Package With A Metal Contact Structure And Protective Layer, And Method Of Forming An
App 20200013749 - Mahler; Joachim ;   et al.
2020-01-09
Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
Grant 10,461,056 - Mahler , et al. Oc
2019-10-29
Direct Selective Adhesion Promotor Plating
App 20190237396 - Dangelmaier; Jochen ;   et al.
2019-08-01
Direct selective adhesion promotor plating
Grant 10,297,536 - Dangelmaier , et al.
2019-05-21
Semiconductor Sensor Device and Method for Fabricating the Same
App 20190148566 - Kalz; Franz-Peter ;   et al.
2019-05-16
Sensor arrangement, battery cell and energy system
Grant 10,107,867 - Elian , et al. October 23, 2
2018-10-23
Pre-mold for a microphone assembly and method of producing the same
Grant 9,986,354 - Mueller , et al. May 29, 2
2018-05-29
Chip Package, Method Of Forming A Chip Package And Method Of Forming An Electrical Contact
App 20170338169 - Mahler; Joachim ;   et al.
2017-11-23
Direct Selective Adhesion Promotor Plating
App 20170271245 - Dangelmaier; Jochen ;   et al.
2017-09-21
Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery
Grant 9,748,611 - Elian , et al. August 29, 2
2017-08-29
Direct selective adhesion promotor plating
Grant 9,704,786 - Dangelmaier , et al. July 11, 2
2017-07-11
Current sensor device
Grant 9,658,296 - Ausserlechner , et al. May 23, 2
2017-05-23
Direct Selective Adhesion Promotor Plating
App 20170092569 - Dangelmaier; Jochen ;   et al.
2017-03-30
Molded Semiconductor Package Having Enhanced Local Adhesion Characteristics
App 20160282212 - Beer; Sebastian ;   et al.
2016-09-29
Semiconductor Device
App 20150279782 - Ewe; Henrik ;   et al.
2015-10-01
Sensor Arrangement, Battery Cell And Energy System
App 20150226810 - Elian; Klaus ;   et al.
2015-08-13
Semiconductor device
Grant 9,059,083 - Ewe , et al. June 16, 2
2015-06-16
Sensor Arrangement, Energy System And Method
App 20150132614 - Elian; Klaus ;   et al.
2015-05-14
Pressure sensor package having a stacked die arrangement
Grant 9,013,013 - Beer , et al. April 21, 2
2015-04-21
Current Sensor Device
App 20150015249 - AUSSERLECHNER; Udo ;   et al.
2015-01-15
Apparatus For Determining A State Of A Rechargeable Battery Or Of A Battery, A Rechargeable Battery Or A Battery, And A Method For Determining A State Of A Rechargeable Battery Or Of A Battery
App 20150004451 - Elian; Klaus ;   et al.
2015-01-01
Pre-mold for a microphone assembly and method of producing the same
App 20150001646 - MUELLER; Thomas ;   et al.
2015-01-01
Method for producing a component and device comprising a component
Grant 8,872,314 - Theuss , et al. October 28, 2
2014-10-28
Module including a micro-electro-mechanical microphone
Grant 8,767,983 - Theuss , et al. July 1, 2
2014-07-01
Method For Producing A Component And Device Comprising A Component
App 20130277864 - Theuss; Horst ;   et al.
2013-10-24
Method for producing a component and device having a component
Grant 8,482,135 - Theuss , et al. July 9, 2
2013-07-09
Magnetic Field Current Sensors
App 20120146165 - Ausserlechner; Udo ;   et al.
2012-06-14
Electronic device and method of manufacturing same
Grant 7,964,448 - Elian , et al. June 21, 2
2011-06-21
Semiconductor device with gold coatings, and process for producing it
Grant 7,911,041 - Dangelmaier , et al. March 22, 2
2011-03-22
Semiconductor component and apparatus for production of a semiconductor component
Grant 7,838,989 - Dangelmaier , et al. November 23, 2
2010-11-23
Component with chip through-contacts
Grant 7,786,577 - Dangelmaier , et al. August 31, 2
2010-08-31
Connector module and method of manufacturing the same
Grant 7,766,560 - Dangelmaier , et al. August 3, 2
2010-08-03
Semiconductor sensor device with sensor chip and method for producing the same
Grant 7,732,915 - Dangelmaier , et al. June 8, 2
2010-06-08
Process for producing and apparatus for improving the bonding between a plastic and a metal
Grant 7,732,333 - Betz , et al. June 8, 2
2010-06-08
Semiconductor device with surface-mountable external contacts and method for manufacturing the same
Grant 7,719,101 - Dangelmaier , et al. May 18, 2
2010-05-18
Electronic Device and Method of Manufacturing Same
App 20100065961 - ELIAN; Klaus ;   et al.
2010-03-18
Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
Grant 7,659,618 - Dangelmaier , et al. February 9, 2
2010-02-09
Chip carrier and system including a chip carrier and semiconductor chips
Grant 7,635,911 - Auburger , et al. December 22, 2
2009-12-22
MID module and a method of mounting an optical fibre in an MID module
Grant 7,597,484 - Ghahremani , et al. October 6, 2
2009-10-06
Semiconductor Device
App 20090072379 - Ewe; Henrik ;   et al.
2009-03-19
Semiconductor module provided with contacts extending through the package
Grant 7,505,276 - Dangelmaier March 17, 2
2009-03-17
Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
Grant 7,504,711 - Beer , et al. March 17, 2
2009-03-17
Optocoupler for converting optical signals into electrical signals and vice versa
Grant 7,476,036 - Auburger , et al. January 13, 2
2009-01-13
Module Including A Micro-electro-mechanical Microphone
App 20080298621 - Theuss; Horst ;   et al.
2008-12-04
Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal
App 20080258281 - Betz; Bernd ;   et al.
2008-10-23
Radiofrequency power semiconductor module with cavity housing, and method for producing it
Grant 7,417,198 - Betz , et al. August 26, 2
2008-08-26
Device and method for data transmission between structural units connected by an articulated joint
Grant 7,413,353 - Beer , et al. August 19, 2
2008-08-19
Connector module and method of manufacturing the same
App 20080160828 - Dangelmaier; Jochen ;   et al.
2008-07-03
Mid Module And A Method Of Mounting An Optical Fibre In An Mid Module
App 20080152285 - Ghahremani; Cyrus ;   et al.
2008-06-26
Integrated magnetic sensor component
Grant 7,385,394 - Auburger , et al. June 10, 2
2008-06-10
Method for producing a component and device having a component
App 20080036099 - Theuss; Horst ;   et al.
2008-02-14
Component And Associated Connection Wire
App 20080014437 - Dangelmaier; Jochen
2008-01-17
Device and Method for Data Transmission Between Structural Units Connected by an Articulated Joint
App 20070230876 - Beer; Gottfried ;   et al.
2007-10-04
Optocoupler for Converting Optical Signals into Electrical Signals and Vice Versa
App 20070217734 - Auburger; Albert ;   et al.
2007-09-20
Substrate with Strip Conductors and Production of Strip Conductors on Substrates for Semiconductor Components
App 20070210883 - Beer; Gottfried ;   et al.
2007-09-13
Flexible rewiring plate for semiconductor components, and process for producing it
Grant 7,268,423 - Beer , et al. September 11, 2
2007-09-11
Semiconductor Device with Surface-Mountable External Contacts and Method for Manufacturing the Same
App 20070170577 - Dangelmaier; Jochen ;   et al.
2007-07-26
Semiconductor component and apparatus for production of a semiconductor component
App 20070158860 - Dangelmaier; Jochen ;   et al.
2007-07-12
Integrated magnetic sensor component
App 20070145972 - Auburger; Albert ;   et al.
2007-06-28
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
Grant 7,221,048 - Daeche , et al. May 22, 2
2007-05-22
Semiconductor sensor device with sensor chip and method for producing the same
App 20070069354 - Dangelmaier; Jochen ;   et al.
2007-03-29
Component With Chip Through-contacts
App 20070069376 - Dangelmaier; Jochen ;   et al.
2007-03-29
Micro-optical module with housing and method for producing the same
Grant 7,189,009 - Dangelmaier , et al. March 13, 2
2007-03-13
Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
App 20070023896 - Dangelmaier; Jochen ;   et al.
2007-02-01
Semiconductor module provided with contacts extending through the package
App 20060255458 - Dangelmaier; Jochen
2006-11-16
Chip carrier and system including a chip carrier and semiconductor chips
App 20060192296 - Auburger; Albert ;   et al.
2006-08-31
Semiconductor device with gold coatings, and process for producing it
App 20060175691 - Dangelmaier; Jochen ;   et al.
2006-08-10
Electronic component comprising external surface contacts and a method for producing the same
App 20060091561 - Dangelmaier; Jochen ;   et al.
2006-05-04
Method for manufacturing a housing for a chip having a micromechanical structure
Grant 7,037,844 - D che , et al. May 2, 2
2006-05-02
Micro-optical module with housing and method for producing the same
App 20060088256 - Dangelmaier; Jochen ;   et al.
2006-04-27
High-frequency power semiconductor module with a hollow housing and method for the production thereof
App 20060012016 - Betz; Bernd ;   et al.
2006-01-19
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
App 20050151246 - Daeche, Frank ;   et al.
2005-07-14
Flexible rewiring plate for semiconductor components, and process for producing it
App 20050142933 - Beer, Gottfried ;   et al.
2005-06-30
Semiconductor component having a plastic housing and methods for its production
App 20050051905 - Dangelmaier, Jochen ;   et al.
2005-03-10
Method for manufacturing a housing for a chip having a micromechanical structure
App 20040067650 - Dache, Frank ;   et al.
2004-04-08

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