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Package with selective corrosion protection of electric connection structure Grant 11,410,942 - Dangelmaier , et al. August 9, 2 | 2022-08-09 |
Package comprising identifier on and/or in carrier Grant 11,239,176 - Dangelmaier , et al. February 1, 2 | 2022-02-01 |
Sensor Packages And Methods For Producing Sensor Packages App 20210300749 - SCHALLER; Rainer Markus ;   et al. | 2021-09-30 |
Current sensor device with a routable molded lead frame Grant 11,073,572 - Dangelmaier , et al. July 27, 2 | 2021-07-27 |
Photoacoustic Sensors And Mems Devices App 20210181151 - SCHALLER; Rainer Markus ;   et al. | 2021-06-17 |
Direct selective adhesion promotor plating Grant 11,024,565 - Dangelmaier , et al. June 1, 2 | 2021-06-01 |
Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer Grant 10,978,418 - Mahler , et al. April 13, 2 | 2021-04-13 |
Chip Package, Method Of Forming A Chip Package And Method Of Forming An Electrical Contact App 20210082861 - Mahler; Joachim ;   et al. | 2021-03-18 |
Package With Selective Corrosion Protection Of Electric Connection Structure App 20210028125 - Dangelmaier; Jochen ;   et al. | 2021-01-28 |
Semiconductor sensor device and method for fabricating the same Grant 10,818,805 - Kalz , et al. October 27, 2 | 2020-10-27 |
Package Comprising Identifier On And/or In Carrier App 20200335451 - Dangelmaier; Jochen ;   et al. | 2020-10-22 |
Molded lead frame sensor package Grant 10,781,095 - Dangelmaier , et al. Sept | 2020-09-22 |
Current Sensor Device With A Routable Molded Lead Frame App 20200233044 - DANGELMAIER; Jochen ;   et al. | 2020-07-23 |
Molded Lead Frame Sensor Package App 20200189908 - DANGELMAIER; Jochen ;   et al. | 2020-06-18 |
Chip Package And Method Of Forming A Chip Package With A Metal Contact Structure And Protective Layer, And Method Of Forming An App 20200013749 - Mahler; Joachim ;   et al. | 2020-01-09 |
Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact Grant 10,461,056 - Mahler , et al. Oc | 2019-10-29 |
Direct Selective Adhesion Promotor Plating App 20190237396 - Dangelmaier; Jochen ;   et al. | 2019-08-01 |
Direct selective adhesion promotor plating Grant 10,297,536 - Dangelmaier , et al. | 2019-05-21 |
Semiconductor Sensor Device and Method for Fabricating the Same App 20190148566 - Kalz; Franz-Peter ;   et al. | 2019-05-16 |
Sensor arrangement, battery cell and energy system Grant 10,107,867 - Elian , et al. October 23, 2 | 2018-10-23 |
Pre-mold for a microphone assembly and method of producing the same Grant 9,986,354 - Mueller , et al. May 29, 2 | 2018-05-29 |
Chip Package, Method Of Forming A Chip Package And Method Of Forming An Electrical Contact App 20170338169 - Mahler; Joachim ;   et al. | 2017-11-23 |
Direct Selective Adhesion Promotor Plating App 20170271245 - Dangelmaier; Jochen ;   et al. | 2017-09-21 |
Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery Grant 9,748,611 - Elian , et al. August 29, 2 | 2017-08-29 |
Direct selective adhesion promotor plating Grant 9,704,786 - Dangelmaier , et al. July 11, 2 | 2017-07-11 |
Current sensor device Grant 9,658,296 - Ausserlechner , et al. May 23, 2 | 2017-05-23 |
Direct Selective Adhesion Promotor Plating App 20170092569 - Dangelmaier; Jochen ;   et al. | 2017-03-30 |
Molded Semiconductor Package Having Enhanced Local Adhesion Characteristics App 20160282212 - Beer; Sebastian ;   et al. | 2016-09-29 |
Semiconductor Device App 20150279782 - Ewe; Henrik ;   et al. | 2015-10-01 |
Sensor Arrangement, Battery Cell And Energy System App 20150226810 - Elian; Klaus ;   et al. | 2015-08-13 |
Semiconductor device Grant 9,059,083 - Ewe , et al. June 16, 2 | 2015-06-16 |
Sensor Arrangement, Energy System And Method App 20150132614 - Elian; Klaus ;   et al. | 2015-05-14 |
Pressure sensor package having a stacked die arrangement Grant 9,013,013 - Beer , et al. April 21, 2 | 2015-04-21 |
Current Sensor Device App 20150015249 - AUSSERLECHNER; Udo ;   et al. | 2015-01-15 |
Apparatus For Determining A State Of A Rechargeable Battery Or Of A Battery, A Rechargeable Battery Or A Battery, And A Method For Determining A State Of A Rechargeable Battery Or Of A Battery App 20150004451 - Elian; Klaus ;   et al. | 2015-01-01 |
Pre-mold for a microphone assembly and method of producing the same App 20150001646 - MUELLER; Thomas ;   et al. | 2015-01-01 |
Method for producing a component and device comprising a component Grant 8,872,314 - Theuss , et al. October 28, 2 | 2014-10-28 |
Module including a micro-electro-mechanical microphone Grant 8,767,983 - Theuss , et al. July 1, 2 | 2014-07-01 |
Method For Producing A Component And Device Comprising A Component App 20130277864 - Theuss; Horst ;   et al. | 2013-10-24 |
Method for producing a component and device having a component Grant 8,482,135 - Theuss , et al. July 9, 2 | 2013-07-09 |
Magnetic Field Current Sensors App 20120146165 - Ausserlechner; Udo ;   et al. | 2012-06-14 |
Electronic device and method of manufacturing same Grant 7,964,448 - Elian , et al. June 21, 2 | 2011-06-21 |
Semiconductor device with gold coatings, and process for producing it Grant 7,911,041 - Dangelmaier , et al. March 22, 2 | 2011-03-22 |
Semiconductor component and apparatus for production of a semiconductor component Grant 7,838,989 - Dangelmaier , et al. November 23, 2 | 2010-11-23 |
Component with chip through-contacts Grant 7,786,577 - Dangelmaier , et al. August 31, 2 | 2010-08-31 |
Connector module and method of manufacturing the same Grant 7,766,560 - Dangelmaier , et al. August 3, 2 | 2010-08-03 |
Semiconductor sensor device with sensor chip and method for producing the same Grant 7,732,915 - Dangelmaier , et al. June 8, 2 | 2010-06-08 |
Process for producing and apparatus for improving the bonding between a plastic and a metal Grant 7,732,333 - Betz , et al. June 8, 2 | 2010-06-08 |
Semiconductor device with surface-mountable external contacts and method for manufacturing the same Grant 7,719,101 - Dangelmaier , et al. May 18, 2 | 2010-05-18 |
Electronic Device and Method of Manufacturing Same App 20100065961 - ELIAN; Klaus ;   et al. | 2010-03-18 |
Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device Grant 7,659,618 - Dangelmaier , et al. February 9, 2 | 2010-02-09 |
Chip carrier and system including a chip carrier and semiconductor chips Grant 7,635,911 - Auburger , et al. December 22, 2 | 2009-12-22 |
MID module and a method of mounting an optical fibre in an MID module Grant 7,597,484 - Ghahremani , et al. October 6, 2 | 2009-10-06 |
Semiconductor Device App 20090072379 - Ewe; Henrik ;   et al. | 2009-03-19 |
Semiconductor module provided with contacts extending through the package Grant 7,505,276 - Dangelmaier March 17, 2 | 2009-03-17 |
Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof Grant 7,504,711 - Beer , et al. March 17, 2 | 2009-03-17 |
Optocoupler for converting optical signals into electrical signals and vice versa Grant 7,476,036 - Auburger , et al. January 13, 2 | 2009-01-13 |
Module Including A Micro-electro-mechanical Microphone App 20080298621 - Theuss; Horst ;   et al. | 2008-12-04 |
Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal App 20080258281 - Betz; Bernd ;   et al. | 2008-10-23 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it Grant 7,417,198 - Betz , et al. August 26, 2 | 2008-08-26 |
Device and method for data transmission between structural units connected by an articulated joint Grant 7,413,353 - Beer , et al. August 19, 2 | 2008-08-19 |
Connector module and method of manufacturing the same App 20080160828 - Dangelmaier; Jochen ;   et al. | 2008-07-03 |
Mid Module And A Method Of Mounting An Optical Fibre In An Mid Module App 20080152285 - Ghahremani; Cyrus ;   et al. | 2008-06-26 |
Integrated magnetic sensor component Grant 7,385,394 - Auburger , et al. June 10, 2 | 2008-06-10 |
Method for producing a component and device having a component App 20080036099 - Theuss; Horst ;   et al. | 2008-02-14 |
Component And Associated Connection Wire App 20080014437 - Dangelmaier; Jochen | 2008-01-17 |
Device and Method for Data Transmission Between Structural Units Connected by an Articulated Joint App 20070230876 - Beer; Gottfried ;   et al. | 2007-10-04 |
Optocoupler for Converting Optical Signals into Electrical Signals and Vice Versa App 20070217734 - Auburger; Albert ;   et al. | 2007-09-20 |
Substrate with Strip Conductors and Production of Strip Conductors on Substrates for Semiconductor Components App 20070210883 - Beer; Gottfried ;   et al. | 2007-09-13 |
Flexible rewiring plate for semiconductor components, and process for producing it Grant 7,268,423 - Beer , et al. September 11, 2 | 2007-09-11 |
Semiconductor Device with Surface-Mountable External Contacts and Method for Manufacturing the Same App 20070170577 - Dangelmaier; Jochen ;   et al. | 2007-07-26 |
Semiconductor component and apparatus for production of a semiconductor component App 20070158860 - Dangelmaier; Jochen ;   et al. | 2007-07-12 |
Integrated magnetic sensor component App 20070145972 - Auburger; Albert ;   et al. | 2007-06-28 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier Grant 7,221,048 - Daeche , et al. May 22, 2 | 2007-05-22 |
Semiconductor sensor device with sensor chip and method for producing the same App 20070069354 - Dangelmaier; Jochen ;   et al. | 2007-03-29 |
Component With Chip Through-contacts App 20070069376 - Dangelmaier; Jochen ;   et al. | 2007-03-29 |
Micro-optical module with housing and method for producing the same Grant 7,189,009 - Dangelmaier , et al. March 13, 2 | 2007-03-13 |
Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device App 20070023896 - Dangelmaier; Jochen ;   et al. | 2007-02-01 |
Semiconductor module provided with contacts extending through the package App 20060255458 - Dangelmaier; Jochen | 2006-11-16 |
Chip carrier and system including a chip carrier and semiconductor chips App 20060192296 - Auburger; Albert ;   et al. | 2006-08-31 |
Semiconductor device with gold coatings, and process for producing it App 20060175691 - Dangelmaier; Jochen ;   et al. | 2006-08-10 |
Electronic component comprising external surface contacts and a method for producing the same App 20060091561 - Dangelmaier; Jochen ;   et al. | 2006-05-04 |
Method for manufacturing a housing for a chip having a micromechanical structure Grant 7,037,844 - D che , et al. May 2, 2 | 2006-05-02 |
Micro-optical module with housing and method for producing the same App 20060088256 - Dangelmaier; Jochen ;   et al. | 2006-04-27 |
High-frequency power semiconductor module with a hollow housing and method for the production thereof App 20060012016 - Betz; Bernd ;   et al. | 2006-01-19 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier App 20050151246 - Daeche, Frank ;   et al. | 2005-07-14 |
Flexible rewiring plate for semiconductor components, and process for producing it App 20050142933 - Beer, Gottfried ;   et al. | 2005-06-30 |
Semiconductor component having a plastic housing and methods for its production App 20050051905 - Dangelmaier, Jochen ;   et al. | 2005-03-10 |
Method for manufacturing a housing for a chip having a micromechanical structure App 20040067650 - Dache, Frank ;   et al. | 2004-04-08 |