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name:-0.011230945587158
name:-0.008901834487915
name:-0.0014209747314453
Dang; Thong Patent Filings

Dang; Thong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dang; Thong.The latest application filed is for "wafer level fan-out with electromagnetic shielding".

Company Profile
0.8.9
  • Dang; Thong - Summerfield NC
  • Dang; Thong - Fayetteville NY
  • Dang, Thong - Yorba Linda CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wafer level fan-out with electromagnetic shielding
Grant 10,103,106 - Dang , et al. October 16, 2
2018-10-16
Redistribution layer system in package
Grant 9,936,578 - Dang , et al. April 3, 2
2018-04-03
Electronic modules having grounded electromagnetic shields
Grant 9,807,890 - Dang , et al. October 31, 2
2017-10-31
Wafer Level Fan-out With Electromagnetic Shielding
App 20170133326 - Dang; Thong ;   et al.
2017-05-11
Wafer level fan-out with electromagnetic shielding
Grant 9,570,406 - Dang , et al. February 14, 2
2017-02-14
Wafer Level Fan-out With Electromagnetic Shielding
App 20160351509 - Dang; Thong ;   et al.
2016-12-01
Method of manufacturing an electronic module
Grant 8,959,757 - Dang , et al. February 24, 2
2015-02-24
Rdl System In Package
App 20150036306 - Dang; Thong ;   et al.
2015-02-05
Electronic Modules Having Grounded Electromagnetic Shields
App 20140355222 - Dang; Thong ;   et al.
2014-12-04
Rdl System In Package
App 20130170147 - Dang; Thong ;   et al.
2013-07-04
Wind powered device
Grant 8,282,236 - Pelken , et al. October 9, 2
2012-10-09
Wind powered device
Grant 7,824,060 - Pelken , et al. November 2, 2
2010-11-02
Wind Powered Device
App 20100220466 - Pelken; Paul Michael ;   et al.
2010-09-02
Wind Powered Device
App 20090244890 - Pelken; Paul Michael ;   et al.
2009-10-01
Foldable utility container / carrier
App 20020145022 - Nguyen, Hung Van ;   et al.
2002-10-10

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