loadpatents
Patent applications and USPTO patent grants for Dang; Thong.The latest application filed is for "wafer level fan-out with electromagnetic shielding".
Patent | Date |
---|---|
Wafer level fan-out with electromagnetic shielding Grant 10,103,106 - Dang , et al. October 16, 2 | 2018-10-16 |
Redistribution layer system in package Grant 9,936,578 - Dang , et al. April 3, 2 | 2018-04-03 |
Electronic modules having grounded electromagnetic shields Grant 9,807,890 - Dang , et al. October 31, 2 | 2017-10-31 |
Wafer Level Fan-out With Electromagnetic Shielding App 20170133326 - Dang; Thong ;   et al. | 2017-05-11 |
Wafer level fan-out with electromagnetic shielding Grant 9,570,406 - Dang , et al. February 14, 2 | 2017-02-14 |
Wafer Level Fan-out With Electromagnetic Shielding App 20160351509 - Dang; Thong ;   et al. | 2016-12-01 |
Method of manufacturing an electronic module Grant 8,959,757 - Dang , et al. February 24, 2 | 2015-02-24 |
Rdl System In Package App 20150036306 - Dang; Thong ;   et al. | 2015-02-05 |
Electronic Modules Having Grounded Electromagnetic Shields App 20140355222 - Dang; Thong ;   et al. | 2014-12-04 |
Rdl System In Package App 20130170147 - Dang; Thong ;   et al. | 2013-07-04 |
Wind powered device Grant 8,282,236 - Pelken , et al. October 9, 2 | 2012-10-09 |
Wind powered device Grant 7,824,060 - Pelken , et al. November 2, 2 | 2010-11-02 |
Wind Powered Device App 20100220466 - Pelken; Paul Michael ;   et al. | 2010-09-02 |
Wind Powered Device App 20090244890 - Pelken; Paul Michael ;   et al. | 2009-10-01 |
Foldable utility container / carrier App 20020145022 - Nguyen, Hung Van ;   et al. | 2002-10-10 |
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