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Patent applications and USPTO patent grants for Danello; Paul A..The latest application filed is for "process for removing bond film from cavities in printed circuit boards".
Patent | Date |
---|---|
Process for removing bond film from cavities in printed circuit boards Grant 11,171,101 - Benedict , et al. November 9, 2 | 2021-11-09 |
Process For Removing Bond Film From Cavities In Printed Circuit Boards App 20210305187 - Benedict; James E. ;   et al. | 2021-09-30 |
Flat-wire Copper Vertical Launch Microwave Interconnection Method App 20200367357 - Benedict; James E. ;   et al. | 2020-11-19 |
Conduction cooling of multi-channel flip chip based panel array circuits Grant 8,780,561 - Danello , et al. July 15, 2 | 2014-07-15 |
Conduction Cooling Of Multi-channel Flip Chip Based Panel Array Circuits App 20130258599 - Danello; Paul A. ;   et al. | 2013-10-03 |
Cooling active circuits Grant 8,508,943 - Danello , et al. August 13, 2 | 2013-08-13 |
Cooling Active Circuits App 20120146862 - Danello; Paul A. ;   et al. | 2012-06-14 |
Pneumatic presssure wedge App 20100039770 - Danello; Paul A. ;   et al. | 2010-02-18 |
Wedgelock system Grant 6,615,997 - Danello , et al. September 9, 2 | 2003-09-09 |
Wedgelock system App 20030146176 - Danello, Paul A. ;   et al. | 2003-08-07 |
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