Danek; Michal

Patent Applications and Registrations

Patent applications and USPTO patent grants for Danek; Michal.The latest application filed is for "metal deposition".

Company Profile

27.93.83

Danek; Michal - Cupertino CA
- Cupertino CA US
Danek; Michal - Liberec CZ
Danek; Michal - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal Deposition App 20220290300 - Vellanki; Ravi ; et al.	2022-09-15
Defect Classification And Source Analysis For Semiconductor Equipment App 20220270237 - Sawlani; Kapil ; et al.	2022-08-25
Method For Preventing Line Bending During Metal Fill Process App 20220262640 - Jandl; Adam ; et al.	2022-08-18
Nucleation-free Tungsten Deposition App 20220254685 - ERMEZ; Sema ; et al.	2022-08-11
Tungsten feature fill with nucleation inhibition Grant 11,410,883 - Chandrashekar , et al. August 9, 2	2022-08-09
Low Resistivity Films Containing Molybdenum App 20220223471 - THOMBARE; Shruti Vivek ; et al.	2022-07-14
Method for preventing line bending during metal fill process Grant 11,355,345 - Jandl , et al. June 7, 2	2022-06-07
Metal fill process for three-dimensional vertical NAND wordline Grant 11,348,795 - Schloss , et al. May 31, 2	2022-05-31
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill App 20220115244 - LAI; Chiukin Steven ; et al.	2022-04-14
Feature Fill With Nucleation Inhibition App 20220102208 - Chandrashekar; Anand ; et al.	2022-03-31
Defect classification and source analysis for semiconductor equipment Grant 11,263,737 - Sawlani , et al. March 1, 2	2022-03-01
Molybdenum Templates For Tungsten App 20220013365 - van Cleemput; Patrick A. ; et al.	2022-01-13
Tungsten Feature Fill App 20210327754 - Chandrashekar; Anand ; et al.	2021-10-21
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill App 20210305059 - Lai; Chiukin Steven ; et al.	2021-09-30
Tungsten feature fill Grant 11,075,115 - Chandrashekar , et al. July 27, 2	2021-07-27
Atomic layer etch of tungsten for enhanced tungsten deposition fill Grant 11,069,535 - Lai , et al. July 20, 2	2021-07-20
Fill process optimization using feature scale modeling Grant 10,977,405 - Bowes , et al. April 13, 2	2021-04-13
Feature fill with multi-stage nucleation inhibition Grant 10,916,434 - Wang , et al. February 9, 2	2021-02-09
In-situ chamber clean end point detection systems and methods using computer vision systems Grant 10,895,539 - Sawlani , et al. January 19, 2	2021-01-19
Systems And Methods For Homogenous Intermixing Of Precursors In Alloy Atomic Layer Deposition App 20200407842 - FISHER; Ilanit ; et al.	2020-12-31
Self-limiting Growth App 20200402846 - Collins; Joshua ; et al.	2020-12-24
Low Resistivity Films Containing Molybdenum App 20200365456 - Thombare; Shruti Vivek ; et al.	2020-11-19
Low resistivity films containing molybdenum Grant 10,777,453 - Thombare , et al. Sept	2020-09-15
Atomic Layer Etch Of Tungsten For Enhanced Tungsten Deposition Fill App 20200286743 - Lai; Chiukin Steven ; et al.	2020-09-10
Depositing ruthenium layers in interconnect metallization Grant 10,731,250 - Kim , et al.	2020-08-04
Fill Process Optimization Using Feature Scale Modeling App 20200242209 - Bowes; Michael ; et al.	2020-07-30
Defect Classification And Source Analysis For Semiconductor Equipment App 20200226742 - Sawlani; Kapil ; et al.	2020-07-16
Metal Fill Process For Three-dimensional Vertical Nand Wordline App 20200211853 - Schloss; Lawrence ; et al.	2020-07-02
Feature Fill With Nucleation Inhibition App 20200185273 - Chandrashekar; Anand ; et al.	2020-06-11
Feature Fill With Multi-stage Nucleation Inhibition App 20200185225 - Wang; Deqi ; et al.	2020-06-11
Method For Preventing Line Bending During Metal Fill Process App 20200144066 - Jandl; Adam ; et al.	2020-05-07
Low Resistivity Films Containing Molybdenum App 20200075403 - Thombare; Shruti Vivek ; et al.	2020-03-05
Feature fill with multi-stage nucleation inhibition Grant 10,580,654 - Wang , et al.	2020-03-03
Feature fill with nucleation inhibition Grant 10,580,695 - Chandrashekar , et al.	2020-03-03
Method for preventing line bending during metal fill process Grant 10,573,522 - Jandl , et al. Feb	2020-02-25
Forming low resistivity fluorine free tungsten film without nucleation Grant 10,546,751 - Bamnolker , et al. Ja	2020-01-28
Tungsten for wordline applications Grant 10,529,722 - Danek , et al. J	2020-01-07
Low resistivity films containing molybdenum Grant 10,510,590 - Thombare , et al. Dec	2019-12-17
Tungsten Feature Fill With Nucleation Inhibition App 20190326168 - Yang; Tsung-Han ; et al.	2019-10-24
Manganese barrier and adhesion layers for cobalt Grant 10,438,847 - Lai , et al. O	2019-10-08
Tungsten Feature Fill With Nucleation Inhibition App 20190206731 - Chandrashekar; Anand ; et al.	2019-07-04
In-situ Chamber Clean End Point Detection Systems And Methods Using Computer Vision Systems App 20190120775 - Sawlani; Kapil ; et al.	2019-04-25
Tungsten feature fill with nucleation inhibition Grant 10,256,142 - Chandrashekar , et al.	2019-04-09
Feature Fill With Multi-stage Nucleation Inhibition App 20190080914 - Wang; Deqi ; et al.	2019-03-14
Tungsten Feature Fill App 20190019725 - Chandrashekar; Anand ; et al.	2019-01-17
Feature fill with multi-stage nucleation inhibition Grant 10,170,320 - Wang , et al. J	2019-01-01
Depositing Ruthenium Layers In Interconnect Metallization App 20180347041 - Kim; Do Young ; et al.	2018-12-06
Integrated direct dielectric and metal deposition Grant 10,128,116 - Lee , et al. November 13, 2	2018-11-13
Tungsten feature fill Grant 10,103,058 - Chandrashekar , et al. October 16, 2	2018-10-16
Low Resistivity Films Containing Molybdenum App 20180294187 - Thombare; Shruti Vivek ; et al.	2018-10-11
Vapor delivery method and apparatus for solid and liquid precursors Grant 10,087,523 - Collins , et al. October 2, 2	2018-10-02
Feature Fill With Nucleation Inhibition App 20180277431 - Chandrashekar; Anand ; et al.	2018-09-27
Forming Low Resistivity Fluorine Free Tungsten Film Without Nucleation App 20180240675 - Bamnolker; Hanna ; et al.	2018-08-23
Atomic Layer Etch Of Tungsten For Enhanced Tungsten Deposition Fill App 20180240682 - Lai; Chiukin Steven ; et al.	2018-08-23
Tungsten For Wordline Applications App 20180219014 - Danek; Michal ; et al.	2018-08-02
Feature fill with nucleation inhibition Grant 9,997,405 - Chandrashekar , et al. June 12, 2	2018-06-12
Method of forming low resistivity fluorine free tungsten film without nucleation Grant 9,978,605 - Bamnolker , et al. May 22, 2	2018-05-22
Atomic layer etching of tungsten for enhanced tungsten deposition fill Grant 9,972,504 - Lai , et al. May 15, 2	2018-05-15
Tungsten for wordline applications Grant 9,953,984 - Danek , et al. April 24, 2	2018-04-24
Integrated Direct Dielectric And Metal Deposition App 20180108529 - Lee; William T. ; et al.	2018-04-19
Method For Preventing Line Bending During Metal Fill Process App 20180053660 - Jandl; Adam ; et al.	2018-02-22
Tungsten Feature Fill With Nucleation Inhibition App 20170365513 - Yang; Tsung-Han ; et al.	2017-12-21
Vapor Delivery Method And Apparatus For Solid And Liquid Precursors App 20170335450 - Collins; Joshua ; et al.	2017-11-23
Manganese Barrier And Adhesion Layers For Cobalt App 20170330797 - Lai; Chiukin Steven ; et al.	2017-11-16
Tungsten Feature Fill App 20170278749 - Chandrashekar; Anand ; et al.	2017-09-28
Method for void-free cobalt gap fill Grant 9,748,137 - Lai , et al. August 29, 2	2017-08-29
Low temperature tungsten film deposition for small critical dimension contacts and interconnects Grant 9,673,146 - Chen , et al. June 6, 2	2017-06-06
Tungsten feature fill Grant 9,653,353 - Chandrashekar , et al. May 16, 2	2017-05-16
Method Of Forming Low Resistivity Fluorine Free Tungsten Film Without Nucleation App 20170117155 - Bamnolker; Hanna ; et al.	2017-04-27
Deposition of low fluorine tungsten by sequential CVD process Grant 9,613,818 - Ba , et al. April 4, 2	2017-04-04
Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor Grant 9,595,470 - Bamnolker , et al. March 14, 2	2017-03-14
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill App 20170040214 - Lai; Chiukin Steven ; et al.	2017-02-09
Deposition Of Low Fluorine Tungsten By Sequential Cvd Process App 20160351401 - Ba; Xiaolan ; et al.	2016-12-01
Method of depositing a diffusion barrier for copper interconnect applications Grant 9,508,593 - Rozbicki , et al. November 29, 2	2016-11-29
Feature Fill With Multi-stage Nucleation Inhibition App 20160343612 - Wang; Deqi ; et al.	2016-11-24
Deposition of conformal films by atomic layer deposition and atomic layer etch Grant 9,502,238 - Danek , et al. November 22, 2	2016-11-22
Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor Grant 9,478,438 - Thombare , et al. October 25, 2	2016-10-25
Method to tune TiO.sub.x stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiO.sub.x/Ti based MIS contact scheme for CMOS Grant 9,478,411 - Thombare , et al. October 25, 2	2016-10-25
Deposition Of Conformal Films By Atomic Layer Deposition And Atomic Layer Etch App 20160293398 - Danek; Michal ; et al.	2016-10-06
Tungsten For Wordline Applications App 20160233220 - Danek; Michal ; et al.	2016-08-11
Tungsten Feature Fill App 20160190008 - Chandrashekar; Anand ; et al.	2016-06-30
Methods and apparatuses for atomic layer cleaning of contacts and vias Grant 9,362,163 - Danek , et al. June 7, 2	2016-06-07
Conformal film deposition for gapfill Grant 9,355,886 - Swaminathan , et al. May 31, 2	2016-05-31
Method for void-free cobalt gap fill Grant 9,349,637 - Na , et al. May 24, 2	2016-05-24
Low Tempature Tungsten Film Deposition For Small Critical Dimension Contacts And Interconnects App 20160118345 - Chen; Feng ; et al.	2016-04-28
Feature Fill With Nucleation Inhibition App 20160093528 - Chandrashekar; Anand ; et al.	2016-03-31
Tungsten Feature Fill With Nucleation Inhibition App 20160071764 - Chandrashekar; Anand ; et al.	2016-03-10
Method To Tune Tiox Stoichiometry Using Atomic Layer Deposited Ti Film To Minimize Contact Resistance For Tiox/ti Based Mis Contact Scheme For Cmos App 20160056037 - Thombare; Shruti Vivek ; et al.	2016-02-25
Method For Void-free Cobalt Gap Fill App 20160056074 - Na; Jeong-Seok ; et al.	2016-02-25
Method And Apparatus To Deposit Pure Titanium Thin Film At Low Temperature Using Titanium Tetraiodide Precursor App 20160056053 - Thombare; Shruti Vivek ; et al.	2016-02-25
Method For Void-free Cobalt Gap Fill App 20160056077 - Lai; Chiukin Steven ; et al.	2016-02-25
CVD flowable gap fill Grant 9,257,302 - Wang , et al. February 9, 2	2016-02-09
Tungsten feature fill Grant 9,240,347 - Chandrashekar , et al. January 19, 2	2016-01-19
Low tempature tungsten film deposition for small critical dimension contacts and interconnects Grant 9,236,297 - Chen , et al. January 12, 2	2016-01-12
Methods Of Filling High Aspect Ratio Features With Fluorine Free Tungsten App 20150348840 - Bamnolker; Hanna ; et al.	2015-12-03
Methods Of Preparing Tungsten And Tungsten Nitride Thin Films Using Tungsten Chloride Precursor App 20150325475 - Bamnolker; Hanna ; et al.	2015-11-12
Tungsten deposition process using germanium-containing reducing agent Grant 9,159,571 - Humayun , et al. October 13, 2	2015-10-13
Method of depositing a diffusion barrier for copper interconnect applications Grant 9,099,535 - Rozbicki , et al. August 4, 2	2015-08-04
Depositing tungsten into high aspect ratio features Grant 9,034,768 - Chandrashekar , et al. May 19, 2	2015-05-19
Methods of improving tungsten contact resistance in small critical dimension features Grant 8,975,184 - Chen , et al. March 10, 2	2015-03-10
Tungsten Feature Fill App 20150056803 - Chandrashekar; Anand ; et al.	2015-02-26
Methods And Apparatuses For Atomic Layer Cleaning Of Contacts And Vias App 20150037972 - Danek; Michal ; et al.	2015-02-05
Systems and methods for controlling etch selectivity of various materials Grant 8,883,637 - Jeng , et al. November 11, 2	2014-11-11
Depositing tungsten into high aspect ratio features Grant 8,835,317 - Chandrashekar , et al. September 16, 2	2014-09-16
Systems and methods for selective tungsten deposition in vias Grant 8,778,797 - Gao , et al. July 15, 2	2014-07-15
Methods For Depositing Ultra Thin Low Resistivity Tungsten Film For Small Critical Dimension Contacts And Interconnects App 20140162451 - Chen; Feng ; et al.	2014-06-12
Tungsten Nucleation Process To Enable Low Resistivity Tungsten Feature Fill App 20140154883 - Humayun; Raashina ; et al.	2014-06-05
Conformal Film Deposition For Gapfill App 20140134827 - Swaminathan; Shankar ; et al.	2014-05-15
Tungsten barrier and seed for copper filled TSV Grant 8,709,948 - Danek , et al. April 29, 2	2014-04-29
Premetal dielectric integration process Grant 8,685,867 - Danek , et al. April 1, 2	2014-04-01
Method of depositing a diffusion barrier for copper interconnect applications Grant 8,679,972 - Rozbicki , et al. March 25, 2	2014-03-25
Methods Of Improving Tungsten Contact Resistance In Small Critical Dimension Features App 20140030889 - Chen; Feng ; et al.	2014-01-30
Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects Grant 8,623,733 - Chen , et al. January 7, 2	2014-01-07
Subtractive patterning to define circuit components Grant 8,617,982 - Danek , et al. December 31, 2	2013-12-31
Subtractive patterning to define circuit components Grant 08617982 -	2013-12-31
Depositing Tungsten Into High Aspect Ratio Features App 20130330926 - Chandrashekar; Anand ; et al.	2013-12-12
Tungsten Feature Fill App 20130302980 - Chandrashekar; Anand ; et al.	2013-11-14
Tungsten Feature Fill With Nucleation Inhibition App 20130171822 - Chandrashekar; Anand ; et al.	2013-07-04
Depositing tungsten into high aspect ratio features Grant 8,435,894 - Chandrashekar , et al. May 7, 2	2013-05-07
Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics Grant 8,409,987 - Chandrashekar , et al. April 2, 2	2013-04-02
Systems And Methods For Controlling Etch Selectivity Of Various Materials App 20130005140 - Jeng; Esther ; et al.	2013-01-03
Method for improving adhesion of low resistivity tungsten/tungsten nitride layers Grant 8,207,062 - Gao , et al. June 26, 2	2012-06-26
Depositing Tungsten Into High Aspect Ratio Features App 20120115329 - Chandrashekar; Anand ; et al.	2012-05-10
Thinning tungsten layer after through silicon via filling Grant 8,153,520 - Chandrashekar , et al. April 10, 2	2012-04-10
Subtractive Patterning To Define Circuit Components App 20120080793 - Danek; Michal ; et al.	2012-04-05
Systems And Methods For Selective Tungsten Deposition In Vias App 20120077342 - Gao; Juwen ; et al.	2012-03-29
Depositing tungsten into high aspect ratio features Grant 8,124,531 - Chandrashekar , et al. February 28, 2	2012-02-28
Depositing tungsten into high aspect ratio features Grant 8,119,527 - Chadrashekar , et al. February 21, 2	2012-02-21
Depositing Tungsten Into High Aspect Ratio Features App 20120009785 - Chandrashekar; Anand ; et al.	2012-01-12
Tungsten Barrier And Seed For Copper Filled Tsv App 20110221044 - Danek; Michal ; et al.	2011-09-15
Depositing Tungsten Into High Aspect Ratio Features App 20110159690 - Chandrashekar; Anand ; et al.	2011-06-30
Method For Improving Adhesion Of Low Resistivity Tungsten/tungsten Nitride Layers App 20110059608 - Gao; Juwen ; et al.	2011-03-10
Method For Forming Tungsten Contacts And Interconnects With Small Critical Dimensions App 20100267230 - Chandrashekar; Anand ; et al.	2010-10-21
Methods For Depositing Ultra Thin Low Resistivity Tungsten Film For Small Critical Dimension Contacts And Interconnects App 20100267235 - Chen; Feng ; et al.	2010-10-21
Methods For Depositing Tungsten Films Having Low Resistivity For Gapfill Applications App 20100144140 - Chandrashekar; Anand ; et al.	2010-06-10
Method for depositing a diffusion barrier for copper interconnect applications Grant 7,732,314 - Danek , et al. June 8, 2	2010-06-08
Method for preventing metalorganic precursor penetration into porous dielectrics Grant 7,199,048 - Chu , et al. April 3, 2	2007-04-03
Barrier first method for single damascene trench applications Grant 7,186,648 - Rozbicki , et al. March 6, 2	2007-03-06
PVD deposition process for enhanced properties of metal films Grant 7,037,830 - Rumer , et al. May 2, 2	2006-05-02
Method for preventing metalorganic precursor penetration into porous dielectrics App 20050148209 - Chu, Karen ; et al.	2005-07-07
Method to improve barrier layer adhesion Grant 6,797,642 - Chu , et al. September 28, 2	2004-09-28
Method for depositing a diffusion barrier for copper interconnect applications Grant 6,764,940 - Rozbicki , et al. July 20, 2	2004-07-20
Chamber for constructing a film on a semiconductor wafer App 20040099215 - Danek, Michal ; et al.	2004-05-27
Method for constructing a film on a semiconductor wafer Grant 6,699,530 - Danek , et al. March 2, 2	2004-03-02
Control of the deposition temperature to reduce the via and contact resistance of Ti and TiN deposited using ionized PVD techniques Grant 6,673,716 - D'Couto , et al. January 6, 2	2004-01-06
Use of RF biased ESC to influence the film properties of Ti and TiN Grant 6,652,718 - D'Couto , et al. November 25, 2	2003-11-25
Method of depositing copper seed on semiconductor substrates Grant 6,642,146 - Rozbicki , et al. November 4, 2	2003-11-04
Method of depositing a diffusion barrier for copper interconnect applications Grant 6,607,977 - Rozbicki , et al. August 19, 2	2003-08-19
Deposition of conformal copper seed layers by control of barrier layer morphology Grant 6,566,246 - de Felipe , et al. May 20, 2	2003-05-20
Passivation of copper in dual damascene metalization Grant 6,554,914 - Rozbicki , et al. April 29, 2	2003-04-29
Method of depositing a diffusion barrier for copper interconnection applications Grant 6,541,374 - de Felipe , et al. April 1, 2	2003-04-01
Method of depositing diffusion barrier for copper interconnect in integrated circuit Grant 6,534,404 - Danek , et al. March 18, 2	2003-03-18
Construction of a film on a semiconductor wafer Grant 6,500,742 - Chern , et al. December 31, 2	2002-12-31
Construction of a film on a semiconductor wafer Grant 6,444,036 - Chern , et al. September 3, 2	2002-09-03
Chamber For Constructing A Film On A Semiconductor Wafer App 20020001976 - DANEK, MICHAL ; et al.	2002-01-03
Construction of a film on a semiconductor wafer App 20010025205 - Chern, Chyi ; et al.	2001-09-27
Plasma treatment of titanium nitride formed by chemical vapor deposition Grant 6,270,859 - Zhao , et al. August 7, 2	2001-08-07
Plasma Treatment Of Titanium Nitride Formed By Chemical Vapor Deposition App 20010004478 - ZHAO, JUN ; et al.	2001-06-21
Apparatus for substrate processing with improved throughput and yield Grant 6,129,044 - Zhao , et al. October 10, 2	2000-10-10
Removable pumping channel liners within a chemical vapor deposition chamber Grant 5,964,947 - Zhao , et al. October 12, 1	1999-10-12
Multilayer diffusion barriers Grant 5,942,799 - Danek , et al. August 24, 1	1999-08-24
Thermally floating pedestal collar in a chemical vapor deposition chamber Grant 5,846,332 - Zhao , et al. December 8, 1	1998-12-08

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.