Dan; Chung-Che
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dan; Chung-Che.The latest application filed is for "light emitting diode (led) package and method of fabrication".
- Dan; Chung-Che - Hsinchu N/A TW
- Dan; Chung-Che - US
- Dan; Chung-Che - Banciao City TW
| Patent | Date |
|---|---|
| Wafer-type light emitting device having precisely coated wavelength-converting layer Grant 8,648,370 - Liu , et al. February 11, 2 | 2014-02-11 |
| Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof Grant 8,614,453 - Liu , et al. December 24, 2 | 2013-12-24 |
| Light Emitting Diode (LED) Package And Method Of Fabrication App 20120097985 - Liu; Wen-Huang ; et al. | 2012-04-26 |
| Wafer-type Light Emitting Device Having Precisely Coated Wavelength-converting Layer App 20110316017 - Liu; Wen-Huang ; et al. | 2011-12-29 |
| Chip-type Light Emitting Device Having Precisely Coated Wavelength-converting Layer And Packaged Structure Thereof App 20110316027 - Liu; Wen-Huang ; et al. | 2011-12-29 |
| Led With Improved External Light Extraction Efficiency App 20090321758 - LIU; WEN-HUANG ; et al. | 2009-12-31 |
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