DAMMASCH; Matthias

Patent Applications and Registrations

Patent applications and USPTO patent grants for DAMMASCH; Matthias.The latest application filed is for "method for depositing a copper seed layer onto a barrier layer and copper plating bath".

Company Profile

1.3.5

DAMMASCH; Matthias - Berlin DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Depositing A Copper Seed Layer Onto A Barrier Layer And Copper Plating Bath App 20190024239 - DAMMASCH; Matthias ; et al.	2019-01-24
Method for depositing a copper seed layer onto a barrier layer and copper plating bath Grant 10,077,498 - Dammasch , et al. September 18, 2	2018-09-18
Plating bath compositions for electroless plating of metals and metal alloys Grant 9,909,216 - Brunner , et al. March 6, 2	2018-03-06
Plating Bath Compositions For Electroless Plating Of Metals And Metal Alloys App 20170327954 - BRUNNER; Heiko ; et al.	2017-11-16
Method For Depositing A Copper Seed Layer Onto A Barrier Layer And Copper Plating Bath App 20160194760 - DAMMASCH; Matthias ; et al.	2016-07-07
Composition For Forming A Seed Layer App 20150166802 - Dixon; Richard ; et al.	2015-06-18
Method of manufacturing pattern-forming metal structures on a carrier substrate Grant 8,202,567 - Kohnle , et al. June 19, 2	2012-06-19
Method Of Manufacturing Pattern-forming Metal Structures On A Carrier Substrate App 20100136252 - Kohnle; Franz ; et al.	2010-06-03

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