Dambrauskas; Tony

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dambrauskas; Tony.The latest application filed is for "underfill flow management in electronic assemblies".

Company Profile

0.8.13

Dambrauskas; Tony - Chandler AZ
Dambrauskas; Tony - Mesa AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Underfill Flow Management In Electronic Assemblies App 20210343677 - Atadana; Frederick W. ; et al.	2021-11-04
Laser die backside film removal for integrated circuit (IC) packaging Grant 9,859,248 - Faruqui , et al. January 2, 2	2018-01-02
Organic thin film passivation of metal interconnections Grant 9,824,991 - Aleksov , et al. November 21, 2	2017-11-21
Organic Thin Film Passivation Of Metal Interconnections App 20170141061 - ALEKSOV; Aleksandar ; et al.	2017-05-18
Organic thin film passivation of metal interconnections Grant 9,583,390 - Aleksov , et al. February 28, 2	2017-02-28
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20160307869 - Faruqui; Danish ; et al.	2016-10-20
Organic Thin Film Passivation Of Metal Interconnections App 20160155667 - ALEKSOV; Aleksandar ; et al.	2016-06-02
Organic thin film passivation of metal interconnections Grant 9,257,276 - Aleksov , et al. February 9, 2	2016-02-09
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20140264951 - Faruqui; Danish ; et al.	2014-09-18
Organic Thin Film Passivation Of Metal Interconnections App 20140138818 - Aleksov; Alexsandar ; et al.	2014-05-22
Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same App 20080251896 - Dambrauskas; Tony	2008-10-16
Recessed Solder Socket In A Semiconductor Substrate App 20080237881 - DAMBRAUSKAS; Tony ; et al.	2008-10-02
Multi-step etch for metal bump formation Grant 7,427,565 - Dambrauskas , et al. September 23, 2	2008-09-23
Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same Grant 7,402,501 - Dambrauskas July 22, 2	2008-07-22
Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring Grant 7,354,799 - Kinderknecht , et al. April 8, 2	2008-04-08
Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same App 20070257338 - Dambrauskas; Tony	2007-11-08
Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring App 20070105370 - Kinderknecht; Daniel J. ; et al.	2007-05-10
Multi-step etch for metal bump formation App 20070004190 - Dambrauskas; Tony ; et al.	2007-01-04

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