| Patent | Date |
|---|
High density opto-electronic interconnection configuration utilizing passive alignment
Grant 10,725,254 - Shastri , et al. | 2020-07-28 |
High Density Opto-Electronic Interconnection Configuration Utilizing Passive Alignment
App 20190086618 - Shastri; Kalpendu ; et al. | 2019-03-21 |
Direct printed circuit routing to stacked opto-electrical IC packages
Grant 10,209,464 - Pfnuer , et al. Feb | 2019-02-19 |
Reference-less clock and data recovery circuit
Grant 9,793,902 - Lakshmikumar , et al. October 17, 2 | 2017-10-17 |
Reference-less Clock And Data Recovery Circuit
App 20170244416 - LAKSHMIKUMAR; Kadaba ; et al. | 2017-08-24 |
Molded glass lid for wafer level packaging of opto-electronic assemblies
Grant 9,575,266 - Desai , et al. February 21, 2 | 2017-02-21 |
Single mode fiber array connector for opto-electronic transceivers
Grant 9,435,965 - Togami , et al. September 6, 2 | 2016-09-06 |
Wafer scale packaging platform for transceivers
Grant 9,343,450 - Shastri , et al. May 17, 2 | 2016-05-17 |
Direct Printed Circuit Routing To Stacked Opto-electrical Ic Packages
App 20160109668 - PFNUER; Stefan Martin ; et al. | 2016-04-21 |
Self-aligning optical connector assembly
Grant 9,235,019 - Shastri , et al. January 12, 2 | 2016-01-12 |
Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits
Grant 9,209,509 - Shastri , et al. December 8, 2 | 2015-12-08 |
Molded Glass Lid For Wafer Level Packaging Of Opto-electronic Assemblies
App 20150277068 - DESAI; Kishor ; et al. | 2015-10-01 |
Molded glass lid for wafer level packaging of opto-electronic assemblies
Grant 9,052,445 - Desai , et al. June 9, 2 | 2015-06-09 |
Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components
Grant 9,031,107 - Shastri , et al. May 12, 2 | 2015-05-12 |
Interposer Configuration With Thermally Isolated Regions For Temperature-sensitive Opto-electronic Components
App 20150023377 - SHASTRI; Kalpendu ; et al. | 2015-01-22 |
Self-aligning Connectorized Fiber Array Assembly
App 20150016784 - SHASTRI; Kalpendu ; et al. | 2015-01-15 |
Optical modulator utilizing unary encoding and auxiliary modulator section for load balancing
Grant 8,929,689 - Metz , et al. January 6, 2 | 2015-01-06 |
Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components
Grant 8,905,632 - Shastri , et al. December 9, 2 | 2014-12-09 |
Self-aligning connectorized fiber array assembly
Grant 8,876,410 - Shastri , et al. November 4, 2 | 2014-11-04 |
Enhanced Low Inductance Interconnections Between Electronic And Opto-electronic Integrated Circuits
App 20140294334 - SHASTRI; Kalpendu ; et al. | 2014-10-02 |
Wafer Scale Packaging Platform For Transceivers
App 20140248723 - SHASTRI; Kalpendu ; et al. | 2014-09-04 |
Wafer scale packaging platform for transceivers
Grant 8,803,269 - Shastri , et al. August 12, 2 | 2014-08-12 |
Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits
Grant 8,724,939 - Shastri , et al. May 13, 2 | 2014-05-13 |
Interposer Configuration With Thermally Isolated Regions For Temperature-Sensitive Opto-Electronic Components
App 20140003457 - Shastri; Kalpendu ; et al. | 2014-01-02 |
Single Mode Fiber Array Connector For Opto-Electronic Transceivers
App 20130202255 - Togami; Chris Kiyoshi ; et al. | 2013-08-08 |
Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors
App 20130188970 - Shastri; Kalpendu ; et al. | 2013-07-25 |
Self-Aligning Connectorized Fiber Array Assembly
App 20130183008 - Shastri; Kalpendu ; et al. | 2013-07-18 |
Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assemblies
App 20130101250 - Desai; Kishor ; et al. | 2013-04-25 |
Optical interconnection arrangement for high speed, high density communication systems
Grant 8,364,042 - Shastri , et al. January 29, 2 | 2013-01-29 |
HDMI TMDS optical signal transmission using PAM technique
Grant 8,340,529 - Shastri , et al. December 25, 2 | 2012-12-25 |
Wafer Scale Packaging Platform For Transceivers
App 20120280344 - Shastri; Kalpendu ; et al. | 2012-11-08 |
Enhanced Low Inductance Interconnections Between Electronic and Opto-Electronic Integrated Circuits
App 20120237160 - Shastri; Kalpendu ; et al. | 2012-09-20 |
Optical Modulator Utilizing Unary Encoding And Auxiliary Modulator Section For Load Balancing
App 20120230626 - Metz; Peter C. ; et al. | 2012-09-13 |
Optical Interconnection Arrangement For High Speed, High Density Communication Systems
App 20100316391 - Shastri; Kalpendu ; et al. | 2010-12-16 |
HDMI TMDS Optical Signal Transmission Using PAM Technique
App 20100316388 - Shastri; Kalpendu ; et al. | 2010-12-16 |
Common electronic dispersion compensation arrangement for use with multiple optical communication channels
Grant 7,570,889 - Shastri , et al. August 4, 2 | 2009-08-04 |
Optical modulator utilizing multi-level signaling
Grant 7,483,597 - Shastri , et al. January 27, 2 | 2009-01-27 |
Optical modulator utilizing multi-level signaling
App 20080095486 - Shastri; Kalpendu ; et al. | 2008-04-24 |
Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits
Grant 7,269,809 - Shastri , et al. September 11, 2 | 2007-09-11 |
Common electronic dispersion compensation arrangement for use with multiple optical communication channels
App 20060245761 - Shastri; Kalpendu ; et al. | 2006-11-02 |
SOI-based optical interconnect arrangement
App 20060126993 - Piede; David ; et al. | 2006-06-15 |
Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits
App 20050289490 - Shastri, Kalpendu ; et al. | 2005-12-29 |
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