DAIWA FINE CHEMICALS CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for DAIWA FINE CHEMICALS CO., LTD..The latest application filed is for "silver electroplating solution".

Company Profile

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DAIWA FINE CHEMICALS CO., LTD. - Akashi City JP
Daiwa Fine Chemicals Co., Ltd. - Akashi JP
DAIWA FINE CHEMICALS CO., LTD. - Akasi-shi JP
Daiwa Fine Chemicals Co., Ltd. - Hyogo-ken JP
Daiwa Fine Chemicals Co., Ltd. -
Daiwa Fine Chemicals Co., Ltd. - Kobe JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silver Electroplating Solution App 20150184307 - Hosokawa; Yohei ; et al.	2015-07-02
Silver and silver alloy plating bath Grant 7,938,948 - Tsuji , et al. May 10, 2	2011-05-10
Silver and silver alloy plating bath Grant 7,628,903 - Tsuji , et al. December 8, 2	2009-12-08
Method For Silver Plating App 20090159453 - Yoshimoto; Masakazu ; et al.	2009-06-25
Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method Grant 7,166,152 - Okuhama , et al. January 23, 2	2007-01-23
Method for forming circuit pattern Grant 7,056,448 - Okuhama , et al. June 6, 2	2006-06-06
Method for forming circuit pattern App 20050258134 - Okuhama, Yoshiaki ; et al.	2005-11-24
Plating method and plating bath precursor used therefor Grant 6,852,210 - Obata , et al. February 8, 2	2005-02-08
Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method App 20040043153 - Okuhama, Yoshiaki ; et al.	2004-03-04
Plating bath and process for depositing alloy containing tin and copper Grant 6,607,653 - Tsuji , et al. August 19, 2	2003-08-19
Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath App 20030150743 - Obata, Keigo ; et al.	2003-08-14
Plating method and plating bath precursor used therefor App 20020079226 - Obata, Keigo ; et al.	2002-06-27
Redox system electroless plating method Grant 6,338,787 - Obata , et al. January 15, 2	2002-01-15
Aqueous solutions for obtaining metals by reductive deposition Grant 6,183,545 - Okuhama , et al. February 6, 2	2001-02-06
Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface Grant 5,651,873 - Uchiyama , et al. July 29, 1	1997-07-29
Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use Grant 5,618,404 - Okuhama , et al. April 8, 1	1997-04-08

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