loadpatents
Patent applications and USPTO patent grants for Daikoku; Takahiro.The latest application filed is for "carriage apparatus, printing apparatus, and control method thereof".
Patent | Date |
---|---|
Carriage Apparatus, Printing Apparatus, And Control Method Thereof App 20220097427 - Abe; Tomohito ;   et al. | 2022-03-31 |
Heat-resistant imaging camera that moves in a high temperature furnace Grant 11,172,103 - Nakamura , et al. November 9, 2 | 2021-11-09 |
Railway equipment inspecting and measuring apparatus, and railway equipment inspecting and measuring method Grant 11,044,838 - Suzuki , et al. June 22, 2 | 2021-06-22 |
Heat-resistant Imaging Camera That Moves In A High Temperature Furnace App 20210075938 - NAKAMURA; Keigo ;   et al. | 2021-03-11 |
Liquid-cooling cold plate and method for manufacturing same Grant 10,532,401 - Ujiie , et al. Ja | 2020-01-14 |
Railway Equipment Inspecting And Measuring Apparatus, And Railway Equipment Inspecting And Measuring Method App 20190297750 - SUZUKI; Hideyasu ;   et al. | 2019-09-26 |
Sheet supplying apparatus and printing apparatus Grant 10,421,299 - Daikoku , et al. Sept | 2019-09-24 |
Sheet Supplying Apparatus And Printing Apparatus App 20180257407 - Daikoku; Takahiro ;   et al. | 2018-09-13 |
Liquid-cooling Cold Plate And Method For Manufacturing Same App 20180078997 - UJIIE; Satoru ;   et al. | 2018-03-22 |
Sealing structure for multi-chip module Grant 7,518,233 - Takahashi , et al. April 14, 2 | 2009-04-14 |
Device for sealing and cooling multi-chip modules Grant 6,890,799 - Daikoku , et al. May 10, 2 | 2005-05-10 |
Cooling apparatus for electronic unit Grant 6,711,017 - Kurokawa , et al. March 23, 2 | 2004-03-23 |
Highly thermal conductive grease composition and cooling device using the same Grant 6,632,780 - Uematsu , et al. October 14, 2 | 2003-10-14 |
Device for sealing and cooling multi-chip modules App 20030103333 - Daikoku, Takahiro ;   et al. | 2003-06-05 |
Device for sealing and cooling multi-chip modules Grant 6,528,878 - Daikoku , et al. March 4, 2 | 2003-03-04 |
Cooling apparatus for electronic unit App 20030016498 - Kurokawa, Tateki ;   et al. | 2003-01-23 |
Device and method for cooling multi-chip modules Grant 6,351,384 - Daikoku , et al. February 26, 2 | 2002-02-26 |
Air-cooled electronic apparatus with condensation prevention Grant 5,934,368 - Tanaka , et al. August 10, 1 | 1999-08-10 |
Cooling apparatus for electronic devices Grant 5,818,694 - Daikoku , et al. October 6, 1 | 1998-10-06 |
Low thermal resistant, fluid-cooled semiconductor module Grant 5,774,334 - Kawamura , et al. June 30, 1 | 1998-06-30 |
Cooling device of multi-chip module Grant 5,751,062 - Daikoku , et al. May 12, 1 | 1998-05-12 |
Cooling device of semiconductor chips Grant RE35,721 - Daikoku , et al. February 3, 1 | 1998-02-03 |
Semiconductor module Grant 5,705,850 - Ashiwake , et al. January 6, 1 | 1998-01-06 |
Cooling apparatus for electronic device Grant 5,705,854 - Atarashi , et al. January 6, 1 | 1998-01-06 |
Method of actively controlling noise, and apparatus thereof Grant 5,689,572 - Ohki , et al. November 18, 1 | 1997-11-18 |
Cooling apparatus of electronic devices Grant 5,595,240 - Daikoku , et al. January 21, 1 | 1997-01-21 |
Electronic apparatus Grant 5,592,363 - Atarashi , et al. January 7, 1 | 1997-01-07 |
Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower Grant 5,558,493 - Hayashi , et al. September 24, 1 | 1996-09-24 |
Cooling apparatus of electronic devices Grant 5,515,912 - Daikoku , et al. May 14, 1 | 1996-05-14 |
Heat sinks and semiconductor cooling device using the heat sinks Grant 5,365,400 - Ashiwake , et al. November 15, 1 | 1994-11-15 |
Apparatus for cooling heat generating members Grant 5,349,831 - Daikoku , et al. September 27, 1 | 1994-09-27 |
Cooling apparatus for electronic device Grant 5,345,107 - Daikoku , et al. * September 6, 1 | 1994-09-06 |
Liquid impingement cooling module for semiconductor devices Grant 5,270,572 - Nakajima , et al. December 14, 1 | 1993-12-14 |
Cooling arrangement for semiconductor devices and method of making the same Grant 5,133,403 - Yokono , et al. July 28, 1 | 1992-07-28 |
Cooling apparatus for electronic device Grant 5,126,829 - Daikoku , et al. June 30, 1 | 1992-06-30 |
Semiconductor module Grant 5,089,936 - Kojima , et al. February 18, 1 | 1992-02-18 |
Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system Grant 5,077,601 - Hatada , et al. December 31, 1 | 1991-12-31 |
Fluid temperature control system and computer system using same Grant 5,058,389 - Yasuda , et al. October 22, 1 | 1991-10-22 |
Semiconductor device with heat transfer cap Grant 5,047,837 - Kitano , et al. September 10, 1 | 1991-09-10 |
Dry etching apparatus Grant 4,956,043 - Kanetomo , et al. September 11, 1 | 1990-09-11 |
Cooling system and method for electronic circuit devices Grant 4,897,762 - Daikoku , et al. January 30, 1 | 1990-01-30 |
Thermal conduction device Grant 4,823,863 - Nakajima , et al. April 25, 1 | 1989-04-25 |
Cooling device of semiconductor chips Grant 4,770,242 - Daikoku , et al. September 13, 1 | 1988-09-13 |
Evaporating heat transfer wall Grant 4,678,029 - Sasaki , et al. July 7, 1 | 1987-07-07 |
Heat-conducting cooling module Grant 4,649,990 - Kurihara , et al. March 17, 1 | 1987-03-17 |
Heat transfer surface with multiple layers Grant 4,602,681 - Daikoku , et al. July 29, 1 | 1986-07-29 |
Liquid film evaporation type heat exchanger Grant 4,585,055 - Nakayama , et al. April 29, 1 | 1986-04-29 |
Cooling module for integrated circuit chips Grant 4,558,395 - Yamada , et al. December 10, 1 | 1985-12-10 |
Magnetic refrigerator Grant 4,532,770 - Hakuraku , et al. August 6, 1 | 1985-08-06 |
Electrical apparatus winding Grant 4,431,980 - Ikegawa , et al. February 14, 1 | 1984-02-14 |
Winding structure for static electrical induction apparatus Grant 4,363,012 - Daikoku , et al. December 7, 1 | 1982-12-07 |
Winding structure of electric devices Grant 4,207,550 - Daikoku , et al. June 10, 1 | 1980-06-10 |
Heat-transfer wall for condensation and method of manufacturing the same Grant 4,195,688 - Fujie , et al. April 1, 1 | 1980-04-01 |
Vapor-condensing, heat-transfer wall Grant 4,166,498 - Fujie , et al. September 4, 1 | 1979-09-04 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.