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name:-0.008281946182251
name:-0.0049090385437012
name:-0.00061893463134766
Dai; Xiang Patent Filings

Dai; Xiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dai; Xiang.The latest application filed is for "processing method for reducing power consumption and mobile terminal".

Company Profile
0.4.7
  • Dai; Xiang - Chang'an Dongguan CN
  • Dai; Xiang - Jiangsu CN
  • DAI; Xiang - Nantong Jiangsu
  • Dai; Xiang - Roseville CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Processing method for reducing power consumption and mobile terminal
Grant 11,366,510 - Liu , et al. June 21, 2
2022-06-21
Processing Method For Reducing Power Consumption And Mobile Terminal
App 20210011541 - LIU; Xudong ;   et al.
2021-01-14
Repairable electrochemical energy storage device
Grant 10,797,300 - Che , et al. October 6, 2
2020-10-06
Repairable Electrochemical Energy Storage Device
App 20180309114 - CHE; Yong ;   et al.
2018-10-25
Supporting a circuit package including a substrate having a solder column array
Grant 7,372,147 - Dai , et al. May 13, 2
2008-05-13
Method for aligning a component on a printed circuit board
App 20060156540 - Cromwell; Daniel ;   et al.
2006-07-20
Support for an integrated circuit package having a column grid array interconnect
Grant 6,923,658 - Cromwell , et al. August 2, 2
2005-08-02
Support For An Integrated Circuit Package Having A Column Grid Array Interconnect
App 20050124185 - Cromwell, Dan ;   et al.
2005-06-09
Supporting a circuit package including a substrate having a solder column array
App 20050001310 - Dai, Xiang ;   et al.
2005-01-06
Protective coating for attach hardware for circuits
App 20040240188 - Cromwell, Stephen Daniel ;   et al.
2004-12-02
Use of perimeter stops to support solder interconnects between integrated circuit assembly components
App 20040134680 - Dai, Xiang ;   et al.
2004-07-15

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