Dai; Shih-Neng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dai; Shih-Neng.The latest application filed is for "light-mixing multichip package structure".
- Dai; Shih-Neng - Zhongli N/A TW
- Dai; Shih-Neng - Taoyuan County TW
- Dai; Shih-Neng - Zhongli City TW
| Patent | Date |
|---|---|
| Multichip package structure for directly electrically connecting to an AC power source Grant 9,078,312 - Dai , et al. July 7, 2 | 2015-07-07 |
| Light-mixing multichip package structure Grant 8,421,373 - Chung , et al. April 16, 2 | 2013-04-16 |
| Multichip package structure using a constant voltage power supply Grant 8,405,118 - Chung , et al. March 26, 2 | 2013-03-26 |
| Light-mixing Multichip Package Structure App 20120187865 - CHUNG; CHIA-TIN ; et al. | 2012-07-26 |
| Multichip Package Structure Using A Constant Voltage Power Supply App 20120097997 - CHUNG; Chia-Tin ; et al. | 2012-04-26 |
| Multichip Package Structure For Directly Electrically Connecting To An Ac Power Source App 20120098458 - DAI; Shih-Neng ; et al. | 2012-04-26 |
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